JWG – Human Body Model (HBM) Device Testing

Status:
Active
Working Group Chair:
Terry Welsher, Dangelmayer Associates; Scott Ward, Texas Instruments, Inc.

Related Documents

  • Summary of meeting activities:

    The joint committee continued the five-year review of ANSI/ESDA/JEDEC JS-001. The document is targeted for submission to both organizations by September 2020. Updates were made to the HBM user guide, JTR-001, and it is expected to be submitted to both organizations in December 2020.

  • Summary of meeting activities:

    The joint committee discussed the method for HBM testing in general (every 2 Pin combination vs. Table 2A/2B). Then a discussion was held on a strategy for updating ANSI/ESDA/JEDEC JS-001 during the five-year review cycle to mandate all exposed die attach pads (thermal pads, heat sinks, etc) be considered for HBM stress.  Essentially treating exposed die attach pads just like any other pin on the package. The group plans to update the document and then decide how to address the non-conductive exposed die attach pads (more info in an annex, in the user guide or do nothing).

  • Summary of meeting activities:

    The joint working group discussed the definition of supply pins (per ANSI/ESDA/JEDEC JS-001). The challenges of categorizing certain classes of pins was discussed (VPP, LDO, charge pumps, etc.) and it was determined that for some of these pins, the clarity within ANSI/ESDA/JEDEC JS-001 could be improved. The group created a first draft of proposed revisions to ANSI/ESDA/JEDEC JS-001 related to HBM stress of die attach pads (thermal pads, heat sinks, etc.). A short brief submitted to inCompliance was discussed-this is critical as the change may require new HBM test boards to be created. A short discussion was held on low parasitic testers and non-monotonous waveforms and these discussions may drive proposed changes to ANSI/ESDA/JEDEC JS-001.

  • Summary of meeting activities:

    The joint working group discussed HBM pin classification (and HBM testing) on RF products. A proposal to use an Arduino processor for future HBM round robin testing was presented. The product could be HBM tested and the post-stress evaluation could be done at each testing site. This will eliminate the need for units to be shipped for post-stress evaluation for “Pass/Fail”. A discussion was held on continuity measurements of exposed die attach pads (DAP) with “semi-conductive” die attach adhesive. This may present a challenge during continuity verification of testing products with non-conductive DAPs.

  • Summary of meeting activities:

    A proposal was made for a stress method for the single pin combinations and a proposal for allocating an ESD test device for round robin experiments. This would be applicable for HBM, CDM, and other device level testing documents. There was a discussion on high-threshold HBM testing including three examples from industry. The committee decided that this discussion will be moved to WG 5.0 Device Testing. An article on the challenges of HBM stress on “die attach pads” was also shared.

  • Summary of meeting activities:

    A discussion was held on the current status of ANSI/ESDA/JEDEC JS-001 and the accompanying user. The document is expected to be ready for review by the end of the year. There was also a discussion on the stress methodology for determining the HBM threshold for a few pins to support the new datasheet document being developed in WG 5.0. A presentation was given showing a small sample of datasheets where a few pins were listed as having higher HBM robustness levels than the product as a whole. There was also a brief discussion on single pin thresholds.

  • Summary of meeting activities:

    The committee adjudicated TAS comments on ESD WIP5.1.4. Continued discussions were held on how to stress products with “exception pins” (i.e., pins with different thresholds that the majority of the pins). More discussion is needed before changes are made to ANSI/ESDA/JEDEC JS-001. The status of the technical report for a ANSI/ESDA/JEDEC JS-001 User Guide was reviewed and it was decided that many of the annexes in the joint standard will be moved to the user guide.

  • Summary of meeting activities:

    An update was presented on monatomic HBM waveforms including the initiation of a writing team between meeting series. The status of the user guide for ANSI/ESDA/JEDEC JS-001 was reviewed and further revisions are expected. The joint working group also reviewed questions from an industry user on the current ANSI/ESDA/JEDEC JS-001; the questions were related to APL and methods on how supply pin groups are formed and stressed.

  • Summary of meeting activities:

    An update was presented on monatomic HBM waveforms and a proposal was made for a modification to the ANSI/ESDA/JEDEC JS-001 requirements to allow more sophisticated ways of waveform parameter extraction. The group discussed out of spec 500-ohm waveforms using adapter boards and a 10K shunt on relay-based testers. There was also a discussion on how to stress products with “exception pins” (i.e., pins with higher or lower thresholds than the majority of the pins). This proposal was driven by the work in WG 5.0 on reporting recommendations in data sheets. A few methods were proposed and there is a plan to have this topic covered in the next revision of ANSI/ESDA/JEDEC JS-001. The status of the user guide for ANSI/ESDA/JEDEC JS-001 was reviewed and it is expected to be published at the same time as the next revision of ANSI/ESDA/JEDEC JS-001.

