EOS/ESD ASSOCIATION, INC. SEPT/OCT 2025 VOLUME 42, NO 5 THRESHOLD™ SETTING THE GLOBAL STANDARDS FOR STATIC CONTROL! 1 IN THIS ISSUE: Letter From The President - #2-3 Message From Our Senior Executive Director - #4-5 ESDA Events Schedule - #6-7 September Meeting Schedule #8-9 Symposium Newsletter #10-13 November Tech Talk #14 ESD External Article - #15-22 Connect With Us On LinkedIn - #23 Tech Questions - #24 Services/Advertisements - #25-27 Entertainment Center - #28-30 Would You Like To Publish Something in Threshold? - #31
THRESHOLD™ SEPT/OCT 2025 ACL Staticide 840 W. 49th Place, Chicago, IL 60609 Tel: 847-981-9212 Fax: 847-981-9278 info@aclstaticide.com • www.aclstaticide.com Manufacturer of anti-static topicals, dissipative coatings for plastic and floors, ESD workstation products including meters. ISO 9001:2008 certified QS CONTROLLED ENVIRONMENTS PO Box 779, Amherst, NH 03031 Tel:973-920-7000 Fax:603-672-3028 www.cemag.us web_ce@viconmedia.com Leading source of digital and print information on contamination prevention, detection, and control for cleanrooms and critical environments From the President EOS/ESD Association, Inc, President Nathaniel Peachey 2 Dear Friends of the ESDA, At the risk of stating what is obvious to anyone who has even a cursory knowledge of semiconductor technology, the leading edge of the technology is shifting from a total reliance on miniaturization of the transistor to include 3D heterogeneous integration and packaging technologies. In the last decade, it has been recognized that Moore’s Law can only continue its scaling prediction of doubling the number of transistors per unit area through 3D integration. This is being reflected in various roadmaps such as the International Roadmap for Devices and Systems (IRDS) More Moore and the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap. This is also true for the recently released ESD Technology Roadmap from the ESD Association. The result of this shift has been that cutting edge technology is no longer confined to EUV stepper tools and advanced technology development in multibillion-dollar fabs. Rather, it includes the development of die-to-die interface and bonding technology using increasingly dense hybrid bonds connecting chiplets into 3D modules. Particularly for large microprocessors and high bandwidth memories, 3D integration brings with it unique ESD challenges that are different from earlier technologies. Previously, the connection between circuit and product design to the assembly and packaging factory was the device level Human Body Model (HBM) and Charged Device Model (CDM) test requirements. Factories followed ANSI/ESD S20.20 in developing their ESD control programs and product design was responsible for designing the necessary on-chip ESD protection, typically 1000V HBM and 250V CDM. This allowed ESD control in factories as well as qualification of ESD materials to become rather siloed from ESD protection design and testing of circuits and application boards. Even the structure of the ESD Association reflected this in the division of “factory” and “device/design” standards, education, and certification programs. However, the ESD challenges of advanced 3D heterogeneous integration is driving a new paradigm. The Industry Council’s White Paper 2: Part II predicts that the sensitivity of hybrid bond interfaces will approach 3V CDM by 2030 or so. What drives the increased ESD sensitivity is that chiplets, particularly for large microcontrollers, may have thousands if not tens of thousands of hybrid bonds making it impossible to include specific ESD protection for each of these interface pins. Typically, these hybrid bonds are high-speed digital die-to-die connections which cannot tolerate the additional parasitic capacitance of even small ESD protection circuits. These reduced CDM tolerances will require much closer collaboration and cooperation between the packaging and assembly factory with design engineering to match factory capability with what tolerance is possible for circuit designers to include in chiplet design.
Transforming Technologies, LLC 3719 King Road, Toledo, OH 43617 Tel: 419-841-9552 • Fax: 419-841-3241 Email: info@transforming-technologies.com www.transforming-technologies.com Transforming Technologies provides unique and outstanding products to detect, protect, eliminate, and monitor electrostatic charges. IEST - Institute of Environmental Sciences and Technology 2340 S. Arlington Heights Road, Suite 100, Arlington Heights IL 60005 Tel: 847-981-0100 • Email: information@iest.com • www.iest.com As secretariat of ISO/TC 209, IEST offers ISO 14644 and ISO 14698 standards, as well as peer-approved standardized procedures, IEST Recommended Practices. 3 THRESHOLD™ SEPT/OCT 2025 Normally, the matching of factory ESD capability with ESD robustness of the part is done through ESD benchmark testing. The transient current level that a chiplet can tolerate must be balanced against the CDM voltage level that the factory is capable of protecting against. Unfortunately, there are no tests or standard test methods that can be used to quantify the ESD sensitivities of the hybrid bonds. These are both too small and too many to measure using methods currently in use. In practice, the factory process capability determines the peak current capability that designers must achieve in simulation when designing their circuits. The industry’s need for a standard method for testing micro-bumps or hybrid bonds at very fine pitches has become a focus for the ESD Association. We are addressing this on several levels. First, the work on testing bare dies is intended as a precursor to developing test methods for ESD testing of chiplets. As part of this effort, a CC-TLP round robin is being conducted. The follow-on to this round robin will be another such effort but using test vehicles with the low ESD sensitivities that are expected for chiplets used in 3D heterogeneous integration. The second effort will involve the ESDA directly in research and development efforts. Up until now, most advanced 3D integration and packaging have been done in house and so designers and packaging engineers have direct access to the factory and factory capability data. This is not expected to be the case moving forward. Chiplets designed by one company may be assembled into 3D modules by a different company. To facilitate this, there must be some test method to benchmark the ESD capability of chiplet micro-bumps or hybrid bonds so that an assembly process that provides high yields in high volume can be defined. The ESDA is joining SMART USA and the R&D effort to develop such a test method is part of a proposal that is being submitted to SMART USA. Part of this work is to fabricate chiplets that can be used as test vehicles for the development of a method for testing bare dies with micro-bumps. The intent is that this work will culminate in a standard test method for characterizing die-to-die micro-bumps. Finally, through the 3D heterogeneous integration task team, the ESDA is working to help coordinate work that is being done by various groups both in the US and Europe. As we continue to develop the mission of this task team, it is hoped that it will become both a clearinghouse for activities that various groups are engaged in and a way to highlight a call to action for what work remains to be done. Warm regards, Nate Nate Peachey President of EOS/ESD Association Inc.
