WG 23.0 – Electrical Overstress (EOS) Best Practices

Status:
Active
Working Group Chair:
Terry Welsher, Dangelmayer Associates

Related Documents

  • Summary of meeting activities:

    The working group began discussion on a new document aimed at controlling electrical stresses in manufacturing in the same way ANSI/ESD S20.20 does for ESD. There was also discussion on a new document on replication stressing techniques that would aid in root cause analysis of potential EOS failures

  • Summary of meeting activities:

    The working group completed adjudication of all TAS comments on ESD TR23.0-01. A presentation was given on the SEMI 176. The group also discussed the next steps for a new document - EOS Control Program and EOS Replication Testing.

     

  • Summary of meeting activities:

    The group continued adjudicating technical advisory and support committee comments on a new technical report for the best practice for mitigation of EOS in manufacturing and test.

  • Summary of meeting activities:

    The working group started adjudicating comments from the Technical and Administrative Support committee on ESD TR23.0-01-1x – electrical overstress in manufacturing and test.

  • Summary of meeting activities:

    The working group continued working on a technical report for best practices of EOS mitigation in manufacturing and test including agreement on a new section explaining new definitions of EOS and related terms.

     

  • Summary of meeting activities:

    A presentation was given on how EMI becomes EOS. The working group continued working on a technical report for best practices of EOS mitigation in manufacturing and test.

     

  • Summary of meeting activities:

    The working group continued working on a technical report for best practices for EOS mitigation in manufacturing and test.

     

  • Summary of meeting activities:

    The working group reviewed the updated scope, purpose, and two major technical sections of a new technical report. Volunteers were identified to write the remaining sections (definitions, references, etc). Topics for the next version of the technical report were also identified (board-level test and auditing).

     

  • Summary of meeting activities:

    An introduction to the past work / work in progress of WG 23 was presented. Then the committee reviewed the major sections of a document currently being developed for assembly and test. More sections were identified and assigned to writers; the committee will continue reviewing at the September meeting.

     

  • Summary of meeting activities:

    The committee discussed current progress on the individual sections of the EOS best practice technical report including sources of EOS in circuit assembly and test. The WG will continue to work on the technical report before and during the July virtual meeting. A presentation was give on measurements when high frequency disturbances; a section will be added to the technical report based on the information presented.

     

  • Summary of meeting activities:

    The committee discussed current progress on the individual sections of the EOS best practice technical report.