  • Summary of meeting activities:

    The joint working group reviewed the current status of ESDA/JEDEC JWIP-001. A discussion was held on current parking lot and new items for inclusion in the five-year update to ANSI/ESDA/JEDEC JS-001. This included a discussion on die attach exposed pads and how to curve trace them. There was also a discussion on a new item related to how to HBM stress products with known weak pins (e.g., RF pins). There was a concern raised due to the new datasheet standard practice currently being developed in WG 5.0. This topic will be discussed at future meetings.

  • Summary of meeting activities:

    A presentation on the summary of work on non-monotonic waveforms and alternate means for waveform verification that will be considered for inclusion in the next revision of ANSI/ESDA/JEDEC JS-001 – Human Body Model – Component Level was presented to the joint working group. The information presented will be documented in a technical report along with analysis methods previously proposed by a joint working group member. The group reviewed proposed changes for the next ANSI/ESDA/JEDEC JS-001 revision including a definition of “pin”, categorization of “exposed pads”, and low pin count devices. The joint working group also discussed the status of updates to the JS-001 user guide technical report and also discussed answers to questions from JEDEC JC-13 on ANSI/ESDA/JEDEC JS-001 and ANSI/ESDA/JEDEC JS-002 as part of their review of HBM test method in MIL-STD-883 Method 3015.9.

  • Summary of meeting activities:

    The joint working group discussed the treatment of exposed pads and the steps required to include the subject in the next revision of ANSI/ESDA/JEDEC JS-001. The committee is still exploring how to classify exposed die attach pads that use non-conductive adhesive. The joint working group also discussed a definition of “pin” and a recommendation on how to stress ICs with 10 pins or less. There was a brief discussion on the status of the user guide for ANSI/ESDA/JEDEC JS-001; a revision is expected soon.

  • Summary of meeting activities:

    The joint working group discussed a new document, ESD WIP5.1.4 - HBM testing – random sampling of power pins.  A discussion focused on HBM testing using a two-pin tester and methods to address devices with a number of power supply groups connected on the die only. The joint working group also held in-depth discussions on future additions to ANSI/ESDA/JEDEC JS-001 including exposed pads and stress guidance for low pin count devices (ICs <10 pins, discrete devices).

  • Summary of meeting activities:

    The joint working group adjudicated STDCOM vote comments on the limited ballot revision of JS-001. The document is expected to be submitted for industry review prior to the April meeting series. A discussion was held on the current status of the non-monotomic waveform analysis and simplification of decay constant determination.

  • Summary of meeting activities:

    The joint working group reviewed comments from the JEDEC JC10 limited ballot for ANSI/ESDA/JEDEC JS-001. A proposal presentation was given for a standard practice on pin selection using sampling for the terminal B pins during stress using a two pin tester. Technical considerations on non-monotonic HBM waveforms and “exposed pads” were also discussed. Both topics will be explored further in more detail during upcoming meetings.

  • Summary of meeting activities:

    An introduction to HBM JWG and past work / work in progress was presented. The committee reviewed the status of the ANSI/ESDA/JEDEC JS-001 limited ballot and reworked the schedule for a goal of publishing in December 2016. The working group also reviewed the status of ESD WIP5.1.3, a standard practice for random pin pairs, and a new proposal for a standard practice on two-pin testing improvements.

  • Summary of meeting activities:

    The committee discussed the newest revisions to ANSI/ESDA/JEDEC JS-001 regarding failure windows. The document updates will be submitted to the technical and administrative support (TAS) committee immediately following the April meeting series. The goal is to submit a final document to the ESDA Standards Committee (STDCOM) and JEDEC’s JC14.1 for vote in May.

    The joint WG also discussed a proposal for multiple pin supply pin groups shorted on the die only. There are concerns about the 10-90% rise-time measurement method so a small sub-group has been formed to analyze the issue and report back to the full team prior to the next teleconference.

     

  • Summary of meeting activities:

    The committee discussed the addition of “less than 50 V” allowance during the next revision of ANSI/ESDA/JEDEC JS-001. A proposal was presented for multiple pin supply pin groups shorted on the die only. A brief history of the WG was also presented for new meeting attendees.