Volunteer List

EOS/ESD Association, Inc. is served by many volunteers who offer their expertise and dedication.

Here is a list of current volunteers and the committees/groups on which they serve.

A

  • Aihua Dong, HiSilicon

    IEDS

  • Akhil Gore, Synopsys

    WG 18

  • Akhilesh Kumar, Ansys

    WG 18

  • Alain Loiseau, GLOBALFOUNDRIES

    US Symposium

  • Alan Righter, Analog Devices, Wilmington, MA

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 17, Working Group Chairs, ESDA Board of Directors, Standards Committee, Advanced Topics, Publications

  • Andrea Boroni, STMicroelectronics, Agrate Brianza, Italy

    JWG (HBM), JWG (CDM), WG 5.5, WG 27, WG Chairs

  • Andrew Kopanski, MIT Lincoln Laboratory

    Education

  • Andrew Spray, Synaptics Incorporated

    WG 25, US Symposium

  • Andy Nold, Teradyne, Inc.

    WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 20, WG53, WG 97, Certification

  • Anindya Nath, Globalfoundries

    US Symposium

  • Anish Kumar, Intel

    WG 18

  • Ann Concannon, Texas Instruments, Santa Clara, CA

    WG 22, ESDA Board of Directors, Volunteer Development & Initiatives, Publications, US Symposium, Academia, Advanced Topics

  • Arman Vassighi, Intel Corporation

    WG 17, WG 53

     

  • Arnie Steinman, Electronics Workshop, Berkeley, CA

    WG 3, STDCOM

B

  • Barry Fernelius, Eurofins EAG

    JWG (CDM)

  • Bart Keppens, SOFICS, Gistel, Belgium

    WG 22

  • Bas Grootemaat, Kingsize Consultancy

    WG 53

  • Benjamin Orr, Intel

    US Symposium, Advanced Topics

  • Bernard Chin, Qorvo

    WG 17, WG 19, WG29, WG 53

  • Bob Vermillion, RMV Technology Group LLC, Moffett Field, CA

    WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 19, WG 29, WG 97, Standards Committee, Working Group Chairs

  • Brett Carn, Intel, Hillsboro, OR

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.6, WG 14, WG 15, WG 25, WG 27, WG 29, Standards Committee, Technical and Advisory Support Committee, Board of Directors, Standards Business Unit Manager, Education, Advanced Topics

  • Bright Ho

    IEDS

C

  • Carl Newberg, Simco-Ion

    WG 3, WG 20, WG28, WG 29, Working Group Chairs, Certification

  • Carol Rouying Zhan, ON Semiconductor

    US Symposium

  • Chanhee Jeon, Samsung, Gyeonggi-Do, South Korea

    WG 22

  • Charvaka Duvvury, ESD Consulting, LLC, Plano, TX

    Publications, IEDS, Awards, Academia, Advanced Topics, India ESD Forum

  • Chau-Neng (Michael) Wu, TSMC, San Jose, CA

    WG 22

  • Cheryl Checketts, Estatec

    WG 1, WG 53, Standards Committee

  • Chin Siang (CS) Tay, Suzhou TA & A Ultra Clean Technology

    WG 2, WG 17, WG 53, WG 97, ESDA Board of Directors

  • Chris Jones, Semtech Corporation, Camarillo, CA

    JWG (HBM)

  • Christopher Almeras, Raytheon, McKinney, TX

    WG 7, WG 11, WG 17, WG 19, WG 20, WG 28, WG 53, ESDA Board of Directors, Volunteer Development and Initiatives, US Symposium

  • Chuck Dunn, NRD LLC

    WG 3

  • Chuck McClain, Micron Technology, Inc., Boise ID

    WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 17, WG 19, WG 20, WG 28, WG 29, WG 53, WG 97, Standards Committee, Technical Advisory and Support Committee, Working Group Chairs, ESDA Board of Directors, Education

  • Chun-Yu Lin, National Taiwan Normal University

    IEDS, IEW Committee

  • Colleen Doll, Google

    Education, Volunteer Development & Initiatives, Certification

  • Craig Zander, Transforming Technologies, Edina, MN

    WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 20, WG 53, WG 97, Standards Committee, Working Group Chairs

