Volunteer List
EOS/ESD Association, Inc. is served by many volunteers who offer their expertise and dedication.
Here is a list of current volunteers and the committees/groups on which they serve.
A
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Aihua Dong, HiSilicon
IEDS
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Akhil Gore, Synopsys
WG 18
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Akhilesh Kumar, Ansys
WG 18
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Alain Loiseau, GLOBALFOUNDRIES
US Symposium
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Alan Righter, Analog Devices, Wilmington, MA
WG 5, JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 17, Working Group Chairs, ESDA Board of Directors, Standards Committee, Advanced Topics, Publications
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Andrea Boroni, STMicroelectronics, Agrate Brianza, Italy
WG 5, JWG (HBM), JWG (CDM), WG 5.5, WG 27, WG Chairs
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Andrew Kopanski, MIT Lincoln Laboratory
Education
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Andrew Spray, Synaptics Incorporated
WG 25, US Symposium
-
Andy Nold, Teradyne, Inc.
WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 20, WG53, WG 97, Certification
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Anindya Nath, Globalfoundries
US Symposium
-
Anish Kumar, Intel
WG 18
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Ann Concannon, Texas Instruments, Santa Clara, CA
WG 22, ESDA Board of Directors, Volunteer Development & Initiatives, Publications, US Symposium, Academia, Advanced Topics
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Arman Vassighi, Intel Corporation
WG 17, WG 53
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Arnie Steinman, Electronics Workshop, Berkeley, CA
WG 3
B
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Barry Fernelius, Eurofins EAG
JWG (CDM)
-
Bart Keppens, SOFICS, Gistel, Belgium
WG 22
-
Bas Grootemaat, Kingsize Consultancy
WG 53
-
Benjamin Orr, Intel
US Symposium, Advanced Topics
-
Bernard Chin, Qorvo
WG 17, WG 19, WG29, WG 53
-
Bob Vermillion, RMV Technology Group LLC, Moffett Field, CA
WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 19, WG 29, WG 97, Standards Committee, Working Group Chairs
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Brett Carn, Intel, Hillsboro, OR
WG 5, JWG (HBM), JWG (CDM), WG 5.4, WG 5.6, WG 14, WG 15, WG 25, WG 27, WG 29, Standards Committee, Technical and Advisory Support Committee, Board of Directors, Standards Business Unit Manager, Education, Advanced Topics
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Bright Ho
IEDS
C
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Carl Newberg, Simco-Ion
WG 3, WG 20, WG28, WG 29, Working Group Chairs, Certification
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Carol Rouying Zhan, ON Semiconductor
US Symposium
-
Chanhee Jeon, Samsung, Gyeonggi-Do, South Korea
WG 22
-
Charvaka Duvvury, ESD Consulting, LLC, Plano, TX
Publications, IEDS, Awards, Academia, Advanced Topics, India ESD Forum
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Chau-Neng (Michael) Wu, TSMC, San Jose, CA
WG 22
-
Cheryl Checketts, Estatec
WG 1, WG 53, Standards Committee
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Chin Siang (CS) Tay, Suzhou TA & A Ultra Clean Technology
WG 2, WG 17, WG 53, WG 97, ESDA Board of Directors
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Chris Jones, Semtech Corporation, Camarillo, CA
JWG (HBM)
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Christopher Almeras, Raytheon, McKinney, TX
WG 7, WG 11, WG 17, WG 19, WG 20, WG 28, WG 53, ESDA Board of Directors, Volunteer Development and Initiatives, US Symposium
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Chuck Dunn, NRD LLC
WG 3
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Chuck McClain, Micron Technology, Inc., Boise ID
WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 17, WG 19, WG 20, WG 28, WG 29, WG 53, WG 97, Standards Committee, Technical Advisory and Support Committee, Working Group Chairs, ESDA Board of Directors, Education
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Chun-Yu Lin, National Taiwan Normal University
IEDS, IEW Committee
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Colleen Doll, Google
Education, Volunteer Development & Initiatives, Certification
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Craig Zander, Transforming Technologies, Edina, MN
WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 20, WG 53, WG 97, Standards Committee, Working Group Chairs
D
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Dale Fuller, Seagate Technology, Longmont, CO