4 Building Technical Communities When I think about what defines a strong technical community, it’s not just access to knowledge—it’s the spirit of connection, contribution, and continuity. Over my time as Executive Director, I’ve had the privilege of witnessing how powerful this community can be when we create space for people to engage meaningfully—with the technology, and with each other. We often talk about the importance of standards, training, and research in our industry. But none of those efforts happen in a vacuum. They happen because people show up—not just to learn, but to share their insights, ask questions, and build relationships. That’s how trust forms, how collaboration deepens, and how innovation grows. EOS/ESD Association , Inc., Sr. Executive Director Lisa Pimpinella From Our Senior Executive Director ESDEMC Technology, LLC 4000 Enterprise Dr., Suite 103, Rolla, MO 65401 Tel: 573-202-6411 • Fax: 877-641-9358 www.esdemc.com ESDEMC Technology designs, manufactures, and markets ESD/EMC related products and consulting services. Thermo Fisher Scientific Inc. 200 Research Drive, Wilmington, MA 01887 Tel: 978-275-0800 • Fax: 978-275-0850 www.thermoscientific.com Leading manufacturer of semiconductor test equipment for the simulation of Electro Static Discharge (ESD), Latch-up, and TLP events. THRESHOLD™ SEPT/OCT 2025 This past year, more than ever, I’ve been reminded that technical communities don’t just emerge organically—they’re nurtured, one opportunity at a time. The EOS/ESD Symposium: A Launchpad for Community One of the most vibrant examples of this nurturing happens every year at the EOS/ESD Symposium. What makes the Symposium unique isn’t just its technical rigor—it’s the openness with which knowledge is exchanged. The questions asked in workshops, the hallway conversations after presentations, the mentoring moments between senior engineers and first-time attendees—these are the heartbeats of community. This year, we’ve made a conscious effort to expand the ways people can engage at the Symposium: First-time participants can find accessible entry points through tutorials, committee meetups, and social mixers. Emerging professionals have a chance to present ideas, volunteer behind the scenes, or connect with mentors in our industry. Seasoned contributors are invited to deepen their leadership and guide new voices. If you’ve been thinking about getting more involved, this is your moment. The Symposium is not just a technical conference—it’s a living, breathing manifestation of our shared purpose. Investing in Infrastructure: Our New Environmental Control Lab While events like the Symposium bring our community together in powerful ways, having the right infrastructure to support hands-on exploration and standards development is just as critical.
5 RMV Technology Group, LLC, A NASA INDUSTRY PARTNER NASA Ames Research Center, Space Portal, Moffett Field, CA 94035 www.esdrmv.com and www.esdaerospacetraining.org Internationally Accredited ESD Product Qualification Laboratory The Exclusive iNARTE® Certified Space & Defense ESD Engineer Training Center 650-964-4792 or renee@esdrmv.com Proline 10 Avco Rd., Haverhill, MA 01835 Tel: 800-739-9067 Fax: 978-374-4885 www.1proline.com E-mail: Bench@1proline.com Manufactures ESD modular and ergonomic work benches THRESHOLD™ SEPT/OCT 2025 That’s why I’m especially proud to share that we’ve recently completed construction on our new environmental control lab space at our new office building, right across the street from our main headquarters. This lab has been designed not only with research and testing in mind, but with collaboration at its core. The space enables us to: Support industry partners and standards committees with controlled environmental testing capabilities. Provide a site for in-person training, experiments, and validation efforts. Offer a tangible way to engage with real-world applications of ESD mitigation technologies. We see this lab as more than a facility—it’s a tool for strengthening our technical ecosystem. This is a gathering point where projects partner with staff, and we explore new questions, ideas, and projects. Building Together: A Community by Design What I’ve learned—again and again—is that building technical communities requires intentionality. It requires us to look beyond the content of what we teach and ask: How are we supporting the people who show up to learn? How are we recognizing and empowering those who want to lead? How are we making it easier for more people to find a role that fits? At EOS/ESD Association, our job is not just to set the standards—it’s to be a platform for connection and contribution. That means: Keeping our doors open to volunteers, educators, and engineers at every stage of their careers. Making space for new voices in our committees and our leadership structures. Investing in tools, events, and facilities that allow all of us to bring our best work forward. As we look ahead, I invite you to think about your role in this ecosystem. Whether it’s presenting at the Symposium, testing ideas in our new lab, joining a technical working group, or mentoring the next generation —we need your voice, your experience, and your perspective. Let’s build this community together—with purpose, with care, and with the belief that what we create will outlast us. I mean it has to right? All the best, Lisa Lisa Pimpinella Sr. Executive Director, EOS/ESD Association, Inc.
