EOS/ESD Association, Inc. is served by many volunteers who offer their expertise and dedication.

Here is a list of current volunteers and the committees/groups on which they serve.

A

  • Agha Jahanzeb, Apple, Cupertino, CA

    WG 25

  • Akram Salman, Texas Instruments, Dallas, TX

    Technical Program Committee, IEW Committee

  • Alain Kamdem, Caen, France

    WG 23

  • Alain Salles, Freescale Semiconductor, Toulouse, France

    WG 26

  • Alan Glaser

    WG 22

  • Alan Righter, Analog Devices, Wilmington, MA

    JWG (HBM), WG 5.2, JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 23, WG 25, ESDA Board of Directors, Executive Committee, STDCOM, Advanced Topics

  • Albert Wang, University of California Riverside, Riverside, CA

    On-Campus Committee

  • Alessio Griffoni, Osram, Treviso, Italy

    Advanced Topics

  • Andrea Boroni, STMicroelectronics, Agrate Brianza, Italy

    JWG (HBM), WG 23, WG 27

  • Andy Noiret, Micronas GmbH, Freiburg im Breisgau, Germany

    WG 22

  • Anirudh Oberoi, Silicon Laboratories, Inc., Singapore

    Technical Program Committee

  • Ankit Srivastava, Qualcomm, San Diego, CA

    Technical Program Committee

  • Ann Concannon, Texas Instruments, Santa Clara, CA

    WG 22, Steering Committee

  • Arnie Steinman, Electronics Workshop, Berkeley, CA

    WG 3, WG 10, WG 17, WG 21, STDCOM

  • Augusto Tazzoli, Maxim Integrated Products, San Jose, CA

    Technical Program Committee, On-Campus Committee

B

  • Bart Keppens, SOFICS, Gistel, Belgium

    WG 22, IEW Committee, Marketing and Communications

  • Benjamin Orr, Missouri University of Science and Technology, Rolla, MO

    WG 14, WG 26

  • Benjamin Van Camp, SOFICS BVBA, Aalter, Belgium

    WG 22, WG 26

  • Bill Reynolds, IBM, Essex Junction, VT

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG14

  • Bob Ross, Compass Concepts, Inc., San Francisco, CA

    WG 26

  • Bob Vermillion, RMV Technology Group LLC, Moffett Field, CA

    WG 2, WG 3, WG 4, WG 11, WG 13, WG 15, WG 19, STDCOM, Nominations

  • Brett Carn, Intel, Hillsboro, OR

    JWG (HBM), JWG (CDM), WG 5.4, WG 15, WG 23, WG 25, WG 27, Standards Committee, Technical and Advisory Support Committee, Board of Directors, Education Council, Standards Business Unit Manager, Education

  • Bruno Guidotti, Forbo Flooring, Giubiasco, Switzerland

    WG 97

  • Byongsu Seol, Samsung Electronics, Suwon, South Korea

    WG 21, WG 23, Asia Factory Symposium

C

  • Chanhee Jeon, Samsung, Gyeonggi-Do, South Korea

    WG 22

  • Charles Chu, Maxim Integrated, San Jose, CA

    WG22

  • Charvaka Duvvury, ESD Consulting, LLC, Plano, TX

    WG 25, Board of Directors, Volunteer development and Initiatives, IEW Committee, Advanced Topics, Academia Committee, Education, Technical Program Committee, Awards, Nominations, Marketing and Communications, Publications

  • Chau-Neng (Michael) Wu, TSMC, San Jose, CA

    WG 22

  • Cheryl Checketts, General Dynamics, Scottsdale, AZ

    WG 1, WG 13, WG 53, Standards Committee, ESDA Board of Directors, Education, Steering Committee, Nominations