Education
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Dale Parkin, Seagate Technology, Shakopee, MN
WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 17, WG 19, WG 20, WG 53, WG 97, Standards Committee, Working Group Chairs, Nominations, US Symposium, Awards
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Dan O’Brien, University of Dayton Research Institute, Wright-Patterson AFB, OH
WG 1, WG 2, WG 4, WG 9, WG 11, WG 19, WG 20, WG 53, WG 97
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David Chandler, Forbo Flooring Systems
WG 7, WG 29
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David Eppes, Advanced Micro Devices, Austin, TX
WG 5, JWG (HBM), JWG (CDM), WG 25, US Symposium
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David Girard, Honeywell, Clearwater FL
WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 13, WG 15, WG 17, WG 19, WG 20, WG 53, WG 97, Standards Committee
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David Johnsson, High Power Pulse Instruments GmbH, Haar, Germany
US Symposium
-
David Kirk, Hologic, Newark, DE
Education
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David Klein, pSemi, Inc.,Austin TX
JWG HBM, JWG CDM, WG 5.5, WG 18, US Symposium
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David Pommerenke, Graz University of Technology
WG 26, IEDS
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David Swenson, Affinity Static Control Consulting, LLC, Round Rock, TX
WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 15, WG 17, WG 20, WG 28, WG 29, WG 53, WG 97, Standards Committee, Working Group Chairs, ESDA Board of Directors, Nominations, Education, Volunteer Development and Initiatives, Awards
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David Torp, Elect Nano
Advanced Topics Committee
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Dina Medhat, Mentor Graphics Egypt
Volunteer Development & Initiatives, US Symposium
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Divya Acharya, Qorvo
Volunteer Development & Initiatives
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Dolphin Abessolo-Bidzo, NXP Semiconductors, Nijmegen, Netherlands
WG 18, US Symposium
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Doug Holtz, CCI, New Hope, MN
WG 11
E
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Efraim Aharoni, Tower Semiconductor, Ltd., Migdal Haemek,Israel
WG 22
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Eleonora Gevinti, STMicroelectronics, Agrate Brianza, Italy
WG 18, US Symposium
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Eric Borrero, NASA
WG 7
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Evan Grund, Grund Technical Solutions, Inc., San Jose, CA
WG 5, JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 25, Standards Committee
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Evan Tsai, Dou Yee Enterprises
IEW Committee
F
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Fabrice Blanc, ARM, Grenoble, France
WG 22
-
Fabrice Caignet, LAAS/CNRS, Toulouse, France
WG 26, US Symposium
-
Filippo Magrini, Infineon Technologies AG, Neubiberg, Germany
WG 22
-
Frank Zou Feng, Synopsys
WG 18
-
Friedrich zur Nieden, Infineon Technologies AG
US Symposium
G
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Gary Latta, SAIC
WG 20, WG53
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Gene Monroe, NASA-LARC, Hampton, VA
WG 2, WG 7, WG 17, WG 28
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Geng Yang, UNISOC
IEDS
-
Gianluca Boselli, Texas Instruments, Inc., Dallas, TX
Board of Directors, Executive Committee, Nominations, Advisory Committee on Global Growth, Awards, Advanced Topics
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Gijs De Raad, NXP Semiconductors
US Symposium
-
Ginger Hansel, Dangelmayer Associates LLC, Austin, TX
WG 1, WG 4, WG 7, WG 17, WG 20, WG 53, Standards Committee, Nominations, Education, Volunteer Development and Initiatives
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Girish AS, AMD
India ESD Forum
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Greg O'Sullivan, Micron Technology Inc.
WG 5, JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6
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Guanghui Liu, Vivo
IEDS
-
Guangxiang Lu, Continental Corporation
Advanced Topics
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Guangyi Lu, HiSilicon Technologies Co., Limited
IEDS
-
Guido Quax, NXP Semiconductors
WG 18
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Guoyan Zhang, Silergy Corp
IEDS
H
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Hailian Liang, Jiang Nan University
IEDS
-
Hank Mead, BAE Systems Inc.