6 Upcoming Events THRESHOLD™ SEPT/OCT 2025 Desco Industries Inc. 3651 Walnut Ave., Chino, CA 91710 www.Descoindustries.com • Tel: CA-909-627-8178• MA-781-321-8370 ESD Control Products & More. Our brands include: APR, Desco, Desco Asia, Desco Europe, EasyBraid, EMIT, ESDSystems.com, Menda, Protektive Pak, SCS, SpecialTeam, Statguard, TRONEX and US Toyo Fan. SelecTech, Inc. 33 Wales Ave, Suite F, Avon MA 02322 USA Ph: 508-583-3200 Fax: 877-738-4537 Email: info@selectechinc.com www.selectechinc.com Manufacturer of StaticStop interlocking flooring
7 Upcoming Events (Cont.) THRESHOLD™ SEPT/OCT 2025 Key Resin Co./Flowcrete 4050 Clough Woods Drive, Batavia, OH 45103 513-943-4225, Fax 513-943-4255 sales@keyresin.com www.keyresin.com Manufacturer of conductive and ESD resinous flooring and floor sealers. Key Resin West 1315 E. Gibson, Suite D., Phoenix, AZ 85034 602-523-9353, Fax 602-523-9349 SCS - Formerly 3M Static Control 914 JR Industrial Drive, Sanford, NC 27332 USA Ph: 919-718-0000 www.staticcontrol.com ESD control products: bags, floor tiles, foot grounders, ionizers, mats, testers & monitors, smocks, vacuums, wrist straps, Static Control Management and more.
8 September Meeting Schedule THRESHOLD™ SEPT/OCT 2025 Core Insight, Inc. 186 Galmachi-ro, Seongnam-city, Gyeonggi-do, 13230, Korea Phone: +82-31-750-9200. Email: sales@coreinsight.co.kr: www.coreinsight.co.kr Steady-State DC Ionizer Manufacturer for BenchTop, Overhead, Nozzle, Gun, Air Assist, and Ceiling Ionizers Molded Fiberglass Tray Co. 6175 US Highway 6, Linesville, PA 16424 USA Ph: +1-814-683-4500 Fx: +1-814-683-4504 www.mfgtray.com Manufactures fiberglass reinforced plastic Fiberstat ESD products; trays, bins, totes, and mats
September Meeting Schedule (Cont.) THRESHOLD™ SEPT/OCT 2025 Can’t make the meeting? Attend the September Virtual Standards Summary! 9 Join Zoom Meeting https://us02web.zoom.us/j/84560310933?pwd=TTiBItKBB3LqaEC5SW30PAQi8zl092.1 Meeting ID: 845 6031 0933 Passcode: 453083 HPPI GmbH Stadlerstrasse 6A, D-85540 Haar, Germany Phone: +49 (0)89 / 878 06 98 – 443; www.hppi.de Development and sales of ESD Testers Hanwa Electronic Ind. Co., Ltd. 689-3, Ogaito, Wakayama, Japan 649-6272 TEL:+81-73-477-4435 • FAX:+81-73-477-3445 keiichih@hanwa-ei.co.jp • www.hanwa-ei.co.jp Full Automatic Wafer Level ESD Tester / HBM, MM, HMM, and SCM ESD Tester, TLP Tester/ CDM Tester/ Electrostatic Imaging System
10 THRESHOLD™ SEPT/OCT 2025 47th Annual EOS/ESD Symposium: Advancing Electrostatic Knowledge and Innovation September 13–18, 2025 | Riverside Convention Center | Riverside, CA The EOS/ESD Association, Inc. invites professionals from around the globe to attend the 47th Annual EOS/ESD Symposium — the industry’s leading event focused on Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and the emerging challenges and innovations in electronic device reliability. Taking place at the Riverside Convention Center in Riverside, California, this year’s symposium promises a comprehensive blend of tutorials, technical sessions, hands-on training, and industry networking. A Week of In-Depth Learning and Certification Beginning on Saturday, September 13, the Symposium kicks off with a series of expert-led tutorials and certification programs designed to give attendees practical knowledge and actionable skills. Symposium Newsletter Highlighted Tutorials and Certifications Include: ESD Compliance Verification Technician to TR53®: This certification, taught by Charles McClain (Northwest ESD Services) and Andy Nold (Teradyne, Inc.), provides detailed training on compliance verification methods as outlined in ESD TR53® and prepares attendees to perform verification within their organizations. September 13–15 | 8:00 AM–5:00 PM Introduction to On-Chip ESD Protection: Led by Olivier Marichal (SOFICS), this full-day tutorial offers engineers insight into the fundamentals of electrostatic discharge events and effective on-chip protection strategies. Saturday, September 13 | 8:30 AM–4:30 PM EPA Compliance Certification: A focused session on ESD control program implementation in manufacturing environments, led by John Kinnear of EOS/ESD Association, Inc. Saturday, September 13 | 8:30 AM–10:00 AM Simco-Ion, Technology 1141 Harbor Bay Pkwy, Ste 201, Alameda, CA USA 94502 (800) 367-2452 (510) 217-0600 ioninfo@simco-ion.com www.simco-ion.com/technology Simco-Ion has been the world’s largest provider of solutions for static charge control for over 40 years. Products include ionizing bars, ionizing blowers, in-line ionizing products with balance control as low as ±1V, Novx real-time monitors and ESD event detection. BARTH ELECTRONICS, INC. 702.293.1576 Original Equipment Manufacturers of: CMT Generator, TLP+, VFTLP+, and HMM+ Test Systems Please see barthelectronics.com for more info on our products. 1589 Foothill Drive, Boulder City, NV USA 89005 beisales@barthelectronics.com Since 1964
