WG 5.4 – Transient Latch-up (TLU) Device Testing

In previous meetings, the WG discussed what the next steps should be for the TLU WG.

Also discussed were the results of the Industry Council of ESD Target Levels “Latch-up survey”, which yielded a significant amount of “TLU issues” not captured by other “static test methods”. Although there may be some communication with JEDEC78 on the inclusion of TLU in a JEDEC document, the WG decided to go dormant as, currently, no technical work on the TLU characterization method or on the SP is required. WG will reconvene if there is a strong industry request.

During the meeting, discussed the 5-year review requirement of the SP5.4.1 “Transient Latch-up Testing Device Level” document and determined that it could be reaffirmed with only minor editorial changes, no technical changes at this time.  Document changes will be completed and forwarded to headquarters for review. 

The relevance of TLU testing was discussed, with a questioning being asked “how many are using this method”?  This led into a discussion on the results of the Industry Council of ESD Target Levels “Latch-up survey” which yielded a significant amount of “TLU issues”, not captured by other “static test methods”.

Based on these reviews, the WG will explore whether SP5.4.1 or any other TLU methodology was used for debugging and/or characterization.

      Companies using TLU characterization are be invited to the next WG meeting.