WG1.0 – Wrist Straps.
The working group (WG) made a technical change to ANSI/ESD S1.1 during the five-year review. The wrist strap system resistance was changed from 10 megohm to less than 35 megohm to harmonize with the current limits in ANSI/ESD S20.20. A decision was made by the WG to not increase the flex limit since there has not been any user pressure that would necessitate a change. The revised document will be submitted for review by the Technical and Administrative Support (TAS) committee.
WG2.0 – Garments.
The WG reviewed TAS comments and made revisions to the work-in-progress (WIP) 2.1 document. The document will be submitted to TAS for a second review. The WG’s goal is early 2011 for the Standards Committee (STDCOM) vote-by-mail. The WG discussed varied conductor fabrics as a future focus.
WG3.0 – Ionization.
The WG reviewed TAS comments on ESD WIP3.4. The WG reformatted the document and will be submitting the revised document to TAS for review.
The WG continued the five-year review of ANSI/ ESD SP3.3 and will be submitting a revised document to TAS for review. The WG started the five-year review of ANSI/ESD STM3.1, and technical changes will be made.
WG4.0 – Worksurfaces.
The WG continued the five-year review of ANSI/ESD S4.1. The compliance verification section will be removed and the document will be re-designated as a standard test method (STM). The goal is to have a revised document to TAS for review by the end of the year.
WG5.0 – Device Testing.
A discussion was held regarding whether a change for the standard practice document designation should be suggested to TAS due to perceived confusion and misunderstanding by industry users of what a standard practice means.
Ad hoc 5.0 – (CBE) Device Testing.
A team has been assembled to write a technical report (TR) on charged board event (CBE). A discussion was held about pursuing a TR in system level and charge board event. A decision was made to not pursue the topic as it is outside the scope of the WG.
JWG – (HBM) Device Testing.
The WG worked on the second revision of ANSI/ESDA/JEDEC JS-001. A majority of the meeting was spent on reviewing and revising Section 6 – Test Method. A discussion was held on the annex section of the document. A final draft of the revised document is due to TAS for review at the end of October. The WG’s publication goal is April 2011.
WG5.2 – (MM) Device Testing.
The WG discussed the action item to combine ANSI/ESD SP5.1.1 and ANSI/ESD SP5.1.2 into the revision of ANSI/ESD S5.2. The document will be re-designated as a standard practice. A revised document will be submitted to TAS for review in November. A presentation was given by Texas Instruments on changing the zap interval from 1.0 to 0.3 seconds. Data will be collected for review.
JWG – (CDM) Device Testing.
The WG reviewed activities that took place between meetings. 1 GHz data for the JEDEC test head, 10 ohm test head with ferrite, and 10 ohm test head without ferrite has been collected and was reviewed. 3 GHz round robin data comparing the JEDEC test head with a 10 ohm test head without ferrite is currently being gathered. A hardware filter evaluation at several test sites is also in progress. An initial draft of a joint CDM document was summarized and reviewed. Tim Maloney gave a presentation on CDM software filtering of high bandwidth oscilloscopes to lower bandwidths which was shown to correlate to lower bandwidth scope CDM responses. Marti Farris gave a presentation on a hardware filter study using the ESDA – purchased filters comparing high bandwidth scope / hardware filter output to lower bandwidth scopes. John Barth gave a presentation on frequency response measurements of a Thermo RCDM3 JEDEC test head without ferrite. Bob Given gave a presentation on humidity effects on CDM pulses comparing the ESDA CDM test method with the new CDM2 method, showing distribution / standard deviation of CDM pulse variation.
WG5.4 – (TLU) Device Testing.
A presentation was given by Wolfgang Stadler on Infineon’s 2010 Symposium paper titled “Triggering of Transient Latch-up by System Level ESD”. A presentation was given by Tim Maloney on IRPS data and CDE data. A presentation was given by Thermo Fisher on ESD induced latch-up. There were discussions held on the future goals of the WG, and a new TR was proposed to help define a new method. The goal is to complete the TR by February 2011 and publish by June 2011. A discussion was held regarding the re-designation of standard practice. ANSI/ESD SP5.4 will be re-designated as a TR in order to keep the information contained in the document in the industry. Tom Meuse has stepped down as WG chair and Wolfgang Stadler has been appointed the new WG chair.
WG5.5 – (TLP) Device Testing.
The final round robin data for ANSI/ESD SP5.5.2 will be transferred to Tim Prass for analysis. The WG voted to begin focusing on transient or initial pulse phenomena.
WG5.6 – (HMM) Device Testing.
A presentation was given by Thermo Fisher on a contact test method with an IEC compliant waveform. The WG reviewed the round robin data; the variations were large compared to other device testing; two more data points need to be taken before submission to Tim Prass.
WG7.0 – Flooring.
The WG continued the five-year review of ANSI/ESD S7.1. Boilerplate definitions and several technical changes related to groundable point and periodic verification descriptions were made. The title of the document will be changed to “Resistance Characterization of Flooring Materials”. A revised document will be submitted to TAS for review.
WG9.0 – Footwear and WG 97.0 – Footwear Systems.
The WG continued the five-year review of ANSI/ESD STM9.1. A system test is being added using a metal plate (similar to STM97.1 without the floor).
WG10.0 – Handlers.
The WG reviewed and restructured ESD WIP10.2 – “Measurement of CDM Related ESD Characteristics within an Automated Process or Equipment.” The WG reviewed past discharge fixture and target phenomena.
WG11.0 – Packaging.
The WG reviewed the round robin data for ESD WIP11.14. The data shows some variation for high resistance measurements and Tim Prass will be analyzing the data. The WG reviewed ANSI/ESD STM11.11 for five-year review and no technical changes will be made.
WG13.0 – Handtools.
The WG adjudicated all STDCOM vote-by-mail comments and made no technical changes. The WG began discussion of the next topic; Non-AC powered hand tools.
WG14.0 – System Level ESD.
The WG has decided to publish ESD WIP14.3 (measurement of cable discharge) as a TR and a support document to ESD WIP14.4 (cable discharge event test procedure). The WG reviewed ESD WIP14.4 and made new revisions. A presentation was given by Fabrice Caignet on scanning for system level ESD current measurement using magnetic field probes. A presentation was given by Jeff Dunnihoo on current mapping – system level ESD scanning. A TR was proposed for ESD WIP14.5 and is scheduled to be completed by February 2011. Mike Hopkins is stepping down as WG chair and Tom Meuse has been appointed as the new chair.
WG15.0 – Gloves.
The WG adjudicated the STDCOM vote-by-mail comments. The WG began the five-year review of ANSI/ESD SP15.1 and will be making only boilerplate changes.
WG16.0 – Workstations.
The WG reviewed ESD WIP16.1 and made revisions per TAS comments. New drawings will be added and final revisions will be made prior to submitting the revised document to TAS for review.
WG17.0 – Process Assessment.
The WG continued working on the outline of a new document.
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