11 ESD Flooring Systems: Learn about the design, installation, and performance validation of static control flooring systems. Saturday, September 1:30 PM–12:10 PM Grounding - Variations and Concepts (FC121): Jay Skolnik (Skolnik Technical Training) explores grounding strategies, standards, and troubleshooting practices. Saturday, September 13 | 1:00 PM–4:30PM THRESHOLD™ SEPT/OCT 2025 Troubleshooting ESD and Pulsed EMI Problems in Electronic Systems: Doug Smith (D.C. Smith Consultants) shares advanced diagnostics and design strategies for ESD sensitivity in electronics. Saturday, September 13 | 8:30 AM–4:30 PM Beyond Standard TLP – Better ESD Design With The Right Data Presented by Efraim Aharoni (Tower Semiconductor), this course guides participants through data requirements and design improvement strategies. Sunday, September 14 | 1:00 PM–4:30PM Introduction to Characterization of On‑Chip ESD Protection Wim Vanhouteghem (Senior ESD Design Engineer, SOFICS) addresses the methods for characterizing the electrostatic discharge (ESD) robustness of semiconductor circuits and protective structures. Sunday, September 14 | 1:00 PM–12:00 PM Practical Applications of Ionization (FC365) DavidE. Swenson (Owner, Affinity Static Control Consulting) dives into the physics and practical usage of ionization as a tool for static control across various industrial settings. Sunday, September 14 | 1:00 PM–4:30PM Electrical Fields and Particles — Practical Considerations for the Factory and Induction Charging (FC262) DavidE. Swenson ( (Owner, Affinity Static Control Consulting) offers a hands-on perspective on electrical field strength and particle behavior in manufacturing environments. Sunday, September 14 | 8:30 AM–12:00PM NRD, LLC 2937 Alternate Boulevard, Grand Island, NY 14702 716-733-7634, Fax 716-773-7744 sales@nrdllc.com www.nrdllc.com NRD, LLC is recognized as a global leader in the field of static elimination using non-electrical nuclear ionization. The company is dedicated to developing and manufacturing static control technologies including advanced solutions utilizing Alpha and Beta emitters that meets regulatory requirements of sealed source technology. PurePulse ESD - formally Grund Technical Solutions 393-J Tomkins Ct. Gilroy, CA 95020, USA Phone: +1-408-216-8364 x103 Email: sales@grundtech.com https://www.GrundTech.com Manufacturer of ESD Test equipment for devices and wafers including PurePulse 2-pin set-up for HBM, MM, TLP and VF-TLP. Titan for independent device HBM testing. Test House Services with true 2-pin ESD Verification.
12 THRESHOLD™ SEPT/OCT 2025 Technical Program and Featured Sessions From September 16 through September 18, attendees can participate in advanced sessions on key industry topics: Emerging Technologies and Device Testing Semiconductor Materials and Backside Interconnects System-Level ESD & EMI Co-Design GaN Device Reliability and ESD Failures Electrostatics in Manufacturing Environments Hands-on Engineering Demonstrations and Case Studies This year’s program includes papers, panel discussions, and hands-on opportunities to explore real-world applications of ESD protection and failure prevention. System Level ESD‑EMI Principles — Design, Troubleshooting, & Demonstrations (DD/FC240) Speaker Jay Skolnik (Skolnik Technical Training) emphasizes methods to mitigate system-level ESD effects on electronic systems (like boards and chassis) through both design and troubleshooting. Sunday, September 14 | 8:30–12:00 PM Fundamentals of ESD System Level (DD134) Kathleen (Kathy) Muhonen (ESD Engineer, Qorvo) presents an overview of system-level ESD vulnerabilities and corresponding testing standards—including IEC 61000‑4‑2, ISO 10605, and others. Sunday, September 14 | 1:00–4:30PM Exhibit Hall and Networking The Symposium will feature a robust Exhibit Hall where attendees can explore new ESD products and technologies, participate in guided tours, and watch live demonstrations from top vendors and innovators. Attendees are encouraged to network with industry peers and technical experts throughout the even Electrostatic Charging and Induction DavidE.Swenson (Owner, Affinity Static Control Consulting) offers a foundational overview of electrostatic charging processes and the mechanisms of induction charging—essential knowledge for safeguarding sensitive devices, materials, and environments (especially those with flammable atmospheres) from inadvertent electrostatic hazards. Sunday, September 14 | 10:30–12:00PM Botron Company, Inc. 21601 N. 21st Ave Phoenix, AZ 85027 Phone: (623) 582-6776 Fax: 623-582-6700. https://www.botron.com Industry-leading ESD compliance automation. Estatec LLC 8175 Saint Andrews Ave. San Diego, CA 92154 Phone: (619) 934-8759 https://usa.estatec.com/ casales@estatec.com
13 THRESHOLD™ SEPT/OCT 2025 Conclusion The EOS/ESD Symposium remains the industry’s most comprehensive platform for advancing ESD knowledge, building professional networks, and shaping the future of electronics reliability. We look forward to welcoming you to Riverside in September! To register, visit: https://esda.events Click to register Hotel Information: Book your hotel room online! Marriott Riverside at the Convention Center 3400 Market Street Riverside, California 92501 HOTEL INFORMATION: Book your hotel room online! Hyatt Place Riverside Downtown 3500 Market Street Riverside, CA 92501 Expert Consulting Available Limited one-hour consulting sessions with ESD experts are available during the event. These one-onone sessions are ideal for reviewing ESD Control Plans, solving design challenges, or exploring specific concerns. For pricing and availability, contact: info.eosesda@esda.org All are within walking distance of the event venue. HOTEL INFORMATION: Book your hotel room online! Mission Inn Hotel & Spa 3649 Mission Inn Avenue Riverside, California 92501 Hotel Accommodations Discounted hotel rates are available at three nearby locations: ERGOFORM, S.A. DE C.V. Av. Palmas Nte. 562, Bellavista 62140 Cuernavaca, Morelos, Mexico Phone: +52.777311.6970. Fax: +52.777.311.666 Email: info@ergoform.com.mx https://wwwergoform.com.mx ERGOFORM is the leading Industrial, Manufacturing and Technical chair ESD manufacturer for 34 years focusing on the endusers health and the erdonomics and durability of our products. WORK SURFACES CORPORATION 47 East Highland Ave.Unit B, Sierra Madre, CA 91024 Phone: +1.626.485.2555. Email: bp@worksurfaces.com https://worksurfaces.com/ We make solid brass ESD grounding systems for electronic workstations. We sell custom ESD equipment covers, wrist straps, ground cords, ect.
