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Recent News

May 1, 2023

Updated Trends in Charge Device Model (CDM)

Charged device events are by far the leading cause of electrostatic discharge (ESD) damage in modern electronics manufacturing facilities. If an integrated circuit contacts a conducting surface at a different...

April 1, 2023

Challenges of Designing System-level ESD Protection at the IC Level, Part 2

Conducting System-level ESD CurrentA previous article (Challenges of Designing System-Level ESD Protection at the IC Level: Misconceptions Regarding Current Flow to the IC [1]) highlighted the challenges an IC designer...

March 1, 2023

ESD Challenges in 2.5D/3D Integration

Introduction2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package. Back in the 1990s...

Our Relationships

EOS/ESD Association, Inc. is the only organization accredited by ANSI to write and produce standards on electrostatics. We have established informal and formal relationships with similar organizations outside of the United States, and are active with standards activities in various countries.

  • r rcj
    Reliability Center
    Japan (RCJ)
  • r psb
    Productivity Standards Board (PSB)
  • r eiaj
    Electronics Industry Association
    Japan (EIAJ)
  • r esd
    ESD Forum
  • r cnis
    China National Institute of Standardization
    China (CNIS)
  • r iec
    International Electrotechnical Commission (IEC)