Impact of Technology Scaling on ESD High Current Phenomena and Implications for Robust ESD Design

Program
ESD Certified Professional-Device/Design Engineer
 
Course Length
Half-day course
 
Description

This advanced tutorial will cover the impact of silicon technology scaling on ESD device behavior and on subsequent ESD protection design. The physics of CMOS components under high current conditions will be discussed. Also, the technology trends for sub-100nm nodes and their implications for the ESD design window will be covered. Finally, sub-50nm technologies challenges will be discussed.

This class is intended for individuals who have taken the basic on-chip protection class and are familiar with the basic device physics for both ESD and latch-up.

The Industry Council is an independent Institution focused on target levels of ESD component testing, applying the HBM, MM and CDM standards.

Revised: 6/2/2011 © Copyright, 1999-2012

ESD Association • 7900 Turin Road, Building 3 • Rome, NY 13440-2069 USA • Ph: +1 315-339-6937 • Fax: +1 315-339-6793 • email: info@esda.org

The 2010 EOS ESD SymposiumThe 4th Annual IEW is in the works, for location and date click here.Attend the next ESDA Meeting series, for location please click here.

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