  • Chloe Han, Core Insight, Seoul, South Korea

    Asia Factory Symposium

  • Chris Jones, Semtech Corporation, Camarillo, CA

    JWG (HBM), JWG (CDM), WG 23

  • Christian Marot, EADS

    WG 26

  • Christian Russ, Intel Mobile Communications, Munich, Germany

    Technical Program Committee

  • Christoph Thienel, Robert Bosch GmbH, Reutlingen, Germany

    WG 24

  • Christopher Almeras, Raytheon, McKinney, TX

    WG 19

  • Chuck McClain, Micron Technology, Inc., Boise ID

    WG, 4, WG 9, WG 10, WG 19, WG 97

  • Colleen Clancy, NRD LLC

    WG 3

  • Craig Zander, Transforming Technologies, Edina, MN

    WG 3, WG 4, WG 9, WG 11, WG 97, STDCOM

D

  • Dale Fuller, Seagate Technology, Longmont, CO

    Certification

  • Dale Parkin, Seagate Technology, Shakopee, MN

    WG 2, WG 3, WG 4, WG 9, WG 11, WG 17, WG 97, Membership and Volunteer Activities, STDCOM, Nominations

  • Dan Clement, ON Semiconductor, American Fork, UT

    WG 25

  • Dan O’Brien, UDRI, Wright-Patterson AFB, OH

    WG 4, WG 9, WG 19, WG 97

  • David Alveraz, Infineon Technologies, Munich, Germany

    WG 18

  • David Eppes, Advanced Micro Devices, Austin, TX

    JWG (HBM), JWG (CDM), WG 25, Technical Program Committee

  • David Girard, Honeywell, Clearwater FL

    WG 3, WG 4, WG 11, WG 13, WG 17, WG 19, WG 23, WG 53, TT20.20/625B, Standards Committee

  • David Johnsson, HPPI, Haar, Germany

    WG 26

  • David Kirk, Hologic, Newark, DE

    WG 21

  • David Klein, Synaptics, Austin, TX

    WG 26

  • David Pommerenke, Missouri University of Science and Technology, Rolla, MO

    WG 26, Technical Program Committee

  • David Rose, Semtech Corporation, Camarillo, CA

    WG 5.6, WG 14, WG 26

  • David Swenson, Affinity Static Control Consulting, LLC, Round Rock, TX

    WG 2, WG 3, WG 11, WG 17, ESDA Board of Directors, Marketing & Communications, Education, STDCOM, Technical Advisory and Support Committee, Technical Program Committee, Awards, Nominations

  • David Tremouilles, LAAS/CNRS, Toulouse, France

    WG 22

  • Dietmar Walther, Texas Instruments

    WG 26

  • Dimitri Linten, imec, Leuven, Belgium

    IEW Committee, Advanced Topics, Academia Committee

  • Dionyz Pogany, Vienna University, Vienna, Austria

    IEW Committee

  • Dolphin Abessolo-Bidzo, NXP Semiconductors, Nijmegen, Netherlands

    Technical Program Committee

  • Dong-Sun Kim, LG Display, Gyeonggi-do, South Korea

    WG 21, WG 23, Asia Factory Symposium

  • Donn Bellmore, Binghamton, NY

    Voluenteer Initiatives and Development 

  • Doug Holtz, CCI, New Hope, MN

    WG 11

E

  • Efraim Aharoni, Tower Semiconductor, Inc., Migdal Haemek,Israel

    WG 22, Technical Program Committee

  • Eleonora Gevinti, STMicroelectronics, Agrate Brianza, Italy

    WG 18, Technical Program Committee, IEW Committee

  • Elly Koo, Core Insight, Seoul, South Korea

    Asia Factory Symposium

  • Elyse Rosenbaum, University of Illinois at Urbana-Champaign, Urbana, IL

    WG 26, Technical Program Committee, Academia Committee

  • Evan Grund, Grund Technical Solutions, Inc., San Jose, CA

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, Statistical Analysis Committee, STDCOM, Technical and Advisory Support Committee, Technical Program Committee, Nominations

