Standards Summary
September 2011 Meeting Series
Disneyland Hotel, Anaheim, CA
WG1.0 – Wrist Straps.
Chair: Brent Beamer, 3M
The working group (WG) began reviewing and adjudicating Standards Committee (STDCOM) vote-by-mail (VBM) comments on ESD WIP1.1. The WG will finish between meeting series and submit the document for industry review.
WG2.0 – Garments.
Chair: Kurt Edwards, Lubrizol Conductive Polymers
The WG reviewed and adjudicated STDCOM VBM comments on ESD WIP2.1. Technical changes were made to the document so it will be distributed for a VBM between meeting series.
WG3.0 – Ionization.
Chair: Kevin Duncan, Seagate Technology
The WG reviewed editorial changes in ANSI/ESD SP3.3. The document is being recommended for reaffirmation at the February meeting series. The WG reviewed changes to ESD WIP3.4. A new block diagram will be added and the document will be sent to the Technical and Administrative Support Committee (TAS) by November 1st. The WG continued reviewing ESD WIP3.1. Changes are being made to add a voltage follower type ionizer. The WG reviewed data comparing performance of field meter type and voltage type using a steady state DC ionizer. The data collected shows good correlation. Additional comparisons will be conducted using pulsed DC to further understand ionizer technology influence on measurement technology.
WG4.0 – Worksurfaces.
Chair: Dale Parkin, Seagate Technology
The WG reviewed ESD WIP4.1. Further changes will be made to add sections for mobile carts and conveyors that are used as work surfaces. This will be included in the new revision of ANSI/ESD S20.20. Steve Gerken provided data to review on new voltage resistance test method for work surfaces. The information gathered will be looked at as a new test method document to replace the current test method in ANSI/ESD STM4.2. ANSI/ESD STM4.2 will be recommended for reaffirmation at the February meeting series.
WG5.0 – Device Testing.
Chair: Terry Welsher, Dangelmayer Associates
The WG discussed revisions to the 2010 ESDA Technology Roadmap. Comments and suggestions have been received from industry users on how to expand the scope of the document. A section may be added on device packaging, device manufacturing, and production equipment. A new roadmap will be created for device testing and each device WG chair has been asked to submit five-year goals as to where device testing is going. The goal is to have a new roadmap published in January 2012. No Meeting was held during the September 2011 meeting sseries
Ad hoc 5.0 – (CBE) Device Testing.
Chair: Leo G Henry, ESD-TLP Consulting Services
A team has been assembled to begin writing a technical report (TR) primer on Charged Board Event (CBE). The WG is currently researching current papers that have been published in the industry. No meeting was held during the September 2011 meeting series.
JWG – (HBM) Device Testing. (formerly WG5.1)
Chairs: Mike Chaine, Micron Technology Inc.; Terry Welsher, Dangelmayer Associates
The WG reviewed the current status of ANSI/ESDA/JEDEC JS-001 and the limited ballot that is currently in the JC14 voting machine. The document will be sent to TAS for review after the JC14 meeting in September and then the document will be distributed for STDCOM VBM before the February meeting series. The WG reviewed member comments on the “user guide” technical report (TR) draft. A final draft is expected for submission to TAS in October. The WG reviewed new changes identified for 2012.
WG5.2 – (MM) Device Testing.
Chair: Leo G Henry, ESD-TLP Consulting Services
The WG adjudicated STDCOM VBM comments on ESD WIP5.2. A discussion was held to change the final re-designation of ESD WIP5.2 from standard practice (SP) to standard test method (STM) to address comments received in the VBM process. The WG will adjudicate STDCOM VBM comments on ESD WIP5.2.2 and ESD WIP5.2.1 between meeting series.