WG 7, WG 11, WG 20, WG 28, WG 53, Certification
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Harald Gossner, Infineon Technologies, Neubiberg, Germany
WG 14, WG 22, WG 26, Working Group Chairs, ESDA Board of Directors, Executive Committee, Publications, Awards, Academia, Advanced Topics
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Hari Shanker Gupta, SAC, ISRO
India EDS Forum
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Harry Brownett, Brownett Consulting, LLC
WG 29
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Harshit Dhakad, Intel
India ESD Forum
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Heinrich Wolf, Fraunhofer EMFT, Munich, Germany
JWG HBM, JWG CDM, WG 5.5, WG 14, Working Group Chairs, US symposium
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Henning Lohmeyer, Robert Bosch GmbH
WG 5.5, WG 26
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Hiroyasu Ishizuka, Maxwell Japan Co., Ltd
WG 25
-
Horst Gieser, Fraunhofer EMFT, Munich, Germany
WG 5.4
-
Howard Tang, UMC, Hsinchu, Taiwan
IEW Committee
J
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Jae Park, Texas Instruments
WG 14
-
Jam-Wem Lee, TSMC, Hsinchu, Taiwan
US Symposium
-
James Di Sarro, Texas Instuments
Education
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James Ziegler, SIKA
WG 7
-
Jay Skolnik, Skolnik Technical Training, Albuquerque, NM
Education
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Jeff Dunnihoo, Pragma Design, Bertram, TX
WG 14, WG 22, WG 26
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Jeff Salisbury, Coherent Corp. Allen, TX
WG 1, WG 5.6, WG 11, WG 17, WG 53, STDCOM
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Jeremy Smallwood, Electrostatic Solutions, Hampshire, United Kingdom
Education
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Jian Liu, Qorvo, Inc.
Publications
-
Jie Zeng
IEDS
-
Jim Roberts, ZF Friedrichshafen AG
WG 27
-
Jim Vinson, Renesas Electronics America
WG 22
-
Johannes Weber, Fraunhofer EMFT ATIS
US Symposium
-
John Anderson, NASA – AFRC
WG 7, WG 19
-
John Kinnear, IBM, Poughkeepsie, NY
WG 1, WG 2, WG 3, WG 9, WG 11, WG 17, WG 19, WG 20, WG 29, WG 53, WG 97, STDCOM, Technical Advisory and Support Committee, Working Group Chairs, ESDA Board of Directors, EXCOM, Nominations, Education, Publications, US Symposium, Certification, Awards,
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Joshua Yoo, Core Insight, Inc. Gyeonggi-do, South Korea
WG 3, WG 17, WG 19, Standards Committee, US Symposium
-
Julius Turangan, Dou Yee Enterprises
WG 2, WG 3, WG 11, STDCOM
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Jun Wang, SMIC
IEDS
-
Junjun Li, ESDA
ESDA Board of Directors, Advisory Committee on Global Growth, IEDS, Academia
K
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Kai Esmark, Infineon
WG 27
-
Karthik Srinivasan, Ansys
WG 18
-
Kathy Muhonen, Qorvo
JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14, WG 26, Education, US Symposium
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Kay Adams, Tech Wear, Inc
WG 2
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Keiichi Hasegawa, Hanwa Electronic Ind. Co., Ltd., Wakayama City, Japan
WG 5.6
-
Keith Peterson, Missile Defense Agency, Fort Belvoir, VA
WG 1, WG 4, WG 9, WG 11, WG 15, WG 17, WG 19, WG 20, WG 28, WG 53, WG 97, Standards Committee
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Kelly Robinson, Electrostatic Answers
WG 29
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Kevin Cleary, SCS
WG 11
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Kevin Duncan, Seagate Technology, Bloomington, MN
WG 1, WG 2, WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 20, WG 53, Standards Committee
-
Krzysztof Domanski, Intel Deutschland GmbH
WG 18
-
Kun-Hsien Lin, Amazing Microelectronic Corp
IEW Committee
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Kuo-Hsuan Meng, NXP Semiconductors
US Symposium
-
Kwanghoi Koo, Lab126 - Amazon Company
WG 5.5, WG 5.6, WG 25, WG 26
L
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Lena Zeitlhöfler, Infineon
US Symposium
-
Leonardo Di Biccari, STMicroelectronics, Agrate Brianza, Italy
JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, US Symposium
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Lorenzo Cerati, STMicroelectronics, Agrate Brianza, Italy
WG 5, JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 22, WG 25, WG, 26, Technical Advisory and Support Committee, ESDA Board of Directors, Publications, US Symposium
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Luca Merlo, STMicroelectronics
JWG HBM, WG 5.5
M
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Magdalena Hilkersberger, Infineon Technologies
WG 17, WG 53
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Manuel Meruelo, ESTATEC
WG 1, WG 2, WG 11, WG 28
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Marcel Dekker, Eurofins MASER, The Netherlands
WG 5, JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, Technical and Advisory Support Committee, Working Group Chairs
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Marcos Hernandez, Thermo Fisher Scientific, San Jose, CA
JWG CDM
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Marcus Koh, Everfeed Technology Pte., Ltd., Singapore
Education, IEDS
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Marko Simicic, imec
JWG HBM, JWG CDM, WG5.5, WG 5.6, US Symposium
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Mart Coenen, EMCMCC
JWG HBM, JWG CDM, WG 5.5, WG, 5.6, WG 14, WG 26, US Symposium
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Martin Pilaski, Nexperia
WG 26
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Marty Johnson, Texas Instruments, Santa Clara, CA
JWG HBM, JWG CDM
-
Mary Kay Botkins, ACL. Inc.