F

  • Fabrice Blanc, ARM, Grenoble, France

    WG 18, WG 22, Technical Program Committee, IEW Committee

  • Fabrice Caignet, LAAS/CNRS, Toulouse, France

    WG 14, WG 26, IEW Committee, Technical Program Committee

  • Farzan Farbiz, Texas Instruments, Dallas, TX

    WG 5.5, WG 18, Technical Program Committee, IEW Committee

  • Filippo Magrini, Infineon Technologies AG, Neubiberg, Germany

    WG 22

  • Frank Rodriguez, 3M, Austin, TX

    WG 4, WG 9, WG 11, WG 97

  • Fred Bahrenburg, Dell, Austin, TX

    WG 26

G

  • Geert Hellings, imec, Heverlee, Belgium

    Technical Program Committee

  • Gene Monroe, NASA-LARC, Hampton, VA

    WG 2, WG 3, WG 4, WG 9, WG 11, WG 13, WG 14, WG 15, WG 19, WG 23, WG 97, STDCOM

  • Gene Worley, Qualcomm Inc., Irvine, CA

    Technical Program Committee

  • Gheorghe Rugila, Lexmark, Inc., Lexington, KY

    WG 4, WG 9, WG 97

  • Gianluca Boselli, Texas Instruments, Inc., Dallas, TX

    Board of Directors, Education, Marketing and Communication, Steering Committee, On-Campus Committee, Technical Program Committee, President Emeritus

  • Ginger Hansel, Dangelmayer Associates LLC, Austin, TX

    ESDA Board of Directors, EXCOM, Membership and Volunteer Activities, Steering Committee, Education, Marketing & Communications, Education Council

  • Greg Rice, ON Semiconductor

    WG 26

  • Gregory Manning, ARES Technical Services, Greenbelt, MD

    WG 3, WG 4, WG 9, WG 11, WG 13, WG 15, WG 19, WG 53, WG 97, STDCOM

  • Guido Notermans, NXP Semiconductors, Hamburg, Germany

    WG 26, Steering Committee, Technical Program Committee

H

  • Hafez Khamaisy, Tower Semiconductor, Migdal Haemek, Israel

    WG 26

  • Han-Gu Kim, Samsung, Gyeonggi-do, South Korea

    Asia Factory Symposium

  • Hans Kunz, Texas Instruments, Dallas, TX

    WG 23, WG 24, Technical Program Committee

  • Harald Gossner, Infineon Technologies, Neubiberg, Germany

    WG 14, WG 18, WG 22, WG 26, Board of Directors, Technical Program Committee, IEW Committee, Steering Committee, Marketing & Communications, Advanced Topics, Manufacturing Symposium, Academia Committee, On-Campus Committee, Director of Events, Vice President, Marketing and Steering, Marketing Business Unit Manager, Awards, Advanced Topics

  • Heinrich Wolf, Fraunhofer IZM, Munich, Germany

    Technical Program Committee

  • Hoang Nguyen, Maxim Integrated, Dallas, TX

    WG 26

  • Horst Gieser, Fraunhofer EMFT, Munich, Germany

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14

  • Howard Tang, UMC, Hsinchu, Taiwan

    IEW Committee

  • Huan Li, JDSU, Ottawa, Canada

    WG 3, WG 4, WG 9, WG 15, WG 97

J

  • Jam-Wem Lee, TSMC, Hsinchu, Taiwan

    Technical Program Committee

  • Javier Salcedo, Analog Devices, Wilmington, MA

    Technical Program Committee, IEW Committee

  • Javier Salcedo, Analog Devices, Wilmington, MA

    Technical Program Committee, IEW Committee

  • Jay Skolnik, Skolnik Technical Training, Albuquerque, NM

    Education

  • Jean Luc Lefebvre, Presto-Engineering,

    WG 23, WG 24

  • Jean-Luc Levant, Atmel

    WG 26

  • Jean-Philippe Laine, Freescale, Toulouse, France

    Technical Program Committee

  • Jeff Dunnihoo, Pragma Design, Bertram, TX

    WG 14, WG 22, WG 25, WG 26, Technical Advisory and Support Committee, Certification

