WG 5.5 – Transmission Line Pulse (TLP) Device Testing

Status:
Active
Working Group Chair:
Theo Smedes, NXP Semiconductor

Related Documents

  • Summary of meeting activities:

    The group adjudicated the second round of TAS review comments on a new technical report, ESD TR5.5-05-20. The updated document will be submitted for publication following the meeting series. Then the group discussed an update to the TLP section of the ESDA Roadmap and also started the five-year review of ANSI/ESD STM5.5.1.

  • Summary of meeting activities:

    The group discussed TAS review comments on a new technical report, ESD TR5.5-05-20. An updated document will be submitted to the WG for review before being sent back to TAS for a publication review. Then the group briefly discussed some proposals for figure updates in the technical report. Some improvement suggestions were received. Revisions to the user guide being developed were also reviewed.

  • Summary of meeting activities:

    The committee adjudicated WG member comments on a new technical report on transient response (Tr-TR). A presentation was given on a proposal for an annex on impedance vs. time during device turn-on for TR-TR. Information will be extended and used in formulation of an annex of TR-TR. A second presentation was given on comparison of 5 TVS devices with comparable datasheet information. Transient analysis shows significant differences between the five different types. An initial discussion was held on high impedance TLP for extension of the user and application guide. The committee will look for example and references between meetings.

  • Summary of meeting activities:

    An introduction of WG activities was given with a focus on the user guide being developed. A presentation was shown on VF-TLP measurements with different Kelvin and non-Kelvin methods. The presentation showed effects on calibration and impact of Kelvin vs. Non-Kelvin configuration. The group discussed the impact of set-up details on transient behavior observed. A status update was also given on a new technical report on transient response. A full draft is expected for WG review at the September meetings.

  • Summary of meeting activities:

    A technical presentation was given on measurements and demonstrated the differences between 2 Kelvin methods to measure transient effects using PCB with SMA connectors to connect to DUT. Further work will be done to compare with similar measurements with wafer probes. The new for technical report on transient response was reviewed including a new idea for verification of transient measurement with known inductor/capacitor, similar to use of Zener for voltage verification and a new proposal for a better structure. The committee also discussed information collected on solid state pulsers. At this time the WG does not feel there is enough interest or information to pursue work on this topic.

  • Summary of meeting activities:

    The working group reviewed the status and agreed on the next steps for a new technical report on transient response. Chapters will be improved for clarity, coherence, and examples of applications. The document will be distributed for review and feedback before the April meeting. A discussion was held on solid state pulsers including creating an inventory of available equipment. A final decision to pursue or not will be made at the April meeting. A presentation was given on long pulse TLP that included interesting observations that show long TLP can be useful and also may have implications on ANSI/ESD STM5.5.1 (for example, recommendation on setting and reporting integration window). There may also be additional sections in user & application guide technical report.

  • Summary of meeting activities:

    The current draft version of a new technical report on TLP transient response was reviewed and expected for submission to TAS in mid-2019. A discussion was held on future activities of the working group with a decision to work on an update to the TLP user guide technical report to include a section on 500-ohm TLP.

  • Summary of meeting activities:

    An overview of recent WG activities was presented. ESD TR5.5-03-18 was published in June 2018. The status of a TR on transient response analysis was presented as well as details regarding the contribution of Kelvin like measurement. A draft of the document is expected to be circulated to the working group for review before the September face-to-face meeting.

  • Summary of meeting activities:

    The committee completed adjudication of TAS comments on ESD TR5.5-04. The document is expected to be published before the June virtual meeting series. A presentation was given on a proposal for a new technical report on transient response. A first draft is expected to be distributed to a writing team before the June meeting series. There was also a discussion on future work for the group; further discussion will be held at the September face-to-face meeting.

     

  • Summary of meeting activities:

    A short overview of the history of WG5.5 based on the 2017 year in review presentation was presented to the attendees. The committee adjudicated technical and advisory support committee comments on the new user and application guide technical report (ESD TR5.5-04-1x) being developed. An update was given on a new transient response technical report. A draft is being prepared with the goal to have the writing team comments available for discussion at the April face-to-face meeting series.

  • Summary of meeting activities:

    The working group reviewed WG comments on a new technical report - user & application guide for using ANSI/ESD STM5.5.1. A presentation was given on analysis of TLP source impedance characterization. Measurement based simulation shows source impedance changes in the first ns after relay closure, but due to delivery coax cable the DUT does not see that. Thus, valid transient response analysis can be done with such equipment. The working group is also developing a technical report on transient response.

  • Summary of meeting activities:

    A presentation was given on three new sections being propose for the user and application guide technical report currently being written. The working group also reviewed the status of a technical report on transient response.

  • Summary of meeting activities:

    The working group reviewed the status of a technical report on transient response. The goal is to have a draft ready for review at the September meeting series. The working group also reviewed the status of a user and application guide technical report. The goal is to have an updated version ready for review by the July meeting series and a full working group review before the September meeting series.

  • Summary of meeting activities:

    A brief history of WG5.5 and the publication of ANSI/ESD STM5.5.1-2016 was given. The working group reviewed the status of a technical report on transient response. The writing team has completed the structure and outline of the document and some initial text has been drafted. The goal is to have a draft ready for review at the April meeting series. The working group also reviewed the status of a technical report to be used as a user and application guide. The goal is to have an initial version ready for review by the April meeting series.

  • Summary of meeting activities:

    The working group reviewed and adjudicated comments from industry reviewers on ESD DSTM5.5.1 (merged TLP/vf-TLP document). A technical change was identified and the document will be submitted for a limited ballot vote. Two presentations were given on TLP-based modeling of transient behavior and will be included in a new technical report. Three new contributions for the user guide were presented on correlation TLP-HMM; contact burn-in; and repetitive TLP.

  • Summary of meeting activities:

    The working group adjudicated comments from the Standards Committee review and vote. The document will be distributed for industry review before the September meeting. Status reports of the transient response writing team and user guide collection were discussed; both are progressing according to plan. A presentation was given to introduce the topic of using TLP for device modelling; there was sufficient interest so a more detailed discussion is scheduled for the September meeting.

  • Summary of meeting activities:

    The committee adjudicated additional TAS comments on the merged ANSI/ESD STM5.5.1 and ANSI/ESD SP5.5.2 document. Revisions will be completed and the document will be submitted for STDCOM vote prior to the July meeting series.

    The committee reviewed two examples for the TLP user guide technical report. Further discussion is planned for the next teleconference.

    A representative from WG26 (System Level Modeling) discussed the need for standardized file format for TLP measured data to make model extraction easier. It was decided that the proposal should come from WG26 and be discussed with TLP suppliers.

  • Summary of meeting activities:

    The committee reviewed the current status of the merged ANSI/ESD STM5.5.1 and ANSI/ESD SP5.5.2document and discussed TAS feedback. Revisions will be completed and the document will be submitted for STDCOM VBM prior to the April meeting series. An update was presented for a technical report on transient response measurement and analysis with TLP equipment.