WG1.0 – Wrist Straps.
The working group (WG) began the five-year review of ANSI/ESD S1.1. The WG will be submitting the document for reaffirmation with editorial changes that include updating terminology.

WG3.0 – Ionization.
The WG addressed clarification questions from the Standards Administrator regarding adjudication Standards Committee (STDCOM) Vote-by-Mail comments in ESD WIP3.4. The document will be submitted for Technical and Administrative Support Committee (TAS) review and a second vote-by-mail.
The WG began the five-year review of ANSI/ESD SP3.3 and identified no technical changes. Editorial changes will be made to harmonize terminology with S20.20 and TR53. The WG will probably recommend the document be reaffirmed.

WG4.0 – Worksurfaces.
The WG began the five year review of ANSI/ESD S4.1. The limits will be removed and the document will be re-designated as a STM. The WG began the five year review of ANSI/ESD STM4.2. Changes to the document include updating boiler plate sections and references to the charge plate monitors.

WG5.0 – Device Testing.
This is a high level meeting of all device WGs that encourages discussion of issues common to the device testing WGs. Issues discussed included evaluating goals based on a balance of repeatability, reality, and practicality; concerns about using the Standard Practice designation; and resources for project management.

Ad hoc 5.0 – (CBE) Device Testing.
The WG reviewed the activities and information that was gathered during the last two years. A decision was made that there is not enough information to write a standard so a technical report will be pursued.

JWG – (HBM) Device Testing.
The joint working group (JWG) reprioritized work items based on balancing repeatability, reality, and practicality for critical changes needed in the industry. An ad hoc advisory group was formed to support the next generation testing with data and technical explanations for changes in the standard. Accelerated efforts were initiated for reduced cross-domain testing, elimination of non-supply to non-supply testing, and the addition of two-pin testing. The next revision of the document is scheduled to be submitted in 2011.

WG5.2 – (MM) Device Testing.
Machine Model (MM) has been identified as not being critical to qualify device products. Revisions have been made to ANSI/ESD S5.2 to remove classifications and the document will be re-designated as a STM. A suggestion has been made to issue a bulletin to be included in the document stating the documents use as a reference.

JWG – (CDM) Device Testing.
The WG reviewed activities that took place since the February meetings. Data from two separate data collecting initiatives was reviewed. Tim Maloney gave presentations on data showing a waveform decay issue that is amplified with the 10 ohm CDM and further work on software bandwidth filtering of CDM waveforms.
Bob Given gave a presentation on the effects of humidity on variation of the discharge characteristics of the CDM waveform.
John Barth gave a presentation on frequency response measurements. Charvaka Duvvury gave a presentation on a CDM test issue involving large pin count devices and full pin count test causing test failures. Keiichi Hasegawa gave a presentation showing scope data comparing two different scope models.
A discussion was held regarding a proposal to the BoD for funding of CDM test equipment.

WG5.4 – (TLU) Device Testing.
A presentation was given by Wolfgang Stadler on discussions and information gathered during the 2010 IEW on transient latch-up. A technical report will be pursued with a goal of publishing in early 2011. The WG is recommending that ANSI/ESD SP5.4 be withdrawn and published as a technical report (TR).

WG5.5 – (TLP) Device Testing.
The WG discussed closure of the VF-TLP round robin testing with a deadline at the end of June. Tim Prass will be analyzing the data in July. The data will be added to a TR and should be submitted to TAS before October. A presentation was given by Jon Barth on transient analysis. The WG will be pursuing TR’s to discuss anomalies and issues with TLP measurement and techniques.

WG5.6 – (HMM) Device Testing.
The WG discussed the results of three devices from the round robin study. The WG will provide the statistician with the data for analysis.

WG7.0 – Flooring.
Members of the WG met with TAS on Saturday to discuss a lower limit of 2.5 x 104 in the definition of conductive floor materials in the glossary. There will also be a proposed change to the definition of dissipative floor materials at a later date.
The WG reviewed TAS comments on ESD WIP7.1 and ESD TR7.0. Both documents should be submitted to TAS by the end of June.

WG9.0 – Footwear and WG 97.0 – Footwear Systems.
The WG began a five year review of ANSI/ESD STM97.1 and ANSI/ESD STM97.2. The documents will be submitted with a recommendation for reaffirmation. A request was made to add a system test to ANSI/ESD STM9.1. The WG reviewed comparison testing data from other footwear industry standards.
The WG will be completing a round robin on ESD SP9.2 to re-designate it as a STM.

WG10.0 – Handlers.
The WG continued working on ESD WIP10.2. A minimum DUT size for a particular target design must be defined and the “bench fixture” procedure will be moved to an Annex. A presentation was given by Gerald Afflard on an in-situ measurement method using an electrostatic voltmeter. The WG will be refocusing the document on this new method.

WG11.0 – Packaging.
The WG reviewed and made suggested changes to the packaging section of ESD TR53. The industry review comments were adjudicated for ESD DSTM11.13. The WG reviewed the new ESD WIP11.14. The goal is to have round robin data to Tim Prass by September. The five year review of ANSI/ESD STM11.11 and ASNI/ESD STM11.31 will begin in October.

WG13.0 – Handtools.
The WG reviewed ESD WIP13.1. Tom Miller provided additional data on the performance of RF based soldering irons as requested by TAS. The document is ready for TAS review and the goal is to have a STDCOM vote-by-mail before the October meeting series. Discussion began on a test method for non-electric hand tools (ESD WIP13.2). WG members will begin drafting a method to measure resistance-to-ground of non-electric hand tools for an inter-laboratory study. A presentation was given by Bill DeJean. A longer range goal is to provide guidance on what resistance range is required based on the sensitivity of the ESD sensitive product.

WG14.0 – System Level ESD.
ESD WIP14.1 will remain a standard practice and will be submitted for a STDCOM vote-by-mail before the October meeting series. Industry comments for ESD DSP14.3 were adjudicated and after a new drawing is inserted in the document it will be submitted for TAS review. The WG reviewed test setups and methods for ESD WIP14.4. Further clarifications and review of new information will be done between meetings.
Tim Maloney gave a presentation about CDE events on shielded cables and proposed an additional test method.

WG15.0 – Gloves.
The WG reviewed TAS comments on ESD WIP15.2.
The WG began the five-year review of ESD WIP15.1. Re-designation of the document as a STM will be discussed in a future meeting.

WG17.0 – Process Assessment.
A workstatement was completed and approved for submission to TAS. The WG began writing a document outline.

WG53.0 – Compliance Verification and WG16.0 – Workstations
The WG added additional content to the soldering iron section of ESD TR53. The WG is waiting for the packaging section from WG11 before moving forward. The goal is to submit to TAS prior to the October meeting series. Discussions were held on ESD WIP16.1 to determine what content should be included.