  • Jeff Salisbury, Finisar Corporation, Allen, TX

    WG 10, WG 11, WG 53, STDCOM

  • Jeremy Smallwood, Electrostatic Solutions, Hampshire, United Kingdom

    Technical Program Committee

  • Jim Evevsky, Ortho Clinical Diagnostics, Webster, NY

    Education

  • Jim Miller, Freescale Semiconductor, Austin, TX

    Steering Committee, IEW Committee

  • Jim Vinson, Intersil, Palm Bay, FL

    WG 22, IEW Committee

  • Jinseop Shin, Magna Chip

    WG 22

  • Joel Dobson, Texas Instruments, Dallas, TX

    Statistical Analysis Committee

  • John Anderson, NASA – Dryden Flight Research Center, Edwards, CA 

    WG 19, WG 23

  • John Kinnear, IBM, Poughkeepsie, NY

    WG 17, WG 19, WG 23, WG 53, ESDA Board of Directors, EXCOM, STDCOM, Education, Technical Advisory and Support Committee, Technical Program Committee, Awards, Nominations, Asia Factory Symposium, Facility Certification

  • John Ren, IBM, Essex Junction, VT

    WG 25

  • Jon Barth, Barth Electronics, Inc., Boulder, NV

    JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25

  • Jonathan Brodsky, Texas Instruments

    WG 26

  • Joost Willemen, Infineon Technologies, Neubiberg, Germany

    IEW Committee

  • Jordan Davis, Samsung, Phoenix, AZ

    WG 26

  • Josh Morris, Intel, Beaverton, OR

    JWG (HBM)

  • Joshua Yoo, Core Insight, Inc. Gyeonggi-do, South Korea

    WG 3, WG 17, WG 21, Education, Marketing & Communications, Technical Program Committee, Asia Factory Symposium, On-Campus Committee

  • Julius Turangan, Ovation Inc., Livermore, CA

    WG 2, WG 3, WG10, WG 11, WG 13, STDCOM

  • JunJun Li, Apple, Cupertino, CA

    Technical Program Committee, Steering Committee

K

  • Kai Esmark

    Technical Program Committee

  • Karen Yi, Lockheed Martin, Sunnyvale, CA

    WG 19

  • Karim Thomas Kaschani, Texas Instruments, Freising, Germany

    WG 23, WG 24

  • Keiichi Hasegawa, Hanwa Electronic Ind. Co., Ltd., Wakayama City, Japan

    WG 5.6

  • Keith Peterson, Missile Defense Agency, Fort Belvoir, VA

    WG 4, WG 13, WG 19

  • Keong Kam, Apple, Cupertino, CA

    WG 26

  • Kevin Duncan, Seagate Technology, Bloomington, MN

    WG 3, WG 4, WG 9, WG 11, WG 97, STDCOM

  • Kitae Lee, Samsung, Gyeonggi-do, South Korea

    Technical Program Committee

  • Krzysztof Domanski

    WG 18

  • Kurt Edwards, Lubrizol Conductive Polymers, Chino Hills, CA

    WG 1, WG 11, WG 13, Standards Committee

  • Kyongjin Hwang, Magna Chip, Cheongju-si, South Korea

    WG 22

L

  • Larry Johnson, San Jose, CA

    WG 25

  • Larry Williams, ANSYS

    WG 26

  • Leo G. Henry, ESD & TLP Consultants, Freemont, CA

    President Emeritus, JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 23, WG 24, WG 25, WG 26,  Education, Marketing & Communications, STDCOM, Technical and Advisory Support Committee, Nominations, Advanced Topics, On-Campus Committee

  • Leo Luquette, Colorado Springs, CO

    WG 25

  • Leonardo Di Biccari, STMicroelectronics, Agrate Brianza, Italy

    WG 25, Technical Program Committee, WG 26

  • Lorenzo Cerati, STMicroelectronics, Agrate Brianza, Italy

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25, Board of Directors, Steering Committee, IEW Committee, Advanced Topics, Technical Advisory and Support Committee, Technical Program Committee

