Kay Adams, Tech Wear, Inc., Carlsbad, CA
ESDA Board of Directors, Past President, EXCOM, Human Resources, Education, Marketing & Communications, STDCOM, Technical Liaison Team, WG 2
Sheila Akins, Multifineline, Anaheim, CA
WG 2
Robert Ashton, On Semiconductor, Phoenix, AZ
Technical Program Committee, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14, Device Design Council
Alan Barber, Dow Reichold Specialty Latex, Durham, NC
WG 15, Technical Program Committee
Jon Barth, Barth Electronics, Inc., Boulder, NV
Technical Program Committee, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Brent Beamer, 3M, Sanford, NC
STDCOM, WG 11
Donn Bellmore, Universal Instruments Corporation, Binghamton, NY
ESDA Board of Directors, EXCOM, Marketing & Communications, STDCOM, Steering Committee, WG 2, WG 3, WG 10
Donald Boehm, Dou Yee Enterprises, Truckee, CA
Human Resources, STDCOM, WG 2, WG 10, WG 11
Gianluca Boselli, Texas Instruments, Inc., Dallas, TX
Technical Program Committee, Steering Committee, Device Design Council, Board of Directors
Aniket Breed , Intel Corp., Folsom, CA
WG 5.6
Duncan Casselman, QRP, Inc., Tucson, AZ
WG 15
Laurie Casselman, QRP, Inc., Tucson, AZ
WG 15
William Casselman, QRP, Inc., Tucson, AZ
WG 15
Lorenzo Cerati, ST Microelectrnics, Agate Brianza, Italy
Technical Program Committee
Mike Chaine, Micron Technology, Inc., Boise, ID
Technical Program Committee, STDCOM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.5, WG 5.6, Device Design Council
Gene Chase, Electro-Tech Systems, Inc., Granite Falls, NC
STDCOM, WG 15, WG 16, WG 53
Cheryl Checketts, General Dynamics, Scottsdale, AZ
Human Resources, STDCOM, Steering Committee, WG 13, WG 16,
WG 53
Ann Concannon, National Semiconductor, Santa Clara, CA
Technical Program Committee
Ted Dangelmayer, Dangelmayer Associates, Annisquam, MA
Human Resources, Education, STDCOM
Rejean Dion, Bystat International, Inc., St. Laurent, Quebec, Canada
WG 2, WG 7, WG 10
Kevin Duncan, Seagate Technology, Bloomington, MN
TAS, Technical Program Committee, STDCOM
Charvaka Duvvury, Texas Instruments, Dallas, TX
ESDA Board of Directors, Technical Program Committee, Human Resources, Education, Technical Liaison Team, Device Design Council, Awards Commitee
Kai Esmark, Infineon Technologies, Munich, Germany
Technical Program Committee, Technical Liaison Team
Marti Farris, Intel Corporation, Hillsboro, OR
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4
Melissa Feeney-Jolliff, Aerospace Corporation, Hawthorne, CA
STDCOM, WG 13, WG 16, WG 53
Eugene Felder, Desco Industries, Inc., Chino, CA
WG 3, WG 13, WG 16, WG 53
Reinhold Gaertner, Infineon Technologies, Neubiberg, Germany
WG 5.1, WG 5.2, WG 5.3.1
Robert Gauthier, IBM, Essex Junction, VT
Technical Program Committee
Ron Gibson , Celestica International, Toronto, Ontario, Canada
Facility Certification, Program Manager Council
Horst Gieser, Fraunhofer IZM, Munich, Germany
Steering Committee, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 14
Dale Gross, Flexco, Gresham, OR
WG 7
Vaughn Gross, Green Mountain ESD Labs, Inc., St. Albans, VT
STDCOM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 13, WG 14
Evan Grund, Oryx Instruments, Freemont, CA
Technical Program Committee, WG 5.1, WG 5.2, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Bruno Guidotti, Forbo Flooring, Giubiasco, Switzerland
WG 7
Stephen Halperin, Stephen Halperin & Associates, Ltd., Bensenville, IL
Program Manager Council
Jay Hamlin, Medtronic, Tempe, AZ
STDCOM, WG 3, WG 10, WG 11, WG 16, WG 53, Steering Committee
Arleigh Hartkopf, Ansell Healthcare, Red Bank, NJ
WG 15
Leo G. Henry, ESD & TLP Consultants, Freemont, CA
Board of Directors, EXCOM, TAS, Technical Program Committee, Education, STDCOM, Technical Liaison Team, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 14, Program Manager Council, Device Design Council, Steering Committee, Marketing & Communications
Steve Heymann , MKS, Ion Systems, Alameda, CA
