Newsroom Enjoy the latest news from EOS/ESD Association, Inc.!
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In-situ ESD Current Sensing in a Pick-and-Place Machine
In the rapidly evolving semiconductor industry, the shift towards Multi-Chip Modules (MCM) and Systems in a Package (SiP) is notable. These advanced assemblies comprise multiple chiplets, sensors, and optoelectronic components,…
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Pragma Design, Inc. offers System-Level Solutions to the suite of EOS/ESD Services and LLC Services
PRESS RELEASE Pragma Design, Inc. offers System-Level Solutions to the suite of EOS/ESD Services and LLC Services August 7, 2025 Contact: Lisa Pimpinella, Sr. Executive Director, EOS/ESD Association, Inc. lpimpinella@esda.org, (315) 339-6937 ROME,…
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How TVS Properties and Printed Circuit Board Design Influence Peak Voltage and Residual Current At An IC For USB-C Superspeed Data Lines
How TVS Properties and Printed Circuit Board Design Influence Peak Voltage and Residual Current At An IC For USB-C Superspeed Data Lines Steffen Holland, Nima Lotfi, Martin Pilaski, Burkhard Laue, Stefan…
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Addressing an Industry Concern: The Demand for a CDM Bare Die Testing Method
Addressing an Industry Concern: The Demand for a CDM Bare Die Testing Method Lena Zeitlhoefler, Theresa Lutz, Friedrich zur Nieden, Kai Esmark, Reinhold Gaertner, Infineon Technologies AG, on behalf of EOS/ESD…
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WHY ESD Electronic Design Automation Checks ARE SO CRITICAL– PART 2
WHY ESD Electronic Design Automation Checks ARE SO CRITICAL– PART 2 Eleonora Gevinti, Michael Khazhinsky, Ali Muhammad, Dolphin Abessolo Bidzo, Nicolas Richaud, Peter Koeppen, Kuo-Hsuan Meng, Vladislav Vashchenko, Andrei Shibkov, and…
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Why ESD Electronic Design Automation Checks are So Critical: Part 1
WHY ESD Electronic Design Automation Checks ARE SO CRITICAL– PART 1 Eleonora Gevinti, Michael Khazhinsky, Ali Muhammad, Dolphin Abessolo Bidzo, Nicolas Richaud, Peter Koeppen, Kuo-Hsuan Meng, Vladislav Vashchenko, Andrei Shibkov, and…