D

  • Dale Fuller, Seagate Technology, Longmont, CO

    Education

  • Dale Parkin, Seagate Technology, Shakopee, MN

    WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 17, WG 19, WG 20, WG 53, WG 97, Standards Committee, Working Group Chairs, Nominations, US Symposium, Awards

  • Dan O’Brien, University of Dayton Research Institute, Wright-Patterson AFB, OH

    WG 1, WG 2, WG 4, WG 9, WG 11, WG 19, WG 20, WG 53, WG 97

  • David Chandler, Forbo Flooring Systems

    WG 7, WG 29

  • David Eppes, Advanced Micro Devices, Austin, TX

    JWG (HBM), JWG (CDM), WG 25, US Symposium

  • David Girard, Honeywell, Clearwater FL

    WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 13, WG 15, WG 17, WG 19, WG 20, WG 53, WG 97, Standards Committee

  • David Johnsson, High Power Pulse Instruments GmbH, Haar, Germany

    US Symposium

  • David Kirk, Hologic, Newark, DE

    Education

  • David Klein, pSemi, Inc.,Austin TX

    JWG HBM, JWG CDM, WG 5.5, WG 18, US Symposium

  • David Pommerenke, Graz University of Technology

    WG 26, IEDS

  • David Swenson, Affinity Static Control Consulting, LLC, Round Rock, TX

    WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 17, WG 20, WG 28, WG 29, WG 53, WG 97, Standards Committee, Working Group Chairs, ESDA Board of Directors, Nominations, Education, Volunteer Development and Initiatives, Awards

  • Dina Medhat, Mentor Graphics Egypt

    Volunteer Development & Initiatives, US Symposium

  • Divya Acharya, Qorvo

    Volunteer Development & Initiatives

  • Dolphin Abessolo-Bidzo, NXP Semiconductors, Nijmegen, Netherlands

    WG 18, US Symposium

  • Doug Holtz, CCI, New Hope, MN

    WG 11

E

  • Edward Rankin, Sandia National Laboratories

    WG 28

  • Efraim Aharoni, Tower Semiconductor, Ltd., Migdal Haemek,Israel

    WG 22

  • Eleonora Gevinti, STMicroelectronics, Agrate Brianza, Italy

    WG 18, US Symposium

  • Eric Borrero, NASA

    WG 7

  • Evan Grund, Grund Technical Solutions, Inc., San Jose, CA

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 25, Standards Committee

  • Evan Tsai, Dou Yee Enterprises

    IEW Committee

F

  • Fabrice Blanc, ARM, Grenoble, France

    WG 22

  • Fabrice Caignet, LAAS/CNRS, Toulouse, France

    WG 26, US Symposium

  • Filippo Magrini, Infineon Technologies AG, Neubiberg, Germany

    WG 22

  • Frank Zou Feng, Synopsys

    WG 18

  • Friedrich zur Nieden, Infineon Technologies AG

    US Symposium

G

  • Gary Latta, SAIC

    WG 20, WG53

  • Gene Monroe, NASA-LARC, Hampton, VA

    WG 2, WG 7, WG 17, WG 28

  • Geng Yang, UNISOC

    IEDS

  • Gianluca Boselli, Texas Instruments, Inc., Dallas, TX

    Board of Directors, Executive Committee, Nominations, Advisory Committee on Global Growth, Awards, Advanced Topics

  • Gijs De Raad, NXP Semiconductors

    US Symposium

  • Ginger Hansel, Dangelmayer Associates LLC, Austin, TX

    WG 1, WG 4, WG 7, WG 17, WG 20, WG 53, Standards Committee, Nominations, Education, Volunteer Development and Initiatives

  • Girish AS, AMD

    India ESD Forum

  • Greg O'Sullivan, Micron Technology Inc.

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6

  • Guanghui Liu, Vivo

    IEDS

  • Guangxiang Lu, Continental Corporation

    Advanced Topics

  • Guangyi Lu, HiSilicon Technologies Co., Limited

    IEDS

  • Guido Quax, NXP Semiconductors

    WG 18

  • Guoyan Zhang, Silergy Corp

    IEDS

H

  • Hailian Liang, Jiang Nan University

    IEDS

  • Hank Mead, BAE Systems Inc.