STDCOM, WG 3
Masamitsu Honda, Impulse Physics Laboratory, Inc., Tokyo, Japan
WG 14
Mike Hopkins, Thermo Fisher Scientific, Hollis, NH
WG 5.6, WG 14, Device Design Council, Program Manager Council
Tim Iben, IBM, San Jose, CA
Technical Program Committee,
Satoshi Isofuku, Tokyo Electronics Trading Co., Ltd., Tokyo, Japan
WG 5.2, WG 5.3.1
Choshu Ito, LSI Logic, Milpitas, CA
Technical Program Committee
Vsevold Ivanov, Dell, Inc., Round Rock, TX
WG 14
Natarajan Mahadeva Iyer, Silterra Malaysia Sdn. Bhd., Kulim, Kedah, Malaysia
Technical Program Committee
Tim Jarrett, Boston Scientific, St. Paul, MN
ESDA Board of Directors, Technical Program Committee, Human Resources, Education, Marketing & Communications, STDCOM, WG 4
Bart Keppens, Sarnoff Europe, Gistel, Belgium
Technical Program Committee
Michael Khazhinsky, Freescale Semiconductor, Inc/, Austin, TX
Technical Program Committee, Steering Committee
John Kinnear, IBM, Poughkeepsie, NY
ESDA Board of Directors, TAS, Marketing & Communications, STDCOM, WG 7, Facility Certification, Program Manager Council, Awards, EXCOM
Rick Knight, Ranger Plastic Extrusions, Inc., Arlington, TX
Technical Program Committee , WG 11
Vladimir Kraz, 3M, Soquel, CA
Technical Program Committee, WG 3, WG 10
Hans Kunz, Texas Instruments, Dallas, TX
Technical Program Committee, Device Design Council
Tom Larson, Trek Inc., Medina, NY
Education, WG 3, WG 10, WG 11, WG 15, and
2008 Symposium Steering Committee
Raivo Leeto , Sandia National Laboratories, Albuquerque, NM
Steering Committee
Larry Levit, MKS, Ion, Systems, Inc., Alameda, CA
Technical Program Committee
Junjun Li, IBM, Essex Junction, VT
Technical Program Committee
Chris Long , IBM, Essex Junction, VT
Program Manager Council
Jim Ludlow, Noveon, Inc., Cleveland, OH
STDCOM, WG 2, WG 11
Tim Maloney, Intel Corporation, Santa Clara, CA
ESDA Board of Directors, Technical Program Committee, WG 5.5, WG 14, Awards Committee
Oliver Marichal, Sarnoff Europe, Oost-Vlaanderen, Belgium
Technical Program Committee
Michele McSwain, TW Clean, Carlsbad, CA
ESDA Board of Directors, Human Resources, Education Business Unit Manager, Marketing & Communications, STDCOM, WG 2
Markus Mergens, Infineon Technologies, Neubiberg, Germany
Technical Program Committee
Tom Meuse, Thermo Fisher Scientific, Lowell, MA
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5
Doug Miller, Sandia National Laboratories, Amarillo, TX
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Jim Miller, Freescale Semiconductor, Austin, TX
Technical Program Committee, Device Design Council
Kyungjin Min, Global Technology Leader, Santa Clara, CA
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Peter Moens
Technical Program Committee
Kathy Muhonen, Penn State Behrend, Erie, PA
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Andy Murello, Cocoa, FL
Steering Committee
Ravindra Narayan, LSI Logic Corporation, Milpitas, CA
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Carl Newberg, River’s Edge Technical Services/MicroStat Labs, Rochester, MN
ESDA Board of Directors, TAS, Technical Program Committee, Education, STDCOM, Steering Committee, WG 2, WG 3, WG 11, WG 13, WG 15, WG 16, WG 53
Maciej Noras, Trek, Inc., Medina, NY
Technical Program Committee,
Chris O’Connor, Ultra Test International
WG 5.4, WG 5.6
Takayoshi Ohtsu, Hitachi Global Storage Technologies, Kanagawa, Japan
Technical Program Committee
Elaine Olson, Intel Corporation, Chandler, AZ
WG 2, WG 11, WG 15
Joseph Parent, Intel Corporation, Hillsboro, OR
WG 14
Dale Parkin, Rochester, MN
ESDA Board of Directors, STDCOM, Steering Committee,
WG 2, WG 3, WG 4, WG 11, Human Resources
Nathaniel Peachey, RF Micro Devices, Greensboro, NC
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Robert Perry, Seagate Technology, Bloomington, MN
Technical Program Committee
Dionyz Pogany, Institute for Solid State Electronics TU Vienna Technical University, Vienna, Austria
