WG 5.0 – Device Testing

Status:
Inactive
Working Group Chair:
Terry Welsher, Dangelmayer Associates

Related Documents

  • Summary of meeting activities:

    The committee discussed the publication of ANSI/ESD SP5.0-2018. There are no updates currently needed. The group then briefly discussed work to advance inclusion of ESD in data sheets and inclusion of a requirement in ANSI/ESD S20.20. A decision was made for the group to go dormant as there are no current projects.

  • Summary of meeting activities:

    The working group discussed ways to consider sharing information on CDM between the supplier and manufacturer. The group also explored possible new activities for the WG including a guide to help understand all the various device specifications. Will be discussed further at the September face-to-face meeting.

  • Summary of meeting activities:

    The WG reviewed the status of ANSI/ESD SP5.0 and discussed the connection to other documents as well as actual data sheets.

  • Summary of meeting activities:

    The working group adjudicated STDCOM vote comments on ESD WIP5.0-2018. The document will be submitted for industry review before the winter virtual meeting series.

  • Summary of meeting activities:

    The working group completed follow-up adjudication of TAS comments on ESD WIP5.0-2018. The document will be submitted for STDCOM VBM before the September meeting series. There was a discussion on ways to promote inclusion of ESD data on manufacturers’ data sheets.

  • Summary of meeting activities:

    The working group completed adjudication of TAS comments on ESD WIP5.0-2018. There was a discussion on ESD data terminology concerns and a need for some new test procedure options for consideration by the HBM and CDM joint working groups.

  • Summary of meeting activities:

    The group adjudicated technical and advisory support committee comments on ESD WIP5.0; a new standard practice for standardizing the format for ESD information on device data sheets.

  • Summary of meeting activities:

    The committee continued reviewing the current work in progress document on device ESD data sheet standard format. The document is expected to be submitted to the Technical and Administrative Support committee before the end of the year.

  • Summary of meeting activities:

    The committee reviewed and made suggested changes to the current work in progress document on device ESD data sheet standard format. A decision was made to submit the document as a standard practice instead of a technical report.

  • Summary of meeting activities:

    The committee held technical discussions on a new technical report related to reporting HBM and CDM results on a data sheet.  A number of significant changes were proposed and agreed to by the working group. The committee also discussed a future technical report related to datasheet guidance as well as the inclusion of system level ESD, HMM, and latch-up.

     

     

  • Summary of meeting activities:

    The committee reviewed a draft of the new technical report for an ESD data sheet template. A suggestion was made to include static latch-up information; discussion was held and a decision was made that static latch-up is outside the scope of the committee and the suggestion would be referred to the JEDEC 78 committee.

  • Summary of meeting activities:

    The working group reviewed the first draft of the “complete” Data Sheet on Handling (HBM/CDM) section in the new technical report. There was good discussion on different viewpoints of how data sheets are used. A discussion on possible “system-relevant” component information was transferred to WG 5.6 - HMM for further exploration.

  • Summary of meeting activities:

    An introduction to WG5.0 along with a review of past work / work in progress was presented for those new to the WG and guests. The committee then discussed sections of a document for a data sheet on handling (HBM/CDM); the document is ready for the writing team to begin. JEDEC has expressed interest in this being a joint document. The working group discussed a section on “system-level” information; however, more discussion is still needed. The possibility of a test method for surge protection devices was also discussed.

     

  • Summary of meeting activities:

    The committee continued working on a technical report for standardizing ESD information for component data sheets with a focus on handling (HBM and CDM) and systems (IEC, etc.). A discussion was held regarding other organizations where the data sheet template and technical report (TR) could be promoted and socialized once it is published.