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I have a floor that complies with IEC 61340-5-1 and ANSI/ESD S20.20, and buy footwear that also complies, so that’s sorted then? Well, not really. It’s a good starting point, but…

Using Accessible Math and Computer Tools to Solve Heat Flow ProblemsOne early contributor to semiconductor ESD research was Jack Smith of Lockheed, who was fond of stating that all ESD…

Charged Device Model (CDM) discharge events are the major root cause for Electrostatic Discharge (ESD) failures in a modern, automated production and test environment. The CDM stress testing is well…

By Michael J. McCarthy Staff Reporter of The Wall Street Journal Published July 24, 1996 https://www.wsj.com/articles/SB838158289179103000 This may come as a bit of a shock, but static electricity is a hair-raising problem. In…

Ok, let’s start with the basics. What is latch-up, and why do designers care about it?In today’s tightly packed layouts, most integrated circuits (ICs) end up with parasitic bipolar transistors…

Roughly a decade ago, starting at 22nm technology nodes, the transistor architecture changed from planar to FinFET [1-3]. Bulk FinFET (FF) which is a multi-gate transistor built on Si substrate…