SeptemberOctober 2017

Volume 33, No. 5 Sept/Oct 2017 THRESHOLD TM Inside this Issue: Symposium 2017, page 1 From the President, page 2 EOS/ESD Symposium Keynote, page 3 Standards Meetings, page 4 EOS/ESD Symposium Schedule, pages 6-7 IEW Call for Presentations, pages 7-8 2018 EOS/ESD Manufacturing Symposium in Asia Call fo Presentations, pages 9-10 40th Annual Symposium Call for Papers, pages 11-14 China Forum Worksho, page 18 Select Papers from Past Symposiums, pages 24-54 Q & A, page 55 Calendar, page 56 Photo Corner, page 57 The Board of Directors Welcomes You to the EOS/ESD Symposium! Now in its 39th year, the 2017 EOS/ESD Symposium presents the latest re- search on EOS and ESD in the rapidly changing world of electronics. This in- ternational gathering, which is jointly sponsored by the IEEE, the EMC Society, the Electron Devices Society and the Reliability Society, offers a unique op- portunity for engineers in industry and academia to learn best practices and the newest advances in technology for ESD control protection and design. It addresses EOS/ESD at the device, board and system level with attention to both design and manufacturing issues. This year’s event, which will be held September 10-15 at the beautiful Westin La Paloma Resort in Tucson, Ariz. offers an expanded technical program that includes new and updated tutorials, an added parallel track on EOS/ESD in Manufacturing and a total of 16 new sessions. The industry exhibits display a wide variety of ESD solutions from established products to leading-edge innovations. Representatives from many different companies welcome you in the exhibit hall to demonstrate their products and services, starting with the welcome reception on Monday evening and continuing until the exhibits close on Wednesday afternoon. The exhibits offer a unique opportunity to find what you have been looking for or a chance to talk to the professionals with hands-on experience in static control meth- ods, evaluation techniques, ESD testing hardware, and many other ESD solutions.

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