A white paper addressing the serious nature of ESD for the next generation of electronics and the need for further research in the area has been published by the ESD Association.

Entitled ESD Phenomena and the Reliability for Microelectronics, the white paper presents insights into present-day ESD phenomena, an overview of ESD effects on electronic chips and systems, and a summary of future issues and challenges facing ESD reliability as further advances in semiconductor technologies are made.

Several leading electronics and ESD experts contributed chapters to the 53-page document, covering such areas as controlling ESD from the factory point of view, designing ESD protection into the chip itself, methods to measure and test ESD levels, the impact of advanced IC technologies, simulation of ESD effects, and the challenges of the next decade.

Copies of the white paper can be purchased from ESD Association headquarters.

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