JWG – Human Body Model (HBM) Device Testing

Our draft agenda for the in-person meeting of the HBM JWG, scheduled for two hours at 10:00 on 20 March 2026, is shown below.

Draft Agenda
    Welcome
    Assign Note-taker
    Review Etiquette and Policies Slides
    Review Document/WG Activity Status Since the Last Meeting

    Discussion on the treatment of multiple die packages which contain several identical die.  Do all the pins of each die have to be      stressed?

    Discussion on the treatment of non-supply pins which have no associated supplies.

    Review of proposed editorial changes to align with IEC standards

    Schedule for publication of the next revision of JS-001

    AOB / Walk-on items
    Schedule next meeting

Documents in review

• ANSI/ESDA/JEDEC JS001à 2024 ready for publication
  • Introduced an alternative decay time calculation method.
  • Created better waveform verification equipment specifications.
  • Created better descriptions of pre-pulse voltage rise detection test and trailing pulse detection apparatus.
• ESD JTR001-01-xx – User Guide à TAS comments to be adjudicated
  • Complete review (JS001 alignment)

Current Top 3 WG activities

• Pin Grouping and Resistance Measurement Review (for next full review)
• Cloned IO allowance review (for next full review)
• JTR-001 comments adjudication
• Pin Grouping and Resistance Measurement Review
  • Definitions and allowances
    • Supply Pin Group à metal < 3 Ohms
    • Shorted Supply Pin Group à metal < 1 Ohm (including not APL)
    • Shorted Non-Supply Pin Group à metal regardless resistance value
• Cloned IO
  • More accurate definition
  • Engineering judgment on applicability of the methodology
    • Suggestion for additional pins to be selected based on design to confirm normally distribute failure
  • ATE in addition to curve trace for functional failure
  • ATE @ 1.5SPL and V1 (one additional part)
• Round Robin testing to elevate SP5.1.4 to STM5.1.4
  • No parts available
• 500R evaluation load bandwidth
  • Resistance with different bandwidth (VNA measurement)
  • trr = 11.15 ns to 44.11
  • Current note: Care should be used in the selection of the 500-ohm resistor to avoid resistors with high inductance, such as wire wound resistors, or resistors with high parallel capacitance.
  • Additional requirements needed?
• JS001 Next Full Revision
  • Supply pin group, shorted supply pin group, shorted non-supply pin set
    • Definition and allowances
  • Cloned IO
    • Definition, methodology applicability, ATE to confirm failure
  • Incorporate JTR reference
  • Definition: “positive clamp test socket” and "non-positive clamp fixtures“
  • Shall/Should use parts already used for another test à WG 5.0 DONE
  • Failure criteria à WG 5.0
  • Caution changing test table or pin association to discount failure
  • Table B N+1 stress with two-channel tester DONE
  • Shorted supply pins à allowance to have all connected to one tester channel

The WG discussed pin grouping and resistance measurements as well as reviewed cloned I/O allowance. The group also discussed round robin testing for ANSI/ESD SP5.1.4 -  A Method for Random Sampling of Power Pins.

During the meeting, the JWG reviewed the status of JS-001 LB, adjudicated STDCOM comments on WIP5.1.4-203, and discussed Cloned IO/Pin Grouping/Exclude criteria 3 ohms/1 ohm.

• The WG adjudicated the TAS comments on the limited ballot on JS-001. There was also a discussion on the alternative Cloned IO method allowed within the document.

  • Information was given that stated a problem was discovered when using this method, which brings the method into question.
  • Additional information will be gathered on this issue to determine if changes need to be made.

  A status was given on the updates being made to the ESDA/JEDEC JTR001 User Guide document.

  • Additional work is continuing within the writing team, and once they have a version ready, it will be provided to the entire WG for review prior to moving forward towards release.

The WG reviewed modifications made for the limited ballot of JS-001, including:

• Introduction of an alternative Decay Time calculation method
• Better waveform verification equipment specifications
• Better descriptions of the pre-pulse voltage rise detection test and trailing pulse detection apparatus
• New order of Annex D Figures for better alignment with logical flow
• Cloned IO definition and flow revision
• Minor editorial changes

WG adjudicated TAS comments on ANSI/ESD SP5.1.3-2023 – A Method for Randomly Selecting Pin Pairs and WIP SP5.1.4 – Random Sampling of Power Pins. A review was also given on the status of the ESDA/JEDEC JTR001, Users Guide.

The WG adjudicated TAS comments of ESD SP5.1.4 “Random Sampling of Power Pins”. The document will be sent to headquarters. An update on JTR001 User Guide was provided - work is still ongoing with the hopes of releasing it along with JS-001 by the end of 2023. The status of ANSI/ESDA/JEDEC JS-001 HBM was also discussed, awaiting the JEDEC BoD vote. The group discussed a question on cloned IO pin criteria, awareness of many allowances, and impact on HBM results; further user guide discussion is planned.

The WG adjudicated the industry review and JEDEC ballot comments on the five-year update of ANSI/ESDA/JEDEC JS-001, “HBM”. These changes are will be sent to STDCOM for a recirculation vote. TAS comments on the five-year review of ANSI/ESD SP5.1.4 “Random Sampling of Power Pins” were reviewed and adjudicated. ANSI/ESD SP5.1.3 “Statistical pin pair combination” will be sent to TAS with a recommendation for reaffirmation. The JWG discussed the proposal to update the decay time measurement method to move from a linear-based calculation to an exponential-based calculation for the next revision of ANSI/ESDA/JEDEC JS-001. Data was presented which showed the differences in results between these two calculation methods. The JWG also discussed proposals for the “discharge all pins” and charge removal allowances within ANSI/ESDA/JEDEC JS-001 and how these should be updated within the document.

The JWG discussed the proposal to update the decay time measurement method to move from a linear-based calculation to an exponential-based calculation for the next revision of ANSI/ESDA/JEDEC JS-001. Data was presented which showed the differences in results between these two calculation methods.

The JWG also discussed proposals for the “discharge all pins” and charge removal allowances within ANSI/ESDA/JEDEC JS-001 and how these should be updated within the document.

ANSI/ESD SP5.1.3 was also reviewed with some minor edits.

The WG focused on review of TAS comments on the JS-001 “Human Body Model (HBM) – Component Level” document.  All comments were adjudicated except for the definitions of VW, V1V2 and a Note on Figure 4.  These items will be reviewed in subsequent conference calls or face to face meetings.

WG is also working on changes to the JTR-001 HBM Users Guide and WIP5.1.4 Random Sampling of Power Pins.  Additionally, they will be looking at possible changes to SP5.1.3 A Method for Randomly Selecting Pin Pairs, which is up for its 5-year review.

The joint committee adjudicated TAS comments on the five year review revisions of ANSI/ESDA/JEDEC JS-001. The group discussed wafer level testing and the status of an update to the user guide technical report.

The joint committee adjudicated TAS comments on ESDA/JEDEC JWIP-001-2021. Additional updates will be made to ESDA/JEDEC JTR-001 – User Guide.

The joint committee reviewed the ongoing revisions to ESDA/JEDEC JTR-001 – User Guide. This next revision will be a companion document to ANSI/ESDA/JEDEC JS-001. Current revisions to ANSI/ESDA/JEDEC JS-001 during the five-year review will be sent for TAS review before the June meeting series. There was a discussion on “delay between pulses”.

Summary of meeting activities: 

The joint committee adjudicated WG comments on the five-year review of ANSI/ESDA/JEDEC JS-001.