Date & Time:
October 14-15, 2020
China ESD Forum Workshop


Sponsorship Form 

This annual one-of-a-kind workshop/forum brings forth the realities of ESD requirements in light of the rapidly advancing semiconductor technologies requiring higher speeds of operations while balanced with much improved worldwide ESD factory control at fabs and assembly areas.

It is a two-day event to bring together electronics professionals to learn and exchange information about current issues of ESD requirements, and facilitate harmonization towards common goals for product cost savings.

Expert panel discussions provide intensive discussion and analysis that leads to valuable problem-solving exchanges.

General ESD Topics and ESD Control in Production and Lab Areas:
• ESD Control Measures in Electro-Static Protected Areas (EPAs)
• Measurements to Control CDM Events
• Defining Component-Level ESD Target Levels
• Absolute Maximum Ratings and Reliability Physics
• Learning from Physical Failure Analysis

ESD Test and Characterization Methods:
• HBM and CDM Testing and the Correct Implementation of the Test Standards
• Transmission Line Pulsing: Basics and Application Areas of TLP Testing
• System-Level ESD Testing: Basics, Best Practice Sharing and Avoiding Pitfalls

Chip-Level ESD Design:
• Radio-Frequency (RF), High-Voltage (HV), and Mixed-Signal ESD Protection Concepts
• Design Challenges for IC ESD Protection

System-Level ESD Design:
• System Efficient ESD Design (SEED): Co-Design of Semiconductor Components and Electronic Systems
• Disconnects between Component-Level and System-Level Protection
• Teardowns and Examples of System-Level Protection
• System Design Focusing on Soft and Hard Failure Prevention
• TVS Diode Characterization for Successful Application of the SEED Method

Advanced Developments in ESD Design and Testing:
• ESD Stress by Charged Board Events (CBE)
• System ESD Stress and Its Impact on System Interfaces
• Development of Spice Simulation Models for ESD Simulation
• System-Level ESD Simulation: Live Demo
• Applying the SEED Method to Soft Failures