Newsroom Enjoy the latest news from EOS/ESD Association, Inc.!
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Updated Trends in Charge Device Model (CDM)
Charged device events are by far the leading cause of electrostatic discharge (ESD) damage in modern electronics manufacturing facilities. If an integrated circuit contacts a conducting surface at a different…
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Challenges of Designing System-level ESD Protection at the IC Level, Part 2
Conducting System-level ESD CurrentA previous article (Challenges of Designing System-Level ESD Protection at the IC Level: Misconceptions Regarding Current Flow to the IC [1]) highlighted the challenges an IC designer…
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ESD Challenges in 2.5D/3D Integration
Introduction2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package. Back in the 1990s…
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A Look Into Generator Waveforms: Do They Meet the IEC 61000-4-2 Waveform Specification?
This article explores the waveform specifications called out in the IEC 61000-4-2 standard [1]. Verifying that a generator meets this specification requires specific equipment and conversion equations. The setup, data…
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EOS/ESD Association, Inc. Works with Local Area Schools on STEM Education Activities & Technology Certification
January 19, 2023 Contact: Lisa Pimpinella, Executive Director, EOS/ESD Association, Inc. lpimpinella@esda.org, (315) 339-6937 ROME, NY – EOS/ESD Association, Inc. (ESDA) recently announced that it is offering STEM Education activities and Technology…
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EOS/ESD Association, Inc. supports the Philip S. McDonald Police Benevolent Association, Inc.
January 12, 2023 Contact: Lisa Pimpinella, Executive Director, EOS/ESD Association, Inc. lpimpinella@esda.org, (315) 339-6937 PHOTO: From left to right: EOS/ESD Association, Inc. Program Manager Alison Swartz, Executive Director Lisa Pimpinella, and Rome…
