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advancing the theory and practice of electrostatic discharge (ESD) avoidance.
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EventsAnnual EOS/ESD Symposium, Manufacturing Symposium, Volunteer Events, and more!
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CertificationProgram Manager, Facility Certification, Device Stress Testing, Device Design, TR53 Technician, ESD Program Associate, ESD Design Engineer, ESD Control Program Auditor, ESDA Certified Professional Instructor
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Training & EducationTutorials, Seminars, Online Training, Videos, EOS/ESD On-Campus Events
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StandardsFactory & Device Design
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Our Channel Partners
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CanmaxChina -
EstatecMexico
Recent News
Updated Trends in Charge Device Model (CDM)
Charged device events are by far the leading cause of electrostatic discharge (ESD) damage in modern electronics manufacturing facilities. If an integrated circuit contacts a conducting surface at a different...
Challenges of Designing System-level ESD Protection at the IC Level, Part 2
Conducting System-level ESD CurrentA previous article (Challenges of Designing System-Level ESD Protection at the IC Level: Misconceptions Regarding Current Flow to the IC [1]) highlighted the challenges an IC designer...
ESD Challenges in 2.5D/3D Integration
Introduction2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package. Back in the 1990s...
Our Relationships
EOS/ESD Association, Inc. is the only organization accredited by ANSI to write and produce standards on electrostatics. We have established informal and formal relationships with similar organizations outside of the United States, and are active with standards activities in various countries.
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Reliability CenterJapan (RCJ) -
Productivity Standards Board (PSB)Singapore -
Electronics Industry AssociationJapan (EIAJ) -
ESD ForumGermany -
China National Institute of StandardizationChina (CNIS) -
International Electrotechnical Commission (IEC)Switzerland