SIG Chair: Bart Keppens (Sofics)
Similar to previous years, the IEW workshop provides an opportunity for special interest groups (SIGs) to meet. These SIGs are teams focused on one compelling topic of mutual interest. Some of these groups have been successfully cooperating for several years on important ESD topics – with continued momentum stimulated at the IEW! Six SIGs are scheduled for IEW 2012 as outlined here. Attendees are also encouraged to form new SIGs as they see fit. If you would like to form a new SIG please contact Bart Keppens at bkeppens@sofics.com.
Special Interest Group A.1
ESD Data Analysis Tools
Coordinator: David Tremouilles, LAAS-CNRS
david.tremouilles@laas.fr
Frequently ESD engineers must analyze measurement results from different test methods. They extract the most relevant ESD parameters from a large set of test structures and use it to select the appropriate ESD clamp devices and full chip protection concepts. Currently, a lot of that analysis is being handled by general purpose spreadsheets. However, to cope with the growing amount of data a dedicated analysis tool is needed that has import functions for all kinds of ESD test equipment and industry standardized parameter extraction procedures. In the last year, an open source project has been started to develop such a tool for and by ESD engineers: http://code.google.com/p/esdanalysistools/.
ESD engineers involved in ESD analysis, data manipulation, and with an interest to support this tool creation are invited to join our SIG discussion. Programming skills are not required to join!
Special Interest Group A.2
Transient Latch-up (TLU)
Coordinator: Wolfgang Stadler, Intel Mobile Communications wolfgang.stadler@intel.com
Transients are becoming increasingly important for systems and there is no doubt that those transients can trigger latch-up or functional upsets. Therefore, meaningful tests for transient latch-up (TLU) robustness of products are inevitable. However, the former TLU standard practice ANSI/ESD SP5.4, which is the only standard covering TLU, is hardly used today and does not fulfill the current requirements on a TLU test. Therefore, ESDA Working Group 5.4 has decided to re-designate ANSI/ESD SP5.4 as a technical report (TR). Work on a further TR has started that may lead to a "new" TLU standard. A significant amount of examples on TLU "real-world" events is already collected in the TR. In this SIG we will discuss the latest activities in the standardization committees and continue to collect early inputs to those activities from industry experts to support and impact these standardization activities.
Everyone is invited to join this SIG and provide input on appropriate measurement techniques, pulse characteristics or field experiences with TLU.
Special Interest Group A.3
ESD parameters for ESD EDA flow
Coordinator: Harald Gossner, Intel Mobile Communications
harald.gossner@intel.com
Today, IC designers are collaborating with many IP vendors and several foundries. Therefore, for a comprehensive ESD concept and easy verification, information from the internal design team, IP vendors, and foundries must be combined. A special interest group of foundries, IP vendors, and IC suppliers was created to summarize the set of models and input parameters required from the different partners involved. If we can get to an agreement about the relevant parameters and set of data to be provided by foundries and IP vendors, then this would be a win/win/win for all. The ramp to volume production can be reduced and additional flexibility in design-in of 3rd party IP will be possible.
Peers from foundries, IP and EDA vendors, and IC suppliers are invited to join this SIG. Together we will review and align on the required parameters for a consistent ESD design and ESD verification flow.
Special Interest Group B.1
Non-ESD requirements that are relevant for ESD protection
Coordinator: Benjamin Van Camp, Sofics
bvancamp@sofics.com
For ESD and latch-up requirements it is easy to translate the specifications to expected behavior during stand-alone clamp analysis. However, for a number of functional requirements this is not so easy and additional analysis approaches must be added. For instance, DPI tests performed on automotive parts require ESD clamps that do not rely on RC effects. For the design of clamps that comply with ISO 7637-2 load dump pulses it is unclear if it is sufficient to increase the trigger voltage. For IEC 61000-4-4 and IEC 61000-4-5 that describe burst and long duration pulses long duration TLP and/or DC analysis is required.
The people in this SIG want to summarize the different requirements and look forward to hearing from experts in the field how functional aspects can be translated into requirements for ESD clamps.
Special Interest Group B.2
Electrical Overstress
Coordinator: Jean-Luc Lefebvre, Presto Engineering Europe
jean-luc.lefebvre@presto-eng.com
It is well-known that electrical overstress (EOS) is a major cause of IC failure in manufacturing and in the field. Events such as ESD, Latch-up, EMI and other phenomena are sub-groups of EOS events. Specifically ESD has received significant attention in both factory control and designed-in protection. However, the remaining forms of EOS have not been studied as systemically in spite of continued IC failure due to the non-ESD causes. ESDA has convened an ad-hoc working group (WG) of 11 members from 9 companies with the goal of publishing an advanced (high level) Technical Report (TR) by Sept 2012.
ESD engineers involved in EOS analysis and debugging are invited to join our SIG discussion and help drive the Technical Report.
Special Interest Group B.3
Charged Board Event
Coordinator: Reinhold Gaertner, Infineon Technologies
reinhold.gaertner@siemens-scg.com
CBE (Charged Board Event) is related to a system board getting charged and then discharged through a variety of means while creating a strong CDM like event on of the IC pins. The CBE working group is tasked with writing a technical report (TR) on this subject. It is not recommended to make CBE as a standard similar to HBM or CDM since it will not be practical or realistic in light of too many variables. However, the technical report is meant to provide a guideline to debug customer issues related to CBE for ESD and FA engineers.
Attendees interested in CBE are invited to join the SIG discussion and support the technical report.
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