WG 5.6 – Human Metal Model (HMM) Device Testing

Status:
Active
Working Group Chair:
Mirko Scholz, Infineon Technologies; Robert Ashton, Minotaur Labs

Related Documents

  • Summary of meeting activities:

    The WG discussed samples for continued experiments to investigate an energy correction factor for ESD guns and HMM pulse sources. A presentation was given on calibration issues in using both the old and new versions of the current measurement targets in IEC 61000-4-2. Another presentation was given on waveform captures from a variety of ESD gun RC networks from IEC 61000-4-2, ISO 10605, and SAE J1455 A94.

  • Summary of meeting activities:

    A presentation was given on the gun correction factor K. New experiments will be conducted using the gun correction factor in multiple labs using a single lab procedure in which voltage and current waveforms are captured during device stress. A new technical report is planned to focus on issues concerning repeatability and reproducibility when performing HMM testing using ESD Guns. IEC standard IEC61000-4-2 is currently being revised so members are planning a joint task team to input on the new revisions.

  • Summary of meeting activities:

    A presentation by given to introduce a correction factor for ESD guns based on total energy in a resistive load allowing conversion of the HMM voltage to ideal IEC voltage showing promising results by reducing the gun by gun variation. More insight was given through two presentations to the WG on power spectral density (PSD) of ESD guns. One presentation showed the results regarding HMM testing of RF parts and parts failing due to power differences in the certain frequency band of the ESD gun discharge pulse. The other presentation showed the PSD from a nominal IEC HMM 1 kV pulse and an idea for noise reduction for an HMM discharge pulse. Real HMM human discharge pulses were shown in a presentation to give a better understanding that real human HMM discharge pulses differs from HMM standard pulse defined in the HMM standard.

  • Summary of meeting activities:

    A presentation was given on the frequency behavior of ESD guns. Besides devices failing for Peak current or total energy some RF devices fail due to increased energy within a certain frequency band. From the HMM verification waveform the power spectral density was calculated for different guns from the new single device experiment. A presentation was also given on a proposal for scaling ESD gun voltages. First attempt is to establish a way to adjust voltage between guns and to IEC ideal waveform for devices failing for total energy. Idea will be checked with the data from the new single device study. A writing team will begin writing a technical report to explain in more detail differences in testing for reproducibility and repeatability using guns for device testing. A proposal for the outline of the document will be written and discussed within the writing team before the next meeting.

  • Summary of meeting activities:

    An update was given about the single lab experiment, with 3 presentations

    • “IEC 61000-4-2 Calibration Targets” looked at solving the total energy problem between old and new style targets
    • “Fail Results on TSPD Modules” explained the different between the data of 2009 round robin and the 2018 single lab experiment
    • “HMM Pulser Characterization of ON Semiconductor TSPD Device” expanded the single lab experiment data with TLP and HMM pulser data

    The working group discussed the next steps for the document including expanding single lab experiments with other devices (diodes, TVS, RF switches), looking for differences in guns (frequency response), and possibly using filtering for improving the discharge current behavior of ESD guns. The group plans to

    write a technical report to explain in more detail differences in test for reproducibility and repeatability using guns for device testing.

  • Summary of meeting activities:

    The committee adjudicated comments from the STDCOM vote and made changes to address the no votes. Document will be resent to the working group for additional review. A presentation was given about the first results from the single lab experiment on the same TSPD device from the round robin in 2011. Results showed less than 4% difference between labs and 1% difference between same type of gun for failure levels. Standard deviation for the failing levels is almost 2 times smaller than for the round robin from 2011.

  • Summary of meeting activities:

    The WG adjudicated STDCOM vote comments on ESD WIP5.6 and technical changes were made. For the new single lab experiment additional ESD guns were secured to re-investigate the repeatability of the ESD guns on the TSPD samples remaining from the first-round robin. The single lab experiment will be extended with RF protection circuits to further evaluate the repeatability and reproducibility of the IEC stress from the ESD guns.

  • Summary of meeting activities:

    The working group adjudicated TAS comments on the revision of ESD WIP5.6. The document will be distributed to members for additional review prior to the September face-to-face meeting.

  • Summary of meeting activities:

    The working group reviewed the status of ESD WIP5.6 and proposed changes from the 2009 version to better reflect expected usage of the document. There was also a discussion on the working group’s status and future direction. There was general agreement that there is a need for a standardized method for stressing semiconductor devices with an IEC 61000-4-2 current stress and an updated version of ANSI/ESD SP5.6 will fill that need. In the near future the working group will conduct a single lab experiment on a TSPD sample to determine if the same samples, which yielded poor results in the original round robin, can provide repeatable results when the experiments are conducted at a single laboratory with multiple ESD guns and HMM pulse sources.

  • Summary of meeting activities:

    An introduction to the working group was presented for guests including the history and latest achievements. The working group discussed the changes to ESD WIP5.6 that were completed between meeting series by the writing team. 

  • Summary of meeting activities:

    The committee was given a report on the additional measurement data from single lab testing experiments that was collected between meetings. There was a discussion on how to proceed with the five-year review of ANSI/ESD SP5.6. The WG decided to start revising the document with a goal to publish before January 2020.

  • Summary of meeting activities:

    An introduction of the working group’s documents and on-going activities was presented. A short update on single lab testing at a German lab and planned edits to ANSI/ESD SP5.6 during the five-year review cycle was also discussed. A presentation was given on source impedance measurements with a 50-ohm HMM pulser based tester.

  • Summary of meeting activities:

    The committee discussed the next steps and changes needed to reaffirm ANSI/ESD SP5.6 prior to the completion of the round robin testing. The WG decided to address only the most serious issues with the current ANSI/ESD SP5.6. A presentation was given on a comparison of HMM stressing of TVS devices at two locations using three ESD guns of two types. It was found that the difference in the failure levels between the two types of guns could be explained by the difference in energy deposited in the TVS from calculations based on the current waveforms.

  • Summary of meeting activities:

    The committee reviewed a brief history of activities and development of ANSI/ESD SP5.6-2009. The progress of current single lab testing was discussed; there is one site that needs to complete testing. The committee discussed the next steps and changes needed to reaffirm ANSI/ESD SP5.6 prior to the completion of the round robin testing.

  • Summary of meeting activities:

    The committee discussed what is required to elevate ANSI/ESD SP5 to a standard test method; this will increase user confidence in the HMM test method. A new round robin will need to be completed with six or more labs. The committee also discussed if system-level failure levels should be added on datasheets and what would the information look like. It was decided that the round robin needs to be successfully completed first before the information is placed on a datasheet.

  • Summary of meeting activities:

    The past and current WG activities and documents were introduced to the new participants. The draft presentation for the 2016 EOS/ESD Symposium was presented to the attendees. Discussions were held on the practical issues that the working group is facing in the effort to redesignate ANSI/ESD SP5.6 to a standard test method.

  • Summary of meeting activities:

    The WG reviewed the status of the accepted 2016 Symposium paper being presented by committee members. Testing will continue in an effort to identify the variables that affected the original round robin testing.

  • Summary of meeting activities:

    The reviewed the current status of an EOS/ESD Symposium paper abstract being written on the test results of the single site/lab testing that has been completed by WG members. Current testing data was reviewed and discussed as well.