WG 4, WG 7, WG 9, WG 29, WG 53, WG 97
-
Maryam Shojaei, IIT, Mumbai
India ESD Forum
-
Masonori Sawada, Hanwa Electric Ind. Co., Ltd., Wakayama, Japan
JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 14, WG 26
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Matias Aliseda, ESTATEC
WG 1, WG 2, WG 4, WG 7, WG 11, WG 15, WG 17, WG 28, WG 29, WG 97
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Matt Jane, Tesla
WG 3, WG 4, WG 7, WG 9, WG 11, WG 17, WG 19, WG 20, WG 27, WG 28, WG 29, WG 53, WG 97, Technical Advisory Support Committee, ESDA Board of Directors, US Symposium, Certification
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Matt Strickland, Boeing
WG 1, WG 2, WG 3, WG 4, WG 7, WG 11, WG 15, WG 17, WG 19, WG 20, WG 28, WG 53, WG 97, Standards Committee
-
Matthew Hogan, Siemens Digital Industries Software
WG 18, WG 22, IEW Committee
-
Melissa Feeney-Jolliff, Aerospace Corporation, Hawthorne, CA
WG 19
-
Meng Miao, Globalfoundries
IEDS
-
Mengfu Di
IEDS
-
Michael (Chau-Neng), TSMC
WG 22
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Michael Ammer, Infineon Technologies
WG 26, US Symposium
-
Michael Khazhinsky, Silicon Laboratories, Inc., Austin, TX
WG 18, WG 22, Working Group Chairs, ESDA Board of Directors, Executive Committee, Publications, Advisory Committee on Global Growth, US Symposium, Academia, Advanced Topics
-
Michael Laube
WG 22
-
Michael Reardon, Silicon Laboratories, Inc.
JWG CDM
-
Michael Stevens, Freescale Semiconductor, Tempe, AZ
WG 27
-
Michael Zwicknagl, BJZ GmbH & Co. KG
WG 15
-
Michelle Lam, IBM
ESDA Board of Directors, Volunteer Development and initiatives, Publications
-
Mike Manders, United Stated Air Force AFRL/RXSA
WG 1, WG 4, WG 7, WG 9, WG 11, WG 19, WG 20, WG 53, WG 97
-
Ming Dou Ker, National Chiao-Tung University, Hsinchu-City, Taiwan
IEDS, IEW Committee
-
Ming Qiao
IEDS
-
Mingliang Li
IEDS
-
Mirko Scholz, Infineon
WG 5, WG 5.4, WG 5.5, WG 5.6, ESDA Board of Directors, US Symposium, Academia, Advanced Topics
-
Motosugu Okushima, Renesas Electronics, Kawasaki, Japan
IEW Committee
-
Muhammad Ali, Intel Corporation
WG 18
N
-
Nagothu Kranthi
US Symposium
-
Nanhai Xiao
IEDS
-
Nate Ashworth, Julie Industries/StaticSmart Flooring, Andover, MA
WG 4, WG 7, WG 9, WG 29, WG 97
-
Nathaniel Jack, Intel, Hillsboro, OR
Nominations, Volunteer Development & Initiatives
-
Nathaniel Peachey, Qorvo, Greensboro, NC
WG 5.6, WG 19, ESDA Board of Directors, Executive Committee, Education, Advisory Committee on Global Growth, US Symposium, IEDS, IEW Committee, Academia, Advanced Topics
-
Nicolas Richaud, Intel
WG 18, Advanced Topics Committee
-
Nihar Ranjan Mahapatra, IIT, Gandhinagar
India ESD Forum
-
Nitesh Trivedi, Intel Technologies
India ESD Forum
-
Nitin Bansal, Synopsis
India ESD Forum
-
Nobuyuki Wakai, Toshiba Corporation
WG 17
-
Norman Chang, ANSYS, San Jose, CA
WG 22
P
-
Pasi Tamminen, Danfoss
WG 25, WG 26, WG 29, Working Group Chairs, US Symposium
-
Paul Ngan, NXP Semiconductors
JWG CDM
-
Paul Phillips, Phasix ESD, Hampshire, United Kingdom
JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14
-
Paul Zhou, Analog Devices, Inc.
