WG 26.0 – System ESD Modeling

Status:
Active
Working Group Chair:
Steffen Holland, Nexperia
  • Summary of meeting activities:

    Presentations were given on modeling activities of discrete ESD devices and a new board which allows to model an application with IC and external ESD protection device on a board. The current status of ESD TR26.0-01 was also reviewed.

  • Summary of meeting activities:

    The committee review changes to ESD TR26.0-01 based on TAS comments and held a discussion on dynamic models.

  • Summary of meeting activities:

    The committee continued adjudicating TAS comments on two new technical reports.

  • Summary of meeting activities:

    The working group reviewed TAS comments on two new technical reports ESD TR26.0-01 and ESD TR26.0-02. Presentations were given on work concerning dynamic models of devices including USB3 board measurement results and on how to build a transient device model.

  • Summary of meeting activities:

    The working group completed final updates to two technical reports and will send the documents to TAS for review before the April meeting series. A discussion was held on the USB3 measurements and simulation objectives.

  • Summary of meeting activities:

    The working group reviewed the status of documents currently being developed on model implementations and general description modifications. Two documents are expected to be submitted to TAS before the January meeting series. The group also discussed future collaboration with IEC TC47 on an IC model for pulse immunity (including ESD) document. Work will continue on another document focused on dynamic modelling on the component.

  • Summary of meeting activities:

    An overview on the history and current activities of committee were presented. The group then began organizing a round robin for USB3 transient modelling.

  • Summary of meeting activities:

    A presentation was given on a transient spice model for system level ESD modeling that also introduced the USB 3 test board for verification of the model as well as how to perform the measurements. This board will be used in a multi laboratory study on developing transient ESD models for system level ESD simulation. The status of the laboratories to participate in the experiments to prove in the modeling methodology was reviewed and one new laboratory and one potential new laboratory were recruited to join the multi lab experiment. It was decided that a procedure for developing the transient models should be written so the working group will decide in future meetings if the document should be a technical report or standard practice.

  • Summary of meeting activities:

    The working group reviewed the new document on building models for SEED. The document is expected to be submitted to the technical and advisory support committee before the April meeting series. The group also completed a brief review of the main draft document describing why the working group decided to start with measurements and validations. There was also a discussion on transient models. It has been decided to start collecting measurements on a common USB3 board to evaluate dynamic models of the various partners. A proposed board was presented by a meeting attendee.

  • Summary of meeting activities:

    A presentation was given on a document for “building models for SEED”. The document will be distributed to working group members for review and discussion at the September meeting series. A presentation was given on a snapback model for Spice simulation that includes overshoot and dynamic modeling. Further discussion will be held at the September face-to-face meeting.  

  • Summary of meeting activities:

    The committee reviewed sections of a new technical report on system level ESD modeling. A presentation was given on “TVS modeling project and USB IO SEED Modeling”.

     

  • Summary of meeting activities:

    The history and goals of the committee were presented. The committee reviewed sections of a new technical report on system level ESD modeling. Further review and discussion on the document is needed by the working group prior to the April meeting series.

     

  • Summary of meeting activities:

    The committee reviewed a new technical report concerning the actual measurement campaign. There are concerns regarding the complexity of building a simulation of the models; a new document will be written to address the concerns. Another technical report is being written to address TLP format for SEED. Two presentations related to TLP format for SEED were given and a decision was made to extract the parameters for SEED to TLP.

  • Summary of meeting activities:

    The committee reviewed the current outline and progress on a new technical report regarding measurement and simulation campaign to validate SEED modeling. The objectives and outline of the document were presented, including validating the approach of performing TLP measurement to build models, providing models in different languages, and specifying the most common error in building models and how to avoid them. A discussion on the current action of TLP format for SEED modeling was discussed; the objective is to identify first what are the parameters needed to build models that can be extracted from TLP.

     

  • Summary of meeting activities:

    The WG continued the discussion started during the WG5.5 meeting regarding data format exchange from TLP to build SEED models. A subcommittee has been formed to gather relevant information.

    The committee continued discussions regarding a collaboration effort with IEC Technical Committee TC47 to develop a standard for pulse immunity models that defines the non-linear-model and the exchange format already developed by IEC – CIML (xml format dedicated to EMC modeling).

    A presentation was given on current simulation testing underway that shows quasi static prediction with no external elements is easy; when external elements are added, the lack of transient information into the model shows important mismatches. Powered supply measurements have been done and exhibit different behavior depending on the output configuration (standby, normal or low power mode). The information will be presented at IEW 2016.