M

  • Manjunatha Prabhu, GLOBALFOUNDRIES, Malta, NY

    WG 22

  • Marcel Dekker, MASER Engineering BV, Enschede, The Netherlands

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 25

  • Marcos Hernandez, Thermo Fisher Scientific, San Jose, CA

    JWG (CDM), WG 25

  • Marcus Koh, Everfeed Technology Pte., Ltd., Singapore

    Education, Asia Factory Symposium

  • Mariano Dissegna, Texas Instruments

    Technical Program Committee

  • Mark Schneider, The Specialty Lab, Inc., Roseville, MN

    WG 26

  • Markus Mergens, Infineon Technologies, Neubiberg, Germany

    Technical Program Committee, IEW Committee

  • Mart Coenen, EMCMCC

    JWG CDM, WG 5.5, WG, 5.6, WG 14, WG 26

  • Marty Johnson, Texas Instruments, Santa Clara, CA

    JWG (HBM), JWG (CDM), WG 25

  • MaryKay Botkins

    WG 4, WG 53

  • Masonori Sawada, Hanwa Electric Ind. Co., Ltd., Wakayama, Japan

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 14

  • Matt Strickland, L-3 Communications, San Diego, CA,

    WG 3, WG 15, WG 19, WG 23, WG 53, STDCOM, Education

  • Matthew Hogan, Mentor Graphics

    WG 18, WG 22, WG 26, ESDA Board of Directors, Membership and Volunteer Activities Business Unit Manager, Technical Program Committee, IEW Committee

  • Mayank Shrivastava, Indian Institute of Science, Bangalore, India

    Technical Program Committee

  • Meghan Hodge, Desco Industries, Inc., Austin, TX

    WG 4, WG 9, WG 11, WG 97

  • Melanie Etherton, Freescale Semiconductor, Austin, TX

    Technical Program Committee

  • Melissa Feeney-Jolliff, Aerospace Corporation, Hawthorne, CA

    WG 1, WG 19, WG 23, Standards Committee, Education

  • Michael Khazhinsky, Silicon Laboratories, Inc., Austin, TX

    WG 18, WG 22, WG 26,  ESDA Board of Directors, Marketing and Communications, Technical Program Committee, IEW Committee, Advanced Topics

  • Michael Laube

    WG 22

  • Michael Mayerhofer, Infineon Technologies AG, Neubiberg, Germany

    WG 22, IEW Committee

  • Michael Stevens, Freescale Semiconductor, Tempe, AZ

    JWG (HBM), WG 25

  • Michael Stockinger, Freescale Semiconductor

    Technical Program Committee, IEW Committee, Advanced Topics

  • Mike Chaine, Micron Technology, Inc., Boise, ID

    Technical Program Committee

  • Mike Hopkins, Hopkins Technical, Hollis, NH

    WG 5.6, WG 14, STDCOM

  • Ming Dou Ker, National Chiao-Tung University, Hsinchu-City, Taiwan

    Technical Program Committee, On-Campus Committee

  • Mirko Scholz, imec, Leuven, Belgium

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.6, WG 26, IEW Committee, On-Campus Committee, Advanced Topics

  • Motosugu Okushima, Renesas Electronics, Kawasaki, Japan

    Technical Program Committee

  • Muhammad Mujahid, IBM, Essex Junction, VT

    WG 18

  • Myungju Yoon

    Asia Factory Symposium

N

  • Nate Ashworth, Julie Industries, Andover, MA

    WG 4, WG 19, WG 53

  • Nathaniel Jack, Intel, Hillsboro, OR

    JWG (CDM), Technical Program Committee, IEW Committee

  • Nathaniel Peachey, Qorvo, Greensboro, NC

    JWG (HBM), JWG (CDM), WG 5.4, WG 23, WG 26, Statistical Analysis Committee, ESDA Board of Directors, STDCOM, Technical Advisory and Support Committee, Technical Program Committee, Advanced Topics, Academia Committee Standards Business Unit Manager