JWG – (CDM) Device Testing. (formerly WG5.3.1)
Chairs: Alan Righter, Analog Devices; Terry L. Welsher, Dangelmayer Associates
The WG completed gathering data on 1 GHz and 3 GHz multisite JEDEC vs. 10 ohm CDM and the WG has begun analyzing the data. There were three presentations given: Tim Maloney (Intel) - Filter Models of CDM Measurement Channels Tim Maloney (Intel) - 50 ohm self-resonance in 10 ohm CDM test head Andrea Boroni (ST Microelectronics) – CDM on Package With Metallic Slug The WG reviewed the latest draft of the joint CDM document. Questions remain on the specifications for CDM metrology chain and measurement specifications for JEDEC coin modules. A task team was formed to review these sections of the document and define the specifications. Updated data on multisite 10 ohm CDM vs. JEDEC testing was reviewed. 1 GHz data showed peak currents that were very close but 10 ohm data showed more spread (higher standard deviation) for peak current, faster FWHH, and nearly equivalent integrated charge. 3 GHz data showed peak currents that were 20-30% higher for 10 ohm CDM than for JEDEC, but 10 ohm data showed slightly less spread (lower standard deviation) for peak current, faster FWHH, and nearly equivalent (but more spread) in integrated charge compared to JEDEC. Discussion was held about the data and industry benefit from moving to 10 ohm CDM based on results, and if all the items causing variation were properly addressed. The 10 ohm results would create increased peak currents than JEDEC if the WG moved forward with the new direction. The WG decided not to move forward with 10 ohm CDM and better address the issues causing variability. It was decided that a new round of multisite data gathering would be conducted, comparing the CDM system ESDA 1 ohm head (without a ferrite) / JEDEC field plate dielectric, with the standard JEDEC head / JEDEC dielectric.
WG5.3.2 – Device Testing (SDM).
Chair: Mike Chaine, Micron Technology, Inc.
Dormant
WG5.4 – (TLU) Device Testing.
Chair: Wolfgang Stadler, Infineon Technologies
The current work on the new technical report was summarized. The introduction and the large section about the phenomenon (physical background) are completed. A new section on analog circuits and ICs” will be added. There are two different classes of TLU effects - the first class can be reproduced with JEDEC 78 static latch-up with increased compliance levels; the second class requires transient methods, e.g. transmission line pulsing with powered devices. These test methods will be discussed in the TR as base for further work of the working group. The TR should be ready for final review in February 2012 and is targeted for release in mid-2012. Two new TLU phenomena have been reported. Reinhold Gärtner (Infineon) gave a presentation on transient triggering of bipolar transistors during ISO 7673 stress tests for an automotive application. Charvaka Duvvury (Texas Instruments) presented the turn-on of an ESD power clamp during IEC system level tests which causes the system to fail. Both examples show latch-up typical behavior although the physical phenomenon behind the fail is different to “classical” latch-up. These examples will be included in the TR.
WG5.5 – (TLP) Device Testing.
Chair: Steve Voldman
The WG reviewed VF-TLP round robin data. The conclusion is that some data requires explanation as to why some of the statistics were out of expectations. The data will be submitted to TAS for review. Two presentations were given: Tim Maloney – Filter Transients for Transient Phenomena, Kathy Muhonen – Transient TLP
WG5.6 – (HMM) Device Testing.
Chair: Kathy Muhonen, RF Micro Devices
Two Presentations were given: David Tremouilles gave a presentation on using HMM to investigate the ESD robustness of three different processes and the ESD endurance. Robustness is a figure of merit describing the range of failure with one zap. Endurance is a figure of merit that defines the parts ability to withstand repetitive zaps at the same voltage level. Jon Barth gave a presentation on characterizing the ESD guns based on total energy. This, he believes would bring the failure levels of a part closer together when using different guns. A discussion was held about total energy being the next best way to characterize the guns. Based on this discussion, it was clear that some liked this idea and others did not believe it would get us any closer to a repeatable and reproducible. Two sub-committees were formed to conduct studies on testing repeatability. One committee will use Jon Barth’s proposal to characterize the guns based on how much energy is in the waveform. The other committee will investigate using pulsers instead of the ESD guns to see if that may yield a repeatable waveform. These committees will report back at the February meetings with their findings. All agreed that the two sub-committees were a better idea than tightening up the waveform tolerances to +/-10% and then conducting another round robin with those pieces of equipment that could hold to the tighter tolerances. In the meantime, it was decided that the results from the round robin should be submitted as an abstract for the 2012 Symposium and in a trade journal.