    WG 7, WG 11, WG 20, WG 28, WG 53, Certification

  • Harald Gossner, Infineon Technologies, Neubiberg, Germany

    WG 14, WG 22, WG 26, Working Group Chairs, ESDA Board of Directors, Executive Committee, Publications, Awards, Academia, Advanced Topics

  • Hari Shanker Gupta, SAC, ISRO

    India EDS Forum

  • Harry Brownett, Brownett Consulting, LLC

    WG 29

  • Harshit Dhakad, Intel

    India ESD Forum

  • Heinrich Wolf, Fraunhofer EMFT, Munich, Germany

    JWG HBM, JWG CDM, WG 5.5, WG 14, Working Group Chairs, US symposium

  • Henning Lohmeyer, Robert Bosch GmbH

    WG 5.5, WG 26

  • Hiroyasu Ishizuka, Maxwell Japan Co., Ltd

    WG 25

  • Horst Gieser, Fraunhofer EMFT, Munich, Germany

    WG 5.4

  • Howard Tang, UMC, Hsinchu, Taiwan

    IEW Committee

J

  • Jae Park, Texas Instruments

    WG 14

  • Jam-Wem Lee, TSMC, Hsinchu, Taiwan

    US Symposium

  • James Di Sarro, Texas Instuments

    Education

  • Jasmine Shen, ESDEMC

    WG 14

  • Jay Skolnik, Skolnik Technical Training, Albuquerque, NM

    Education

  • Jeff Dunnihoo, Pragma Design, Bertram, TX

    WG 14, WG 22, WG 26

  • Jeff Salisbury, Coherent Corp. Allen, TX

    WG 1, WG 5.6, WG 11, WG 17, WG 53, STDCOM

  • Jeremy Smallwood, Electrostatic Solutions, Hampshire, United Kingdom

    Education

  • Jian Liu, Qorvo, Inc.

    Publications

  • Jie Zeng

    IEDS

  • Jim Roberts, ZF Friedrichshafen AG

    WG 27

  • Jim Vinson, Renesas Electronics America

    WG 22

  • Johannes Weber, Fraunhofer EMFT ATIS

    US Symposium

  • John Anderson, NASA – AFRC

    WG 7, WG 19

  • John Kinnear, IBM, Poughkeepsie, NY

    WG 1, WG 2, WG 3, WG 9, WG 11, WG 17, WG 19, WG 20, WG 29, WG 53, WG 97, STDCOM, Technical Advisory and Support Committee, Working Group Chairs, ESDA Board of Directors, EXCOM, Nominations, Education, Publications, US Symposium, Certification, Awards, 


  • Josh Morris, Intel, Beaverton, OR

    JWG HBM

  • Joshua Yoo, Core Insight, Inc. Gyeonggi-do, South Korea

    WG 3, WG 17, WG 19, Standards Committee, US Symposium

  • Julius Turangan, Dou Yee Enterprises

    WG 2, WG 3, WG 11, STDCOM

  • Jun Wang, SMIC

    IEDS

  • Junjun Li, ESDA

    ESDA Board of Directors, Advisory Committee on Global Growth, IEDS, Academia

K

  • Kai Esmark, Infineon

    WG 27

  • Karthik Srinivasan, Ansys

    WG 18

  • Kathy Muhonen, Qorvo

    JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14, WG 26, Education, US Symposium

  • Kay Adams, Tech Wear, Inc

    WG 2

  • Keiichi Hasegawa, Hanwa Electronic Ind. Co., Ltd., Wakayama City, Japan

    WG 5.6

  • Keith Peterson, Missile Defense Agency, Fort Belvoir, VA

    WG 1, WG 4, WG 9, WG 11, WG 15, WG 17, WG 19, WG 20, WG 28, WG 53, WG 97, Standards Committee

  • Kelly Robinson, Electrostatic Answers

    WG 29

  • Kevin Cleary, SCS

    WG 11

  • Kevin Duncan, Seagate Technology, Bloomington, MN

    WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 20, WG 53, Standards Committee

  • Krzysztof Domanski, Intel Deutschland GmbH

    WG 18

  • Kun-Hsien Lin, Amazing Microelectronic Corp

    IEW Committee

  • Kuo-Hsuan Meng, NXP Semiconductors

    US Symposium

  • Kwanghoi Koo, Lab126 - Amazon Company

    WG 5.5, WG 5.6, WG 25, WG 26

L

  • Lena Zeitlhöfler, Infineon

    US Symposium

  • Leonardo Di Biccari, STMicroelectronics, Agrate Brianza, Italy

    JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, US Symposium

  • Lorenzo Cerati, STMicroelectronics, Agrate Brianza, Italy

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 22, WG 25, WG, 26, Technical Advisory and Support Committee, ESDA Board of Directors, Publications, US Symposium