  • Nicholas Lycoudes, Freescale Semiconductors, Tempe, AZ

    JWG (HBM), JWG (CDM)

  • Nicholas Thomson, University of Illinois at Urbana-Champaign, Urbana, IL

    WG 26

  • Nitesh Trivedi, Infineon Bangalore

    WG 18, Technical Program Committee

  • Norman Chang, Apache Design, an ANSYS Subsidiary, San Jose, CA

    WG 18, WG 22

P

  • Pasi Tamminen, Microsoft, Tampere, Finland

    WG 25, WG 26, Technical Program Committee

  • Patrice Besse, Freescale Semiconductors, Toulouse, France

    WG 26, IEW Committee

  • Paul Ngan, Phillips Semiconductors, Sunnyvale, CA

    JWG (HBM), JWG (CDM), WG 25

  • Paul Phillips, Phasix ESD, Hampshire, United Kingdom

    JWG (HBM), JWG (CDM), WG 5.5, WG 5.6, WG 14

  • Paul Zhou, Analog Devices, Inc.

    WG 22

  • Peter De Jong, Synopsys, Oosterbeek, Netherlands

    WG 22

  • Ping Chiang Lu

    WG 22

R

  • Rahul Mishra, IBM, Essex Junction, VT

    Technical Program Committee

  • Raivo Leeto, Sandia National Laboratories, Albuquerque, NM

    Steering Committee

  • Reinhold Gaertner, Infineon Technologies, Neubiberg, Germany

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 11, WG 14, WG 17, WG 23, WG 25, Board of Directors, Education, Marketing and Steering, Technical and Advisory Support Committee, Awards, Manufacturing Symposium

  • Robert Ashton, ON Semiconductor, Phoenix, AZ

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 23, WG 25, WG 26, Technical Program Committee, Communications and Publications Committee

  • Robert Gauthier, IBM, Essex Junction, VT

    Technical Program Committee, Board of Directors

  • Robert Mason, Semtech, Ontario, Canada

    WG 5.6, WG 14

  • Robert Mertens, University of Illinois, Urbana, Illinois

    WG 26

  • Robert Steinfeld, Apple, Cupertino, CA

    WG 26

  • Ron Gibson, Advanced Static Control Consulting

    Certification

  • Rosario Consiglio, Impulse Semiconductor, San Jose, CA

    WG 22

S

  • Scott Ruth, Freescale Semiconductor, Austin, TX

    IEW Committee, Technical Program Committee, Advanced Topics

  • Scott Ward, Texas Instruments, Dallas, TX

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 10, WG 11, WG 14, WG 15, WG 17, WG 23, WG 25, ESDA Board of Directors, STDCOM, Technical Advisory and Support Committee, Education, Marketing & Communications

  • Seungwood Lee, Corning, Corning, NY

    WG 21

  • Shih-Hung Chen, imec

    Technical Program Committee, IEW Committee

  • Soung Ho (Robert) Myoung, Ansys, San Jose, CA

    WG 21, WG 26

  • Souvick Mitra, IBM, Essex Junction, VT

    Technical Program Committee, IEW Committee

  • Stan Weitz, Electro-Tech Systems, Inc., Glenside, PA

    WG 11

  • Stephen Fairbanks, SRF Technologies, LLC

    Technical Program Committee

  • Stevan Hunter, Pocatello, ID

    Education

  • Steve Gerken

    Certification

  • Steve Voldman, Steven H. Voldman, LLC, Lake Placid, NY

    JWG (HBM), WG 5.4, WG 5.5, WG 5.6, WG 14, Membership and Volunteer Activities, Education, IEW Committee, On-Campus Committee

