WG 26.0 – System ESD Modeling

Working Group Chair:
Fabrice Caignet, LAAS-CNRS
  • Agenda items for the meeting on June 25, 11:00 AM – 12:30 PM EDT are:


  • Summary of meeting activities:
    A presentation was given on a transient spice model for system level ESD modeling that also introduced the USB 3 test board for verification of the model as well as how to perform the measurements. This board will be used in a multi laboratory study on developing transient ESD models for system level ESD simulation. The status of the laboratories to participate in the experiments to prove in the modeling methodology was reviewed and one new laboratory and one potential new laboratory were recruited to join the multi lab experiment. It was decided that a procedure for developing the transient models should be written so the working group will decide in future meetings if the document should be a technical report or standard practice.

    Agenda items for the meeting on April 15, 10:00 AM – 12:00 PM PT are:


  • The working group reviewed the new document on building models for SEED. The document is expected to be submitted to the technical and advisory support committee before the April meeting series. The group also completed a brief review of the main draft document describing why the working group decided to start with measurements and validations. There was also a discussion on transient models. It has been decided to start collecting measurements on a common USB3 board to evaluate dynamic models of the various partners. A proposed board was presented by a meeting attendee.

  • Summary of meeting activities
    A presentation was given on a document for “building models for SEED”. The document will be distributed to working group members for review and discussion at the September meeting series. A presentation was given on a snapback model for Spice simulation that includes overshoot and dynamic modeling. Further discussion will be held at the September face-to-face meeting.

    Agenda items for the meeting on July 27, 2017, 10:00 – 11:30 AM ET are:

    • Review of the "Building models" document
    • Next actions for the "Building models » document get external feedback for September
    • Review of the general SEED Document philosophy - Actions
    • Any other business    
  • Summary of meeting activities
    The committee reviewed sections of a new technical report on system level ESD modeling. A presentation was given on “TVS modeling project and USB IO SEED Modeling”.

    Agenda items for the meeting on April 30, 2017, 10:00 AM – 12:00 PM MT are:

    • Review of the document Building models
    • Review of the comments from WG26 members
      • Discussion on what should be done on this document - modifications need , add examples, ETC...
      • Brief review of the 1st Draft doc on the SEED methodology.
    • Presentations, if any
    • Discussion: future work of WG 26
  • Summary of meeting activities
    The history and goals of the committee were presented. The committee reviewed sections of a new technical report on system level ESD modeling. Further review and discussion on the document is needed by the working group prior to the April meeting series.

    Agenda items for the meeting on Thursday, February 2, 2017, 11:00 AM – 12:30 PM ET are:

    • Presentation and history of the working group models for system level   
    • Evolution of the documents resulting from the measurement campaign.
    • Last result and document issues on simulation while implementing piecewise linear models into simulators
  • Summary of meeting activities
    The committee reviewed a new technical report concerning the actual measurement campaign. There are concerns regarding the complexity of building a simulation of the models; a new document will be written to address the concerns. Another technical report is being written to address TLP format for SEED. Two presentations related to TLP format for SEED were given and a decision was made to extract the parameters for SEED to TLP.

  • Summary of meeting activities
    The committee reviewed the current outline and progress on a new technical report regarding measurement and simulation campaign to validate SEED modeling. The objectives and outline of the document were presented, including validating the approach of performing TLP measurement to build models, providing models in different languages, and specifying the most common error in building models and how to avoid them. A discussion on the current action of TLP format for SEED modeling was discussed; the objective is to identify first what are the parameters needed to build models that can be extracted from TLP.

    Thursday, July 21, 11 am – 12 pm EST meeting agenda items:

    • Introduction to activities of WG 26 – summary of the activities
    • TLP Format for component models 
    • Report on the "round robin" Document – status
    • Actions for September meeting
  • Summary of meeting activities
    The WG continued the discussion started during the WG5.5 meeting regarding data format exchange from TLP to build SEED models. A subcommittee has been formed to gather relevant information.

    The committee continued discussions regarding a collaboration effort with IEC Technical Committee TC47 to develop a standard for pulse immunity models that defines the non-linear-model and the exchange format already developed by IEC – CIML (xml format dedicated to EMC modeling).

    A presentation was given on current simulation testing underway that shows quasi static prediction with no external elements is easy; when external elements are added, the lack of transient information into the model shows important mismatches. Powered supply measurements have been done and exhibit different behavior depending on the output configuration (standby, normal or low power mode). The information will be presented at IEW 2016.

    Sunday, April 17, 10 AM to 12 PM meeting agenda items:

    • Standards Policy Review
    • Advances in the Tests on LIN/USB/DLATCH
      • New measurements I(V) on USB and Dlatch 
      • Modeling into VHDL/AMS + SPICE 
      • Comparison between measurements and simulations : (IEW results and some more results we get)
      • Quasi static simulation results (with/without external C)
      • Transient simulation : important on the transient simulation when a decoupling capa is added: current simulation and measurement into the device exhibit a strong difference (*2,*3)
    • Result from the discussion with WG5 group : TLP data need for SEED. 
    • Evolution of the draft document : SP, TR,STM,