Newsroom Enjoy the latest news from EOS/ESD Association, Inc.!
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Small Form Factor CDM Testing: Part 1
Problems with FICDM Testing for Small Form Factor and Interface Die ANSI/ESDA/JEDEC JS-002 [1] specifies how to test and qualify a product for a factory CDM event. The document is intended…
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Can Mechanical Movements on FI‑CDM Tester Cause Additional Zap During CDM Stress?
This investigation is the first to examine how mechanical movements impact CDM stress, revealing that such movements add stress to the Device Under Test—a finding relevant for Field‑Induced CDM testers…
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On-Chip ESD Protection for Multi‑Gbps Automotive Applications
The increasing demand for advanced driver assistance systems (ADAS) in road vehicles is fueling the development of high-speed automotive serial links. ADAS features such as adaptive cruise control, lane-keeping assistance,…
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In-situ ESD Current Sensing in a Pick-and-Place Machine
In the rapidly evolving semiconductor industry, the shift towards Multi-Chip Modules (MCM) and Systems in a Package (SiP) is notable. These advanced assemblies comprise multiple chiplets, sensors, and optoelectronic components,…
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Pragma Design, Inc. offers System-Level Solutions to the suite of EOS/ESD Services and LLC Services
PRESS RELEASE Pragma Design, Inc. offers System-Level Solutions to the suite of EOS/ESD Services and LLC Services August 7, 2025 Contact: Lisa Pimpinella, Sr. Executive Director, EOS/ESD Association, Inc. lpimpinella@esda.org, (315) 339-6937 ROME,…
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How TVS Properties and Printed Circuit Board Design Influence Peak Voltage and Residual Current At An IC For USB-C Superspeed Data Lines
How TVS Properties and Printed Circuit Board Design Influence Peak Voltage and Residual Current At An IC For USB-C Superspeed Data Lines Steffen Holland, Nima Lotfi, Martin Pilaski, Burkhard Laue, Stefan…
