Industry Council White Paper 2: A Case for Lowering Component Level CDM ESD Specifications and Requirements
CDM has become the primary real world ESD event metric describing ESD charging and rapid discharge events in automated handling, manufacturing and assembly of IC devices. Its importance has dramatically increased in the last few years as package feature sizes, capacitance and pin count have scaled upward. In recent years, arbitrary CDM protection levels have been specified as IC qualification goals with little background information available on actual/realistic CDM event levels and the protection methods available in controls and device design for safe production of IC components. The rapid advancement of IC technology scaling, coupled with the increased demand for high speed circuit performance, are making it increasingly difficult to guarantee the commonly customer specified “500V” CDM specification. At the same time, the required static control methods available for production area CDM protection at each process step have not been fully outlined. Therefore, a realistic CDM specification target must be defined in terms of available and commonly practiced CDM control methods, and also must reflect current ESD design constraints.