  • Luca Merlo, STMicroelectronics

    JWG HBM, WG 5.5

M

  • Magdalena Hilkersberger, Infineon Technologies

    WG 17, WG 53

  • Marcel Dekker, Eurofins MASER, The Netherlands

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, Technical and Advisory Support Committee, Working Group Chairs

  • Marcos Hernandez, Thermo Fisher Scientific, San Jose, CA

    JWG CDM

  • Marcus Koh, Everfeed Technology Pte., Ltd., Singapore

    Education, IEDS

  • Marko Simicic, imec

    JWG HBM, JWG CDM, WG5.5, WG 5.6, US Symposium

  • Mart Coenen, EMCMCC

    JWG HBM, JWG CDM, WG 5.5, WG, 5.6, WG 14, WG 26, US Symposium

  • Martin Pilaski, Nexperia

    WG 26

  • Marty Johnson, Texas Instruments, Santa Clara, CA

    JWG HBM, JWG CDM

  • Mary Kay Botkins, ACL. Inc.

    WG 4, WG 7, WG 9, WG 29, WG 53, WG 97

  • Maryam Shojaei, IIT, Mumbai

    India ESD Forum

  • Masonori Sawada, Hanwa Electric Ind. Co., Ltd., Wakayama, Japan

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 14, WG 26

  • Matias Aliseda, ESTATEC

    WG 2, WG 11, WG 15, WG 17, WG 28, WG 29

  • Matt Jane, Tesla

    WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 19, WG 20, WG 27, WG 28, WG 29, WG 53, WG 97, Technical Advisory Support Committee, ESDA Board of Directors, US Symposium, Certification

  • Matt Strickland, Boeing

    WG 1, WG 2, WG 3, WG 4, WG 7, WG 11, WG 15, WG 17, WG 19, WG 20, WG 28, WG 53, WG 97, Standards Committee

  • Matthew Hogan, Siemens Digital Industries Software

    WG 18, WG 22, IEW Committee

  • Melissa Feeney-Jolliff, Aerospace Corporation, Hawthorne, CA

    WG 19

  • Meng Miao, Globalfoundries

    IEDS

  • Mengfu Di

    IEDS

  • Michael (Chau-Neng), TSMC

    WG 22

  • Michael Ammer, Infineon Technologies

    WG 14, WG 26, US Symposium

  • Michael Khazhinsky, Silicon Laboratories, Inc., Austin, TX

    WG 18, WG 22, Working Group Chairs, ESDA Board of Directors, Executive Committee, Publications, Advisory Committee on Global Growth, US Symposium, Academia, Advanced Topics

  • Michael Laube

    WG 22

  • Michael Reardon, Silicon Laboratories, Inc.

    JWG CDM

  • Michael Stevens, Freescale Semiconductor, Tempe, AZ

    JWG HBM, WG 27

  • Michael Zwicknagl, BJZ GmbH & Co. KG

    WG 15

  • Michelle Lam, IBM

    ESDA Board of Directors, Volunteer Development and initiatives, Publications

  • Mike Manders, United Stated Air Force AFRL/RXSA

    WG 1, WG 4, WG 7, WG 9, WG 11, WG 19, WG 20, WG 53, WG 97

  • Ming Dou Ker, National Chiao-Tung University, Hsinchu-City, Taiwan

    IEDS, IEW Committee

  • Ming Qiao

    IEDS

  • Mingliang Li

    IEDS

  • Mirko Scholz, Infineon

    WG 5.4, WG 5.5, WG 5.6, ESDA Board of Directors, US Symposium, Academia, Advanced Topics

  • Motosugu Okushima, Renesas Electronics, Kawasaki, Japan

    IEW Committee

  • Muhammad Ali, Intel Corporation

    WG 18

N

  • Nagothu Kranthi

    US Symposium

  • Nanhai Xiao

    IEDS

  • Nate Ashworth, Julie Industries/StaticSmart Flooring, Andover, MA

    WG 4, WG 7, WG 9, WG 29, WG 97

  • Nathaniel Jack, Intel, Hillsboro, OR

    Nominations, Volunteer Development & Initiatives

  • Nathaniel Peachey, Qorvo, Greensboro, NC

    WG 5.6, WG 19, ESDA Board of Directors, Executive Committee, Education, Advisory Committee on Global Growth, US Symposium, IEDS, IEW Committee, Academia, Advanced Topics

