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Following them properly is for your benefit!This article is a follow-up to “What’s the trouble with AMRs?” In Compliance Magazine, January 2020. The purpose of AMR is to warn “customers” who use the semiconductor...

For 2020, TSMC is targeting to start mass production of its first 5 nm technology. Also, at this node FinFETs are the transistor architecture of choice. In this article, we...

In the past, fiber-optic communication was used primarily for long-distance communication (50 km and beyond). Only a limited number of these high-end interface products were required worldwide. More recently, companies...

What’s New in Standards?In the past six months, EOS/ESD Association, Inc., the only organization accredited by ANSI to write and produce standards on electrostatics, released eight new or revised documents...

On June 4, 2015 the Department of Defense (DoD) adopted S20.20 for use as an alternative to MIL‑STD‑1686 but both standards still exist. EOS/ESD Association, Inc. has worked with a liaison...

A Comprehensive Approach Can Reduce EOS-Related FailuresIt is commonly understood that on-chip ESD protection is essential to meet the human body model (HBM) and charged device model (CDM) ESD stress...