WG 18, WG 22, US Symposium
-
Pawel Rekas, Kimball Electronics
WG 1, WG 3, WG 4, JWG HBM, WG 5.5, WG 7, WG 9, WG 11, WG 15, WG 17, WG 19, WG 25, WG 28, WG 53, WG 97
-
Peter De Jong, Synopsys, Oosterbeek, Netherlands
WG 22, IEW Committee
-
Peter Koeppen, ESD Unlimited LLC
WG 5, JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14, WG 18, WG 22, WG 25, WG 26
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Peter Michelson
WG 18
-
Peter Turlo, On Semiconductor
JWG CDM
-
Pohan Chang
IEW Committee
-
Prantik Mahajan
US Symposium, Academia
Q
-
Qi-an Xu, Macronix Microelectronics (Suzhou) Co., Ltd.
IEDS
R
-
Rachel Rienstra, Lockheed Martin Space Systems
WG 15, WG 19, WG 53
-
Reinhold Gaertner, Infineon Technologies, Neubiberg, Germany
JWG HBM, JWG CDM, WG 5.4, WG 5.6, WG 11, WG 17, WG 20, WG 27, WG 53, Technical and Advisory Support Committee, Working Group Chairs, Advisory Committee on Global Growth, Awards
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Rita Fung, Cisco Systems Inc.
Us Symposium
-
Robert Ashton, ON Semiconductor, Phoenix, AZ
JWG HBM, JWG CDM, WG 5, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, Technical Advisory Support Committee, Working Group Chairs
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Robert Gauthier, Globalfoundries
ESDA Board of Directors, Executive Committee, Certification, Academia, Advanced Topics, Volunteer Development & Initiatives
-
Robert Myoung, ANSYS
WG 22
-
Rodney Doss, Samtec, Inc
WG 1, WG 3, WG 7, WG 11, WG 17, WG 28
-
Ronnie Millsaps, GLOBALFOUNDRIES Singapore Pte Ltd
WG 17, WG 20, WG 53
-
Ryan Jiang
IEW Committee
S
-
Scott Ruth, AMD
WG 18, WG 22, ESDA Board of Directors, Volunteer Development & Initiatives, Advanced Topics
-
Scott Ward, Texas Instruments, Dallas, TX
WG 5, JWG HBM, JWG CDM, WG 5.4, WG 11, WG 14, WG 17, WG 27, Standards Committee, Working Group Chairs
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Sergej Bub, Nexperia
WG 26
-
Shane Burns, Electro-Tech Systems
WG 11
-
Shane Heinle, Digi-Key Corporation
WG 3, WG 4, WG 7, WG 9, WG 11, WG 20, WG 53, WG 97
-
Shen-Li Chen
IEDS
-
Shih-Hung Chen, imec
ESDA Board of Directors, IEW Committee, Academia
-
Shubhankar Marathe, Amazon
WG 26, US Symposium
-
Shurong Dong, College of Information Science and Electronic Engi of Zhejiang University
IEDS
-
Slavica Malobabic, Cirrus Logic
US Symposium
-
Sondes Sahli, Microchip
WG 22
-
Steffen Holland, Nexperia
WG 26, Working Group Chairs, US Symposium, IEW Committee
-
Stephen Blackard, Coherent Corp.