14 THRESHOLD™ SEPT/OCT 2025 Emerging Professionals: November Tech Talk Tech Talk: Mastering ESD Compliance: A Stepby-Step Guide to Crafting Your ESD Control Plan November 4, 2025 01:00 PM Eastern Time (US and Canada) Effectively managing electrostatic discharge (ESD) risk requires a robust and clearly articulated ESD Control Program. This Tech Talk walks you through the EOS/ESD Association's customizable ESD Control Plan Guidance document, offering step-by-step instructions to tailor each critical section to your organization's specific needs. Learn how to clearly define your ESD objectives, identify sensitivity thresholds, implement appropriate administrative and technical controls, and ensure compliance verification. Whether you're establishing a company-wide ESD program or a focused control plan for specific areas, this Tech Talk equips you with the tools and insights needed to confidently meet ANSI/ESD S20.20 requirements, protect sensitive electronic components, and maintain industry-leading ESD safety standards. Register online for this complimentary talk: https://www.esda.org/events/tech-talk-mastering-esdcompliance-a-step-by-step-guide-to-crafting-your-esd-control-plan/ Talk Tru Vue, Inc. 9400 W. 55th St. McCook, IL 60525, USA Phone: (740) 789-0623 Email: chanderson@tru-vue.com www.tru-vue.com Tru Vue is a leading manufacturer of ultra clear ESD-safe plastics, offering high-performance solutions. With over 80 years of expertise, Tru Vue provides advanced TRU-ESD™ acrylic and polycarbonate solutions for effective safety and contamination control. Staticworx Inc. Williston, Vermont, USA Phone: (617 ) 923-2000 https://staticworx.com StaticWorx high-performance static-control floors protect electronic components, explosives, and high-speed computers from damage caused by static electricity.
ESD Technical Article 15 THRESHOLD™ SEPT/OCT 2025 Spiderweb deformation induced by Electrostatically Charged insects Authors Victor Manuel Ortega-Jimenez & Robert Dudley Department of Integrative Biology, University of California, Berkeley, CA 94720 USA, Smithsonian Tropical Research Institute, P.O. Box 2072, Balboa, Republic of Panama. Capture success of spider webs has been associated with their microstructure, ornamentation, andwindinduced vibrations. Indirect evidence suggests that statically charged objects can attract silk thread, but web deformations induced by charged insects have not yet been described. Here, we show under laboratory conditions that electrostatically charged honeybees, green bottle flies, fruit flies, aphids, and also water drops falling near webs of cross-spiders (Araneus diadematus) induce rapid thread deformation that enhances the likelihood of physical contact, and thus of prey capture. The capture effectiveness of orb-weaver webs has been attributed to mechanical, hygroscopic, and adhesive characteristics of the constituent silk, as well as to architectural features ornamentation, and wind-induced distortions of the entire structure. Despite suggestions that web deformation can be induced by the human finger, that insects can be easily charged, and that foraging honeybees can acquire charge sufficient to detach pollen from flowers, the effects of electrical charge on spider orb webs are unknown. Here, we evaluated the deformation responses of spider webs as induced by statically charged insects and water drops. Results Video sequences of positively charged insects and water droplets falling towards a grounded orb web reveal rapid and substantial web attraction (Supplementary Movie S1 online). Radial and particularly spiral silk threads are quickly attracted to the electrified bodies. By contrast, control trials using uncharged insects (honeybees, N = 3, 15 trials; bottle flies, N =3, 11 trials; fruit flies, N = 4, 20 trials; aphids, N = 2, 6 trials) and drops (N = 10) show no such deformation (Supplementary Movie S2 online). It is important to note that 30% and 10% of charging experiments with insect bodies and water drops, respectively, yielded no evident web deformation but were nonetheless included in analyses. For these cases, video recordings indicated that either the distance between the falling body and the spiral thread was 2 body lengths (suggesting much reduced electrical attraction following the inverse square law) or because the body hit directly a radial thread with minimal extensibility (Supplementary Movie S3 online). REPORT SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108 EOS/ESD Association Services, LLC 218 W Court St Rome, NY 13440, USA Phone: +1.315.339.6937. Email: lpimpinella@esda.org https://www.esda.org/eosesd-association-services-llc/ ESD Control Program Plan Development assistance, Preassessment to ANSI/ESD S20.20, auditing, and more. BIMOS ESD Seating 1235 N. Clybourn, #349 Chicago, IL 60610 Phone: +1.630.205.9136 Email: us.support@bimos.com www.info.bimos.com BIMOS ESD Seating is the largest and best-in-class brand globally for chairs and stools to support ESD, technology, manufacturing, research and science workers, and much more. SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108
16 THRESHOLD™ SEPT/OCT 2025 Spiderweb deformation induced by Electrostatically Charged insects (CONT.) REPORT Maximum deformations of spiral silk threads from their resting positions ranged from about 1–2 mm, depending on the size of the charged test object (Table 1); length-normalized deformations ranged from about 0.2–0.7 (Table 1, Fig. 1). Average thread speeds during such movements were on the order of 0.7–1.9 m/s (see Table 1). Spiral threads contacted by a falling water drop could also acquire its positive charge, which resulted in electrical repulsion if an additional drop then fell immediately in its vicinity (Supplementary Movie S4 online). No significant differences were found in the magnitude of induced web deformation among individual honeybees (F 5 0.83, df 5 2,18, P 5 0.45), green bottle flies (F = 0.58, df 5=2,20, P = 0.57), fruit flies (F = 2.3, df = 3,28, P = 0.1), aphids (Wilcoxon’s rank-sum test W = 12.5, P = 0.62), and the two sizes of droplets (Wilcoxon’s rank-sum test W = 63.5, P = 0.57); (Supplementary Table S1 online). Voltages among individual insects were similar for each of the study species (honeybees: F = 0.23, df = 2,27, P = 0.8; green bottle flies: F = 3.05, df = 2,27, P = 0.06; fruit flies: F = 0.3, df = 2,12, P = 0.74) (Supplementary Table S2 online)(Table 1). However, voltage of large water drops was significantly higher than that of small drops (t38 = 7.2, P < 0.0001). Discussion Electrostatic forces have been previously proposed to play an important role in silk adhesion, although experimental evidence indicates that only non-electrostatic adhesive properties pertain to cribellar silk. Our experiments show clearly that positively charged insect bodies induce rapid attraction of silk threads in the webs of cross-spiders, indirectly supporting a prior hypothesis that static charges of insects increase the prey capture success of orb-webs. Your company could be here! Contact info.eosesda@esda.org to find out how to advertise your company in the Bi monthly Threshold. Your company could be here! Contact info.eosesda@esda.org to find out how to advertise your company in the Bi monthly Threshold. SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108