Technical Program Committee
Tim Prass, Raytheon, Indianapolis, IN
STDCOM, WG 3 ,WG 11, WG 13, WG 15, WG 16, WG 53
Donn Pritchard, Monroe Electronics, Lyndonville, NY
ESDA Board of Directors, EXCOM, Marketing & Communications, Technical Program Committee, Steering Committee, WG 3, WG 10
Bill Ricker, Ricker Engineering Services, San Marcos, TX
WG 4, WG 16, WG 53
Alan Righter, Analog Devices, Wilmington, MA
STDCOM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6
Rick Rodrigo, SIMCO, Hatfield, PA
Technical Program Committee, Steering Committee,
Elyse Rosenbaum, University of Illinois, Urbana, IL
Technical Program Committee, Device Design Council
Christian Russ, Infineon Technologies, Munich, Germany
Technical Program Committee
Jeff Salisbury, Seagate Technology, Shakopee, MN
Technical Program Committee, STDCOM, WG 3, WG 11, WG 13, WG 16, WG 53
Akram Salman, Advanced Micro Devices, Sunnyvale, CA
Technical Program Committee
Masonori Sawada, Hanwa Electric Ind. Co., Ltd., Wakayama, Japan
WG 5.1, WG 5.2, WG 5.4, WG 14
Mirko Scholz , IMECvzw, Leuven, Belgium
WG 3, WG 4, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 11, WG 14
Karen Shrier, Electronic Polymers, Inc., Round Rock, TX
WG 5.4, WG 14
Theo Smedes, NXP Semiconductors, Nijmegen, The Netherlands
Technical Program Committee
Doug Smith, D.C. Smith Consultants, Los Gatos, CA
Technical Program Committee, WG 14
Wolfgang Stadler, Infineon Technologies, Munich, Germany
Technical Program Committee, WG 5.4, WG 5.5, WG 5.6, WG 14
Arnie Steinman, MKS, Ion Systems, Alameda, CA
ESDA Board of Directors, Human Resources Business Unit Manager, Marketing & Communications, Technical Liaison Team, STDCOM, WG 3, WG 10, Program Manager Council
Jon Stephan, Intel Corporation, Cetzville, NY
WG 14
Michael Stockinger, Freescale Semiconductor, Austin, TX
Technical Program Committee
Teruo Suzuki, Fujitsu VLSI Ltd., Kasugai-Aichi-Ken, Japan
Technical Program Committee
David Swenson, Affinity Static Control Consulting, LLC, Round Rock, TX
ESDA Board of Directors, President, EXCOM, TAS, Human Resources, Education, Marketing & Communications, Awards Committee, STDCOM, Technical Liaison Team, WG 2, WG 3, WG 10, Program Manager Council
Wayne Tan, Wenvy Technologies, San Jose, CA
Technical Program Committee
Fred Tenzer , Desco Industries, Inc., Chino, CA
TAS, Education, STDCOM
Steven Thijs, Sarnoff Europe, Aalter, Belgium
Technical Program Committee, WG 5.3.1
Larry Ting, Texas Instruments, Dallas, TX
WG 5.4
David Tremouilles, IMEC, Leuven, Belgium
Technical Program Committee
Dale Tucker, LG Floors/Innovision (Associated/ASS), Kenilworth, NJ
WG 7
Julius Turangan, Western Digital, San Jose, CA
STDCOM, WG 2, WG 3, WG 10, WG 11, WG 15
Benjamin Van Camp, Sarnoff Europe, Oost-Vlaanderen, Belgium
Technical Program Committee
Hans Van Zwol, NXP Semiconductors, Nijmegen, The Netherlands
Technical Program Committee, WG 5.6
Vladimir Vaschenko
Technical Program Committee
Vesselin Vassilev, Texas Instruments, Dallas, TX
Technical Program Committee, Steering Committee
Bob Vermillion, RMV Technology Group, LLC, Clayton, CA
Human Resources, STDCOM, WG 11, WG 13
Steve Voldman, Essex Junction, VT
STDCOM, Technical Program Committee, Education, Technical Liaison Team, Steering Committee, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14, Device Design Council
Al Wallash, Hitachi Global Storage Technologies, San Jose, CA
Technical Program Committee
Roger Watkins, Oryx Instruments, Freemont, CA
WG 5.1, WG 5.5
Scott Ward, Cypress Semiconductors, San Jose, CA
WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Stan Weitz, Electro-Tech Systems, Inc., Glenside, PA
WG 11, WG 15
Henry Wolf, Fraunhofer IZM, Munich, Germany
Technical Program Committee
Eugene Worley, Qualcomm, San Diego, CA
Technical Program Committee
Craig Zander, Restronics Company, Inc., Edina, MN
ESDA Board of Directors, Marketing & Communications Business Unit Manager, STDCOM |