WG 1, WG 2, WG 3, WG 7, WG 9, WG 11, WG 15, WG 17, WG 53, WG 97
-
Stevan Hunter, ASU, BYU-I
Education
-
Steve Gerken, Consultant
WG 20
-
Steven Poon, Intel Corporation
WG 18
-
Subhadeep Ghosh, Texas Instuments
WG 18
T
-
Taylor Bahr, Orbis Corporation
WG 11
-
Ted Dangelmayer, Dangelmayer Associates, Annisquam, MA
Education
-
Terry Welsher, Dangelmayer Associates, Suwanee, GA
JWG HBM, JWG CDM, WG 5.4, WG 22
-
Teruo Suzuki, Socionext, Inc., Tokyo, Japan
JWG HBM, JWG CDM, WG 5.5, WG 17, WG 22, US Symposium, IEW Committee
-
Theo Smedes, NXP Semiconductors, Nijmegen, The Netherlands
WG 5, JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 22, WG 25, WG 26, WG 27, Working Group Chairs
-
Tim Jarrett, BSCI
WG 29, WG 53, Standards Committee
-
Tim Maloney, SBC Global
JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, Us Symposium, Awards, Academia, Advanced Topics
-
Tim Maroni, NRD LLC
WG 3
-
Tim Prass, Raytheon Technical Services Co., LLC
WG 19
-
Tom Meuse, Thermo Fisher Scientific, Lowell, MA
WG 5, JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, WG 26, Standards Committee, Working Group Chairs, ESDA Board of Directors, Advanced Topics
-
Tom Ricciardelli, StaticStop, a Division of SelecTech, Inc.
WG 4, WG 7, WG 9, WG 19, WG 28, WG 29, WG 53, WG 97, Working Group Chairs
-
Toni Gurga, Reliant ESD
WG 1, WG 2, WG 3, WG 4, JWG HBM, JWG CDM, WG 5.6, WG 7, WG 9, WG 11, WG 14, WG 17, WG 18, WG 19, WG 20, WG 22, WG 26, WG 28, WG 29, WG 53, WG 97, Standards Committee
-
Toni Viheriakoski, Cascade Metrology, Lohja, Finland
WG 17, WG 25, WG 29, US Symposium
-
Tony Johnson, Federal Aviation Administration - MMAC
Education
-
Troy Anthony, Electro-Tech Systems, Glenside, PA
JWG HBM, JWG CDM
-
Tung-Yang Chen, National Chiao-Tung University
IEDS
V
-
Vicky Batra, STMicroelectronics
India ESD Forum
-
Victor Skulavik II, Sandia National Laboratories
WG 3, WG 17, WG 28, WG 29
-
Vladimir Kraz, OnFILTER, Santa Cruz, CA
WG 3, WG 17
-
Vladislav Vashchenko, Maxim Integrated Products, Palo Alto, CA
WG 18
W
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Wei Gao, HuaWei HiSilicon
IEDS
-
Wei Huang, ESDEMC
WG 5.5, WG 14, WG 25, IEDS
-
Wei Liang, Globalfoundries
WG 18, IEDS
-
Wenqiang Song
IEDS
-
Wolfgang Stadler, Intel Germany Services GmbH, Munich, Germany
WG 1, WG 2, WG 3, WG 4, JWG HBM, JWG CDM, WG 5.4, WG 7, WG 9, WG 11, WG 14, WG 15, WG 17, WG 19, WG 20, WG 28, WG 29, WG 53, WG 97, Standards Committee, Technical Advisory and Support Committee, Working Group Chairs, ESDA Board of Directors, Education, US Symposium
-
Wreeju Bhaumik, Analog Devices
India ESD Forum
X
-
Xiaozong Huang, CETC-24
IEDS
-
Xin Gao, HiSilicon
IEDS
-
Xin Wu
IEDS
Y
-
Yang Wang
IEDS
-
Yi-Ting, Siemens EDA
IEDS, IEW Committee
-
Yuan Wang, Peking University
US Symposium, IEDS
-
Yung-Ming Chiu
IEW Committee
Z
-
Zhaonian Yang, Xi'an PolyTech University
IEDS
-
Zhi Wei Liu, UESTC
IEDS
-
Zhiguo Li, YMTC
IEDS