  • Subhash Rustagi, Silterra

    WG 22

T

  • Takayoshi Ohtsu, Suzuka National College of Technology, Suzuka, Japan

    On-Campus Committee

  • Ted Dangelmayer, Dangelmayer Associates, Annisquam, MA

    Education, Marketing and Communications, Publications

  • Terry Welsher, Dangelmayer Associates, Suwanee, GA

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 17, WG 21, WG 23, WG 24, WG 25 ESDA Board of Directors, Executive Committee, Education, Membership and Volunteer Activities, Marketing & Communications, STDCOM, Technical Advisory and Support Committee, Awards, Education Council, Advanced Topics, Academia Committee

  • Teruo Suzuki, Socionext, Inc., Tokyo, Japan

    WG 22

  • Theo Smedes, NXP Semiconductors, Nijmegen, The Netherlands

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 22, WG 25, WG 26, Steering Committee, Technical Program Committee, IEW Committee

  • Thomas Albano, ITT Space Systems Division, Rochester, NY

    WG 19, STDCOM

  • Thomas Miller, Pace Worldwide, Annapolis Junction, MD

    WG 13

  • Tim Iben, IBM, Santa Clara, CA

    Academia Committee

  • Tim Jarrett, Boston Scientific Corporation, Arden Hills, MN

    Nominations

  • Tim Maloney, Intel Corporation, Santa Clara, CA

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 14, WG 25, WG 26, Awards, IEW Committee, Nominations, Academia Committee

  • Tim Prass, Raytheon Technical Services, Escondido, CA

    WG 4, WG 11, WG 13, WG 15, WG 19, WG 53, Statistical Analysis Committee, STDCOM, Nominations

  • Tom D’Agostino, Tera Speed

    WG 26

  • Tom Meuse, Thermo Fisher Scientific, Lowell, MA

    JWG (HBM), JWG (CDM) WG 5.4, WG 5.5, WG 5.6, WG 14, WG 23, WG 25, WG 26, STDCOM

  • Tom Pelc, Oracle, Newark, CA

    WG 17, WG 53

  • Tom Ricciardelli, SelecTech, Inc., Avon MA

    WG 19

  • Toni Viheriakoski, Cascade Metrology, Lohja, Finland

    WG 25

  • Troy Anthony, Electro-Tech Systems, Glenside, PA

    JWG HBM, JWG CDM

V

  • Vaughn Gross, Green Mountain ESD Labs, Inc., St. Albans, VT

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 19, WG 23, WG 25, Standards Committee

  • Vesselin Vassilev, Novorell Technologies, Dallas, TX

    WG 18, Education, Advanced Topics, Academia Committee

  • Vladimir Kraz, OnFILTER, Santa Cruz, CA

    WG 3, WG 10, WG 17, WG 23, WG 24, Technical Program Committee

  • Vladislav Vashchenko, Maxim Integrated Products, Palo Alto, CA

    WG 22, Technical Program Committee, IEW Committee

W

  • Weng Hong Lai, SIMTech

    On-Campus Committee

  • Wolfgang Reinprecht, Austriamicrosystems AG, Unterpremstatten, Austria

    WG 14, WG 22, IEW Committee

  • Wolfgang Stadler, Intel Mobile Communications, Munich, Germany

    JWG (HBM), JWG (CDM), WG 5.4, WG 5.5, WG 5.6, WG 14, WG 17, WG 23, WG 25, ESDA Board of Directors, STDCOM, Technical Advisory and Support Committee, Education Council, Advanced Topics, Education, Technical Program Committee, IEW Committee

Y

  • Yang Xiu, University of Illinois at Urbana-Champaign, Urbana, IL

    WG 26

  • Yen-Yi Lin, Diodes, Inc., Plano, TX

    WG 26

  • Yiqun Cao, Infineon Technologies, Neubiberg, Germany

    Technical Program Committee, IEW Committee

  • Yorgos Christoforou, Arnhem, Netherlands

    WG 23

  • You Li, IBM, Essex Junction, VT

    Technical Program Committee

Z

  • Zhi Wei Liu, UESTC

    On-Campus Committee

  • Zhong Chen, University of Arkansas

    Technical Program Committee