17 THRESHOLD™ SEPT/OCT 2025 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ Spiderweb deformation induced by Electrostatically Charged insects (CONT.) REPORT Risk of capture for a free-flying insect may correspondingly be enhanced given that the induced deformations observed here are comparable to the average mesh spacing for cross-spider webs (~2 mm). Observed deformations also suggest that greater charges and associated web displacements may characterize larger insects, and are more likely to induce deformation of multiple radial and spiral threads (Table 1). By contrast, length-normalized deformations suggest nondifferences among insects (Figure 2; see also Table 1 and supplementary Table S1 online). The greater charge typically accumulated on larger test insects (see Table 1) reflects its direct dependence on both electric potential (as induced here by the Van de Graaff generator) and their capacitance. Electrostatic charge acquired by insects in free flight will similarly reflect these factors, but charge will principally be acquired through interaction between the flapping wings and the surrounding air, along with particular atmospheric conditions that promote charge accumulation (e.g., lower relative humidity). The substantial variance in web deformation data (Table 1) likely reflects the effects of variable body position and orientation with respect to silk threads, as must characterize prey captured by spiderwebs in nature. Because electrostatic force varies with the inverse square of distance, substantial differences in thread deformation for charged objects passing through the web can be expected. Deformation data presented here, moreover, refer only to two-dimensional motions and will systematically underestimate total thread displacement. The extensibility of web spiral thread is higher than that for radial thread, and we observed qualitative differences in thread deformation according to the position of charged fruit flies falling relative to these two distinct web elements (Supplementary Movie S5 online). It is also well known that spiral threads of ecribel-late spiders are more extensible than those of cribellate species. Arecent computational study found that increased elasticity of spiralthreads reduces the energy absorption and dissipation of the entire web, but in contrast is mostly unchanged for individual spiral threads, despite reduction in strength. These results suggest that comparable capture effectiveness for spiral threads can be obtained with high elasticity and low strength (and that require lower energetic investment to produce). Accordingly, charged insects or small particles may elicit greater deformations from spiral threads of ecribellate taxa. SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108
218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ 18 THRESHOLD™ SEPT/OCT 2025 Insects can easily acquire electrostatic charge by walking over charged surfaces or by flying in an airstream of charged particles. Honeybee workers during wintertime conditions can acquire a positive charge of up to 537 pC, whereas honeybees those in non-winter weather can reach up to 200 pC, values comparable to those used here experimentally (Table 1). Positively charged bumblebees can even detect floral electric fields, which ability enhances their foraging success. Despite the well-recognized role of electrostatic charge in pollination, the charge magnitudes on insects in nature are largely unknown but are expected to be higher in low humidity and in dusty conditions. Spiderweb deformation induced by Electrostatically Charged insects (CONT.) REPORT Spider-orb webs are aerial traps specialized to catch flying insects of different sizes, and even occasionally birds. Mechanical properties of the web silk dissipate the kinetic energy and impulse acting to the web produced during insect impact. Figure 1 Normalized web deformation produced by statically charged insects and water drops. Black dots represent the average value of each sampled individual. Error bars represent 1 s.d. Figure 2 Web deformation produced by a charged honeybee (a), a fruitfly (b) and a water drop (c). Images are three sequential video frames filming speed: 1500 frames s 21). Bee, fruitfly and drop size are 12 mm, 3 mm and 1.5 mm, respectively. Image gamma was increased to 1.5. SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108
19 The stickiness and elasticity of ecribellate threads are mediated by their water coating, which has a ~80 times higher value for relative permittivity than air. Wet silk threads may thus be more easily polarized by an electrostatic field than are dry threads. In calm weather, air contains predominantly positive ions, in contrast to vegetation that is typically negatively charged. Although charges of spider webs under natural conditions have never been reported, accumulation of negative charge may result in even greater deformation in response to positively charged insects. Charge accumulation may also increase deposition rates of electrically charged particles floating in the air, such as pollen and fungal spores, which are actually consumed by juvenile cross-spiders. However, adverse dust deposition and associated web degradation may influence daily patterns of web reconstruction, to which end charge accumulation may be a previously unrecognized contributing factor. Charged rain drops may also induce web damage or adhesion of adjacent threads; field measurements during spring rainfalls indicate both positive and negative charges on rain with values of up to 100 pC. THRESHOLD™ SEPT/OCT 2025 Spiderweb deformation induced by Electrostatically Charged insects (CONT.) REPORT In conclusion, we have experimentally demonstrated that electrostatically charged insects and water drops can induce rapid and comparably sized deformations in threads of the cross-spider’s orb web. Such deformations likely increase the risk of capture for free-flying prey. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ Figure 3 Experimental configurations used in measurements. (a) vertical web deformation induced by charged honeybees and bottle flies; (b) lateral thread deformation of charged fruit flies, aphids, and water drops; (c) Wood frame used to fix the spider web during filming; (d) electrical charge of experimental objects; and (e) apparatus used for voltage measurements (capacitors are located behind the voltmeter). Note that the typical orientation of falling insects in (a) and (b) was not regularly aligned as indicated. SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108
20 THRESHOLD™ SEPT/OCT 2025 Spiderweb deformation induced by Electrostatically Charged insects (CONT.) REPORT 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ Methods Orb webs of the cross-spider (Araneus Diadematus), honeybees (Apis Mellifera), green bottle flies (Lucilia Sericata), fruit flies (Drosophila Melanogaster) and aphids (Aphidoidea) were collected on the UC-Berkeley campus. Each spiderweb was collected via superposition onto a trapezoidal frame of wooden sticks, with radial and framed threads then being wrapped further to stabilize the web. Freshly killed insects were positively charged for ~3 s using a portable Van de Graaff generator (Unitech Toys, Foster City, CA). We tested only positive charge because data for foraging honeybees indicate this condition for 90% of individuals. Insects were placed on a small section of aluminum foil (1.5 3 3 mm) connected to the copper tip of the charge generator. Water drops were generated using a syringe and needles of two intern diameters (small: 0.16 mm; large: 0.5 mm) and were charged by placing the needle in contact for ~3 s with the generator’s tip. Immediately after being charged, sampled individuals were dropped, from heights of 25–35 cm, onto a horizontally oriented orb web mounted on a grounded wooden frame. These heights correspond to vertical descent speeds of 2.2–2.6 m/s at the plane of the spider web. Neutrally charged insects and drops were also used in control experiments by placing them for ~3 s on a grounded aluminum sheet prior to dropping. Relative humidity ranged between 47% and 50%, and room temperature varied from 23–26u C during experiments. Voltage and charge measurements The sensor disk of a surface voltmeter (Model SVM2, AlphaLab Inc.) was electrically connected to three 1 pF capacitors connected in series and then to a small copper pail (Fig. 3). A grounded cylindrical Faraday cage (30 cm diameter x 45 cm) was used to surround the entire test apparatus. Prior to each measurement, the pail was grounded, and the voltmeter was reset. Immediately after the pail was disconnected from ground, a test insect or drop was positively charged above the cage and was then dropped into the pail, yielding a peak voltage measurement at the surface voltmeter. The total accumulated charge was then estimated by multiplying this measured voltage by the total capacitance of the serially connected voltmeter (3 nF) and the three 1 pF capacitors (Fig. 3) SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108
21 THRESHOLD™ SEPT/OCT 2025 Spiderweb deformation induced by Electrostatically Charged insects (CONT.) REPORT 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ Filming Free falls of charged and uncharged insects and drops were filmed at 1500–2000 frames/s (Phantom. v10, Vision Research, Wayne, NJ, USA; X-PRI, AOS Technologies AG, Baden Daettwil, Switzerland). Lateral recordings at the level of the spider web were performed for honeybees and bottle flies, and views from above were recorded for free falls of fruit flies, aphids and water drops. Web displacements were then recorded multiple times for each sampled insect (see Supplementary Table S1 for details). Video sequences were then digitized, using for scaling an absolute reference length recorded in the plane of view. Maximum vertical and lateral thread displacements (for lateral and vertical camera views, respectively), were then measured for each falling insect and water drop (see Fig. 3). For falling fruit flies, aphids, and water drops, lateral web displacements were made on two nearby spiral silk strands, which were assumed to be independent of one another. An average deformation speed was calculated by dividing total thread displacement by duration of measurement for those sequences characterized by obvious deformations. Statistics One-way ANOVA was used to test significant differences in web deformation and maximum voltages among individuals in the separate groups of honeybees, bottle flies, and fruit flies. Wilcoxon’s rank-sum test was used to test deformation differences among sampled aphids and water drop sizes. Students’ ttests were used to compare voltages between the two sizes of drops. References SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108 1. Kohler, T. & Vollrath, F. Thread biomechanics in the two orb-weaving spiders Araneus Diadematus (Araneae, Araneidae) and Uloboris Walckenaerius (Araneae, Uloboridae). J. Exp. Zool. 271, 1–17 (1995). 2. Cranford, S. W., Tarakanova, A., Pugno, N. M. & Buehler, M. J. Nonlinear material behavior of spider silk yields robust webs. Nature 482, 72–76 (2012). 3. Edmonds, D. & Vollrath, F. The contribution of atmospheric water vapor to the formation and efficiency of a spider’s capture web. Proc. Roy. Soc. London 248, 45–148 (1992). 4. Vollrath, F., Fairbrother, W. J., Williams, R. J. P., Tillinghast, E. K., Bernstein, D. T., Gallagher, K. S. & Townley, M. A. Compounds in the droplets of the orb spider’s viscid spiral. Nature 345, 526–528 (1990). 5. Lin, L. H., Edmonds, D. T. & Vollrath, F. Structural engineering of an orb-spider’s web. Nature 373, 146–148 (1995). 6. Craig, C. L. & Bernard, G. D. Insect attraction to ultraviolet reflecting spider webs and web decorations. Ecology 71, 616– 623 (1990). 7. Craig, C. L., Okubo, A. & Andreasen, V. Effect of spider orb web and insect oscillations on prey interception. J. Theor. Biol. 115, 201–211 (1985)