  • Nicolas Richaud, Intel

    WG 18

  • Nihar Ranjan Mahapatra, IIT, Gandhinagar

    India ESD Forum

  • Nitesh Trivedi, Intel Technologies

    India ESD Forum

  • Nitin Bansal, Synopsis

    India ESD Forum

  • Nobuyuki Wakai, Toshiba Corporation

    WG 17

  • Norman Chang, ANSYS, San Jose, CA

    WG 22

P

  • Pasi Tamminen, Danfoss

    WG 25, WG 26, WG 29, Working Group Chairs, US Symposium

  • Paul Ngan, NXP Semiconductors

    JWG CDM

  • Paul Phillips, Phasix ESD, Hampshire, United Kingdom

    JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14

  • Paul Zhou, Analog Devices, Inc.

    WG 18, WG 22, US Symposium

  • Pawel Rekas, Kimball Electronics

    WG 1, WG 3, WG 4, JWG HBM, WG 5.5, WG 7, WG 9, WG 11, WG 15, WG 17, WG 19, WG 25, WG 28, WG 53, WG 97

  • Peter De Jong, Synopsys, Oosterbeek, Netherlands

    WG 22, IEW Committee

  • Peter Koeppen, ESD Unlimited LLC

    JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14, WG 18, WG 22, WG 25, WG 26

  • Peter Michelson

    WG 18

  • Peter Turlo, On Semiconductor

    JWG CDM

  • Pohan Chang

    IEW Committee

  • Prantik Mahajan

    US Symposium

Q

  • Qi-an Xu, Macronix Microelectronics (Suzhou) Co., Ltd.

    IEDS

R

  • Rachel Rienstra, Lockheed Martin Space Systems

    WG 7, WG 11, WG 15, WG 19, WG 53

  • Reinhold Gaertner, Infineon Technologies, Neubiberg, Germany

    JWG HBM, JWG CDM, WG 5.4, WG 5.6, WG 11, WG 17, WG 20, WG 27, WG 53, Technical and Advisory Support Committee, Working Group Chairs, Advisory Committee on Global Growth, Awards

  • Rite Fung, Cisco Systems Inc.

    Us Symposium

  • Robert Ashton, ON Semiconductor, Phoenix, AZ

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, Technical Advisory Support Committee, Working Group Chairs

  • Robert Gauthier, Globalfoundries

    ESDA Board of Directors, Executive Committee, Certification, Academia, Advanced Topics

  • Robert Myoung, ANSYS

    WG 22

  • Rodney Doss, Samtec, Inc

    WG 1, WG 3, WG 7, WG 11, WG 17, WG 28

  • Ronnie Millsaps, GLOBALFOUNDRIES Singapore Pte Ltd

    WG 17, WG 20, WG 53

  • Ryan Jiang

    IEW Committee

S

  • Scott Ruth, AMD

    WG 18, WG 22, ESDA Board of Directors, Volunteer Development & Initiatives, Advanced Topics

  • Scott Ward, Texas Instruments, Dallas, TX

    JWG HBM, JWG CDM, WG 5.4, WG 11, WG 14, WG 17, WG 27, Standards Committee, Working Group Chairs

  • Sergej Bub, Nexperia

    WG 26

  • Shane Burns, Electro-Tech Systems

    WG 11

  • Shane Heinle, Digi-Key Corporation

    WG 3, WG 4, WG 7, WG 9, WG 11, WG 20, WG 53, WG 97

  • Shen-Li Chen

    IEDS

  • Shih-Hung Chen, imec

    ESDA Board of Directors, IEW Committee, Academia

  • Shubhankar Marathe, Amazon

    WG 26, US Symposium

  • Shurong Dong, College of Information Science and Electronic Engi of Zhejiang University

    IEDS

  • Slavica Malobabic, Cirrus Logic

    US Symposium

  • Sondes Sahli, Microchip

    WG 22

  • Steffen Holland, Nexperia

    WG 26, Working Group Chairs, US Symposium, IEW Committee

  • Stephen Blackard, Coherent Corp.

