| Update on Standards Activity
Update on Standards Activity
June 2008 Meeting Series
The ESD Association Standards Committee held their June 2008 Meeting Series at the J.A. Nugget Resort & Casino in Sparks, Nevada, from June 5, 2008 through June 8, 2008.
June 2008 Working Group Activities
Working Group 2.0—Garments. The industry review period for DSTM2.1-2008 closed June 3, 2008. The Working Group reviewed the industry comments. The Industry review resulted in comments that necessitate technical changes to the document. The draft document was brought back to a Work in Process (WIP).
Working Group 3.0—Ionization. The Ionization working group discussed results of a second round of testing, with committee-defined 1-inch x 1-inch CPM plate(s) to validate that the assemblies may be interchanged between the two test instruments. Test results resulted in some variations. The direction of the new document was discussed: the document will outline the use of a test fixture that will fit in confined spaces and will include a procedure to establish correlation with the 6-inch x 6-inch CPM plate in an open environment. It is anticipated that the document will discuss having the instruments provide both raw test data and data correlated to the standard 6-inch by 6-inch CPM. The committee has begun a first draft of the new STM document and will be reviewing that document between now and the September 2008 meeting.
ESDA/JEDEC Joint AdHoc Committee. The joint JEDEC – ESDA AdHoc HBM working group meeting was held with both members of JEDEC and ESD Association organizations. The working group continues to focus on resolving technical differences between the ESDA STM5.1 HBM and JES22-A114E HBM documents. A gap analysis was developed in the February meeting series that defined specific action items required to resolve these differences. At the June meetings, more progress was made to resolve the differences, and additional teleconferences are scheduled following the June meetings.
Working Group 5.2—(MM) Device Testing. The Machine Model (MM) Working Group continued to review industry review comments received for draft standard DS5.2-2007. Industry comments resulted in a technical change and this document has been brought back to a Work in Process. Other Working Group business included a presentation by the Industry Council on MM data, and action items were assigned for the collection of more data for Round Robin testing.
Working Group 5.3.1—(CDM) Device Testing. The Charged Device Model (CDM) Working Group continued to review industry review comments received for draft standard DS5.3.1-2007. There were technical changes to address and the document is going back to a Work in Process (WIP). Action items were assigned.
Charged Board Event (CBE) AdHoc Committee. The committee discussed the relevance of Charged Board Events (CBE), and also focused on the committee’s goals. Action items were assigned to find out how CBE was done in Asia (including setup, etc.), and to establish contact with the Failure Analysis (FA) community.
Working Group 5.4—(TLU) Device Testing. The Transient Latchup (TLU) Working Group committee members were informed that the Technical Report (ESD TR5.4-02-08) was approved by the Technical and Administrative Support (TAS) Committee and has been published. An action item was given to all committee members to review ANSI/ESD SP5.4-2004 for its scheduled ANSI 5-year review by March 1, 2009.
Working Group 5.5—(TLP) Device Testing. The Transmission Line Pulse (TLP) Working Group reviewed the status of the round robin testing for the Very Fast Transmission Line Pulse (VF-TLP) document. Guidelines for the Round Robin were highlighted, results were reviewed and modified, and conclusions were reviewed and modified. Action items were assigned. Completion of the Round Robin testing is scheduled for the end of the year, and a White Paper will be filed by February 2009. Teleconferences were scheduled.
Working Group 5.6—(HMM) Device Testing. The Human Metal Model (HMM) Working Group discussed the addition of the pulse cable system and also discussed edits to the draft technical report. An action item was assigned for the submission of information regarding the pulse cable system; once this information is incorporated, the technical report will be considered complete. It will then be submitted to the Technical and Administrative Support (TAS) Committee for review.
Working Group 7.0—Flooring. The Flooring Working Group finalized a Technical Report on flooring. This document will be submitted to the Technical and Administrative Support (TAS) Committee for review.
Working Group 10.0—Handlers. The Handlers Working Group presented discharge current data. This data and relative meanings were discussed. Action items were assigned. Comments received from the Technical and Administrative Support (TAS) committee pertaining to the 10.2 Workstatement, Handlers Process Measurements, were reviewed. The WG10 Industry Review list was also updated.
Working Group 11.0—Packaging. The Packaging Working Group reviewed the draft document, Resistance between Two Points. This document is now ready for Round Robin testing. Labs and material types were selected for the testing and testing data is expected to be completed for review at the September meetings.
Working Group 13.0—Electrical Soldering / Desoldering Hand Tools. The Hand Tools Working Group reviewed new artwork for the revised Standard Test Method and recorded corrections and improvements. A plan for Round Robin testing was developed. The objective of the Round Robin is to confirm that the test steps yield acceptable results of RF-based technology soldering irons (previously excluded from the document scope). Six labs were identified for the testing that will take place between June and August 2008.
Working Group 14.0—Simulators. The Simulators Working Group continued to revise the draft document, System Level ESD-CDE. The final draft is scheduled to be submitted to the Technical and Administrative Support (TAS) Committee for review by the end of June. The Working Group also began the review of the 14.4 draft, and discussed the future of 14.2. The Working Group will continue to review ESD SP14.1-2004 for ANSI 5-year review, due March 2009.
Working Group 15.0—Gloves. The Gloves Working Group reviewed the results of glove charging data presented to the committee. The decision was made to collect documented records of how the data was gathered, to ensure a common collection process was used. If the required consistency can be confirmed, then the Working Group will proceed drafting a Standard Practice.
Working Group 16.0—Workstations. The Workstations Working Group reviewed Technical and Administrative Support (TAS) Committee comments on WIP16.1 (formerly ADV53.1-1995). The Working Group will continue to make modifications to harmonize this document with long-term plans for ESD Association documentation.
Working Group 53.0—Compliance Verification. The Compliance verification Working Group submitted updated TR53 sections to the Technical and Administrative Support (TAS) Committee for review. At this meeting series, the TAS committee supplied additional feedback, and the Working Group will continue to work on the document for the September meetings.
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