WG6.0 – Grounding.
Chair: Dave Swenson, Affinity Static Control Consulting, Inc.
Dormant
WG7.0 – Flooring.
Chair: Dale Tucker, Floorfolio/Responsive Flooring
The WG reviewed the final changes to ESD WIP7.1 and ESD TR7.0. The files have been submitted to headquarters for STDCOM VBM for ESD WIP7.1 and publication of ESD TR7.0.
WG8.0 – Symbols.
Dormant
WG9.0 – Footwear
Chair: Dale Parkin, Seagate Technology
The WG reviewed and finished adjudicating TAS comments on WIP9.1 and WIP97.1. The documents will be distributed for STDCOM VBM between meeting series.
WG10.0 – Handlers.
Chair: Jay Hamlin, Medtronic
The WG discussed Arnie Steinman’s and Vladimir Kraz’s test data presented at the June meeting. The conclusion is that voltage measurements and resulting currents of the smaller target in the test fixture was linear and correlated to the CDM testing data provided by Alan Righter. The WG reviewed the targets tested and the target recommended by Tim Maloney. After reviewing the data and target types, the group confirmed the previous decision to replace the large target contained in ESD WIP10.2 with the smaller target.
WG11.0 – Packaging.
Chair: Brent Beamer, 3M
The WG reviewed and adjudicated TAS comments for ANSI/ESD STM11.31. The document will recommended for reaffirmation in February. The WG is beginning new work on a document related to the physical characteristics of bags.
WG12.0 – Seating.
Chair: Bill Dejean, TDI International, Inc.
The WG reviewed comments submitted by five industry users of chairs and technical changes were made. The document will be submitted to TAS for review. No meeting was held during the September 2011 meeting series.
WG13.0 – Handtools.
Chair: Tim Prass, Raytheon
The WG reviewed and began adjudicating STDCOM VBM comments on ESD WIP13.1. There were technical changes made so the document will be submitted for another VBM.
WG14.0 – System Level ESD.
Chair: Tom Meuse, Thermo Fisher Scientific
The WG reviewed and adjudicated STDCOM VBM comments on ESD WIP14.1. The document will be submitted for industry review. ESD WIP14.4 will be combined with ESD WIP14.3 and submitted to TAS before the February meeting series. Work is continuing on TR and ESD WIP14.5 (EMI scanning). A brainstorming session was held about new work the WG would like to pursue next.
WG15.0 – Gloves.
Chair: Gene Chase, Electro-Tech Systems, Inc.
The WG finished adjudicating VBM comments on ESD WIP15.2. Technical changes have been made so the document will be submitted for another VBM.
WG16.0 – Workstations.
Chair: Cheryl Checketts, General Dynamics
No meeting was held during the September 2011 meeting series.
WG17.0 – Process Assessment.
Chair: Tim Jarrett, Boston Scientific
The WG continued working on the HBM section of the document. The focus is more on process and less on instruments right now.
WG20.20 – ESD Control Program
Chair: John Kinnear, IBM
The WG continued reviewing and revising ESD WIP20.20 during the five-year review. The main topics discussed were order of insulators, the values in Table 3, changes to Table 3, and editorial changes for clarification in the document. The document should go to TAS in November for review.
WG53 – Compliance Verification
Chair: Cheryl Checketts, General Dynamics
The WG voted to keep the document as a technical report instead of re-designating it as a standard practice. The WG continued reviewing and adjudicating TAS comments on TR53. The document will go to TAS for review by the end of September.
WG55.0 – Cleanrooms.
Dormant
WG 97.0 – Footwear Systems
Chair: Dale Parkin, Seagate Technology
The WG reviewed and finished adjudicating TAS comments on WIP9.1 and WIP97.1. The documents will be distributed for STDCOM VBM between meeting series.
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