    WG 1, WG 2, WG 3, WG 7, WG 9, WG 11, WG 15, WG 17, WG 53, WG 97

  • Stevan Hunter, ASU, BYU-I

    Education

  • Steve Gerken, Consultant

    WG 20

  • Steven Poon, Intel Corporation

    WG 18

  • Subhadeep Ghosh, Texas Instuments

    WG 18

T

  • Taylor Bahr, Orbis Corporation

    WG 11

  • Ted Dangelmayer, Dangelmayer Associates, Annisquam, MA

    Education

  • Terry Welsher, Dangelmayer Associates, Suwanee, GA

    JWG HBM, JWG CDM, WG 5.4, WG 22

  • Teruo Suzuki, Socionext, Inc., Tokyo, Japan

    JWG HBM, JWG CDM, WG 5.5, WG 17, WG 22, US Symposium, IEW Committee

  • Theo Smedes, NXP Semiconductors, Nijmegen, The Netherlands

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 22, WG 25, WG 26, WG 27, Working Group Chairs

  • Tim Jarrett, BSCI

    WG 29, WG 53, Standards Committee

  • Tim Maloney, SBC Global

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, Us Symposium, Awards, Academia, Advanced Topics

  • Tim Maroni, NRD LLC

    WG 3

  • Tim Prass, Raytheon Technical Services Co., LLC

    WG 19

  • Tom Meuse, Thermo Fisher Scientific, Lowell, MA

    JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, WG 28, Standards Committee, Working Group Chairs, ESDA Board of Directors, Advanced Topics

  • Tom Ricciardelli, StaticStop, a Division of SelecTech, Inc.

    WG 4, WG 7, WG 9, WG 19, WG 28, WG 29, WG 53, WG 97, Working Group Chairs

  • Toni Gurga, Reliant ESD

    WG 1, WG 2, WG 3, WG 4, JWG HBM, JWG CDM, WG 5.6, WG 7, WG 9, WG 11, WG 14, WG 17, WG 18, WG 19, WG 20, WG 22, WG 26, WG 28, WG 29, WG 53, WG 97, Standards Committee

  • Toni Viheriakoski, Cascade Metrology, Lohja, Finland

    WG 17, WG 25, WG 29, US Symposium

  • Tony Johnson, Federal Aviation Administration - MMAC

    Education

  • Troy Anthony, Electro-Tech Systems, Glenside, PA

    JWG HBM, JWG CDM

  • Tung-Yang Chen, National Chiao-Tung University

    IEDS

V

  • Vicky Batra, STMicroelectronics

    India ESD Forum

  • Victor Skulavik II, Sandia National Laboratories

    WG 3, WG 17, WG 28, WG 29

  • Vladimir Kraz, OnFILTER, Santa Cruz, CA

    WG 3, WG 17

  • Vladislav Vashchenko, Maxim Integrated Products, Palo Alto, CA

    WG 18

W

  • Wei Gao, HuaWei HiSilicon

    IEDS

  • Wei Huang, ESDEMC

    WG 5.5, WG 14, WG 25, IEDS

  • Wei Liang, Globalfoundries

    WG 18, IEDS

  • Wenqiang Song

    IEDS

  • Wolfgang Stadler, Intel Germany Services GmbH, Munich, Germany

    WG 1, WG 2, WG 3, WG 4, JWG HBM, JWG CDM, WG 5.4, WG 7, WG 9, WG 11, WG 14, WG 15, WG 17, WG 19, WG 20, WG 28, WG 29, WG 53, WG 97, Standards Committee, Technical Advisory and Support Committee, Working Group Chairs, ESDA Board of Directors, Education, US Symposium

  • Wreeju Bhaumik, Analog Devices

    India ESD Forum

X

  • Xiaozong Huang, CETC-24

    IEDS

  • Xin Gao, HiSilicon

    IEDS

  • Xin Wu

    IEDS

Y

  • Yang Wang

    IEDS

  • Yi-Ting, Siemens EDA

    IEDS, IEW Committee

  • Yuan Wang, Peking University

    US Symposium, IEDS

  • Yung-Ming Chiu

    IEW Committee

Z

  • Zhaonian Yang, Xi'an PolyTech University

    IEDS

  • Zhi Wei Liu, UESTC

    IEDS

  • Zhiguo Li, YMTC

    IEDS