22 THRESHOLD™ SEPT/OCT 2025 Spiderweb deformation induced by Electrostatically Charged insects (CONT.) REPORT 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ 8. Coddington, J. A., Chanzy, H. D., Jackson, C. L., Raty, G. & Gardner, K. H. The unique ribbon morphology of the major ampullate silk of spiders from the genus Loxosceles (Recluse spiders). Biomacromolecules 3, 5–8 (2002). 9. Edwards, D. K. Electrostatic charges insects due to contact with different substrates. Can. J. Zool. 40, 579–584 (1962). 10. McGonigle, D. F., Jackson, Ch. W. & Davidson, J. L. Triboelectrification of houseflies (Musca domestica L.) walking on synthetic dielectric surfaces. J. Electrost. 54, 167–177 (2002). 11. Colin, M. E., Richard, D. & Chauzy, S. Measurement of electriccharges carried bybees: evidence ofbiological variations. J. Bioelectricity 10, 17–32 (1991). 12. Vaknin, Y., Gan-Mor, S., Bechar, A., Ronen, B. & Eisikowitch, D. The role of electrostatic forces in pollination. Plant Syst. Evol. 222, 133–142 (2000). 13. Hedrick, T. L. Software techniques for two and three dimensional kinematic measurements of biological and biomimetic systems. Bioinspir. Biomim. 3, 034001 (2008). 14. Opell, B. D. What forces are responsible for the stickiness of spider cribellar threads? J. Exp. Zool. 265, 469–476 (1993). 15. Peters, H. M. The spinning apparatus of Uloboridae in relation to the structure and construction of capture threads (Arachnida, Araneida). Zoomorphology 104, 96–104 (1984). 16. Opell, B. D. Do static electric forces contribute to the stickiness of a spider’s cribellar prey captured threads? J. Exp. Zool. 273, 186–189 (1995). 17. Vollrath, F., Downes, M. & Krakow, S. Design variability in web-geometry of an orb-weaving spider. Physiol. Behav. 62, 735–743 (1997). 18. Tarakanova, A. & Buehler, M. J. The role of capturing spiral silk properties in the diversification of orb webs. J. R. Soc Interface 9, 3240–3248 (2012). 19. Clarke, D., Whitney, H., Sutton, G. & Robert, D. Detection and Learning of Floral Electric Fields by Bumblebees. Science 340, 66–69 (2013). 20. Brooks, D. M. Birds caught in spider webs: a synthesis of patterns. Wils. J. Ornithol. 124, 345–353 (2012). 21. Yu, L., Hu, X., Kaplan, D. & Cebe, P. Dielectric relaxation spectroscopy of hydrated and dehydrated silk fibroin cast from aqueous solutions. Biomacromolecules 11, 2766–2775 (2010). 22. Bowker, G.E. & Crenshaw, H. C. Electrostatic forces in wind-pollination? Part 2: Simulations of pollen capture. Atmosph. Environ. 41, 1596–1603 (2007). 23. Smith, R. R. & Mommsen, T. P. Pollen feeding in an orb weaving spider. Science 226, 1330–1333 (1984). 24. Opell, B. D. Economics of spider orb-webs: the benefits of producing adhesive capture thread and of recycling silk. Funct. Ecol. 12, 613–624 (1998). 25. Chauzy, S. & Despiau, S. Rainfall rate and electric charge and size of raindrops of six spring showers. J. Atmos. Sci. 37, 1619–1627 (1980). SCIENTIFIC REPORTS | 3 : 2108 | DOI: 10.1038/srep02108
218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ 23 Get Connected Are you following EOS/ESD Association, Inc. on Linked In? I hope the answer is YES! It is not too late to follow us. Don’t miss our weekly updates. THRESHOLD™ SEPT/OCT 2025
24 Technical Question(s) Have a question to ask? Send an email to: info.eosesda@esda.org (Be as descriptive as possible.) The response given is a service to industry; EOS/ESD Association, Inc. is not responsible for content. The users of this information need to determine the suitability of the response. THRESHOLD™ SEPT/OCT 2025 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ I have a mixed EPA area, where people circulate without ESD protection, is this situation allowed? Thank you for your question. However, what you have stated clearly violates the principles of an EPA that are defined in our standard ANSI/ESD S20.20. Personnel that are not following the established ESD control practices are not allowed to enter the EPA. The exception is maintenance personnel that are involved in working on energized or open electrical systems. Those operational personnel that have duties in the non-EPA but have to move through an EPA need to have at least minimal training that says "don't touch any unprotected (unpackaged) sensitive items". But, they should wear or use the same ESD control clothing/grounding methods that is required of EPA operational personnel. They would not have to use grounding methods inside of the non-EPA where they work but to get to and from their area, they must not be a potential source of electric fields or electrostatic discharge. If there are any other questions, please let us know. For ionizer decay time test per both ANSI ESD S20 20 is user defined and per iEC 61340-5-1 +/- 1000v to +/-100 v in < 20 sec or user defined, I have a simco FMX 003 field meter ( +/- 20 kv range ) with a portable charge plate for ion balancing test. . For checking the decay time I do not have a static inducer/ charger to induce -/+ 1000 V on to the charge plate. Since a Gas stove lighter generates around 800 V (as I have studied but not checked ) can this be used as a static voltage inducer and can the test be done at less than 1000 V ? Does it require a tailoring statement in the ESD control program plan ? Thank you for your question. The Idea in ionizer testing is to evaluate whether or not the ionizer device is capable of neutralizing an electrostatic charge. The instrument you have will do that if you can find a way to charge the isolated plate some way. Getting to 1,000 volts is desired but whatever you can charge the plate up to will give you something. If you have a piece of isolated metal - metal rod with a plastic handle - like a large screwdriver, rub the metal part with different cloths, like silk and wool or plastic materials, you should be able to charge up the metal screwdriver blade. Measure with your meter to see the level and polarity. It is best to find some materials that will charge the screwdriver both polarities. Once you get the screwdriver charged, touch the isolated plate to share the charge. The meter will tell you the level. Using a stop watch, measure the decay time from peak voltage to under 100 volts and record. If you cannot get to 1000 volts or above, a tailoring statement would be best. Your igniter idea should be OK but will only be one polarity.
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